DE69502642T2 - Ringlaser - Google Patents

Ringlaser

Info

Publication number
DE69502642T2
DE69502642T2 DE69502642T DE69502642T DE69502642T2 DE 69502642 T2 DE69502642 T2 DE 69502642T2 DE 69502642 T DE69502642 T DE 69502642T DE 69502642 T DE69502642 T DE 69502642T DE 69502642 T2 DE69502642 T2 DE 69502642T2
Authority
DE
Germany
Prior art keywords
ring laser
laser
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69502642T
Other languages
English (en)
Other versions
DE69502642D1 (de
Inventor
Hong Lin
David K Donald
Kok-Wai Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69502642D1 publication Critical patent/DE69502642D1/de
Publication of DE69502642T2 publication Critical patent/DE69502642T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1106—Mode locking
    • H01S3/1112—Passive mode locking
    • H01S3/1115—Passive mode locking using intracavity saturable absorbers
    • H01S3/1118—Semiconductor saturable absorbers, e.g. semiconductor saturable absorber mirrors [SESAMs]; Solid-state saturable absorbers, e.g. carbon nanotube [CNT] based
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • H01S3/06791—Fibre ring lasers
DE69502642T 1994-03-01 1995-02-17 Ringlaser Expired - Fee Related DE69502642T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/205,671 US5436925A (en) 1994-03-01 1994-03-01 Colliding pulse mode-locked fiber ring laser using a semiconductor saturable absorber

Publications (2)

Publication Number Publication Date
DE69502642D1 DE69502642D1 (de) 1998-07-02
DE69502642T2 true DE69502642T2 (de) 1998-09-17

Family

ID=22763164

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69502642T Expired - Fee Related DE69502642T2 (de) 1994-03-01 1995-02-17 Ringlaser

Country Status (4)

Country Link
US (1) US5436925A (de)
EP (1) EP0670617B1 (de)
JP (1) JPH07307511A (de)
DE (1) DE69502642T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014114733A1 (de) * 2014-10-10 2016-04-14 Trumpf Laser Gmbh Herstellungsverfahren eines sättigbaren halbleiter-absorberelements und sättigbares halbleiter-absorberelement

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5689519A (en) 1993-12-20 1997-11-18 Imra America, Inc. Environmentally stable passively modelocked fiber laser pulse source
IL109102A (en) * 1994-03-24 1998-06-15 Technion Res & Dev Foundation Method and device for narrowing line-width and single-action operation of lasers with non-linear wave mixing within the resonator
US5828682A (en) * 1996-12-13 1998-10-27 Massachusetts Institute Of Technology Rational-harmonic apparatus and technique
US6097741A (en) 1998-02-17 2000-08-01 Calmar Optcom, Inc. Passively mode-locked fiber lasers
US6072811A (en) * 1998-02-11 2000-06-06 Imra America Integrated passively modelocked fiber lasers and method for constructing the same
US6034975A (en) * 1998-03-09 2000-03-07 Imra America, Inc. High power, passively modelocked fiber laser, and method of construction
US6252892B1 (en) 1998-09-08 2001-06-26 Imra America, Inc. Resonant fabry-perot semiconductor saturable absorbers and two photon absorption power limiters
US6275512B1 (en) * 1998-11-25 2001-08-14 Imra America, Inc. Mode-locked multimode fiber laser pulse source
US7190705B2 (en) 2000-05-23 2007-03-13 Imra America. Inc. Pulsed laser sources
US7088756B2 (en) * 2003-07-25 2006-08-08 Imra America, Inc. Polarization maintaining dispersion controlled fiber laser source of ultrashort pulses
US20040161006A1 (en) * 2003-02-18 2004-08-19 Ying-Lan Chang Method and apparatus for improving wavelength stability for InGaAsN devices
US7804864B2 (en) * 2004-03-31 2010-09-28 Imra America, Inc. High power short pulse fiber laser
US7602825B1 (en) 2004-10-20 2009-10-13 Calmar Optcom, Inc. Tunable passively mode-locked lasers with phase-lock feedback for low timing jitters
FI121040B (fi) * 2005-05-10 2010-06-15 Reflekron Oy Moodilukittu kuitulaser
US7560758B2 (en) * 2006-06-29 2009-07-14 International Business Machines Corporation MOSFETs comprising source/drain recesses with slanted sidewall surfaces, and methods for fabricating the same
DE102007022561B4 (de) * 2007-05-14 2010-09-16 Meos Ag Aktiver Rotationssensor
US8036537B2 (en) * 2007-06-13 2011-10-11 International Business Machines Corporation Optical pulse amplication apparatus and method
DE102007057856B4 (de) 2007-11-29 2017-08-10 Toptica Photonics Ag Faserlaser mit ringförmigem Resonator
US7680372B2 (en) * 2008-06-27 2010-03-16 Honeywell International Inc. Micro-optics photonic bandgap fiber coupler
US20110064096A1 (en) * 2009-09-16 2011-03-17 University Of Central Florida Research Foundation, Inc. Mid-IR laser employing Tm fiber laser and optical parametric oscillator
JP5368360B2 (ja) * 2010-04-09 2013-12-18 浜松ホトニクス株式会社 パルスファイバレーザ装置
JP5675219B2 (ja) * 2010-08-27 2015-02-25 キヤノン株式会社 光パルス発生装置、テラヘルツ分光装置およびトモグラフィ装置
CN102074880B (zh) * 2010-12-20 2012-06-27 北京交通大学 微型谐振腔体结构的单模光纤激光器
CN102684794A (zh) * 2012-06-06 2012-09-19 苏州旭创科技有限公司 应用于高速并行长距离传输的新型波分复用解复用光组件
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
EP3169635B1 (de) 2014-07-14 2022-11-23 Corning Incorporated Verfahren und system zur herstellung von perforationen
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
EP3552753A3 (de) * 2014-07-14 2019-12-11 Corning Incorporated System und verfahren zur verarbeitung transparenter materialien mithilfe von in länge und durchmesser anpassbaren laserstrahlbrennlinien
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3708548A1 (de) 2015-01-12 2020-09-16 Corning Incorporated Laserschneiden von thermisch vorgespannten substraten mit einem multiphotonenabsorptionsverfahren
CN107922237B (zh) 2015-03-24 2022-04-01 康宁股份有限公司 显示器玻璃组合物的激光切割和加工
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
JP7082042B2 (ja) 2015-07-10 2022-06-07 コーニング インコーポレイテッド 可撓性基体シートに孔を連続形成する方法およびそれに関する製品
CN109311725B (zh) 2016-05-06 2022-04-26 康宁股份有限公司 从透明基材激光切割及移除轮廓形状
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
ES2649046A1 (es) * 2016-06-06 2018-01-09 Universidad De Alcalá Láser pulsado anclado en modos con absorbente saturable
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
EP3529214B1 (de) 2016-10-24 2020-12-23 Corning Incorporated Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
CN107248692B (zh) * 2017-05-19 2020-01-14 武汉理工大学 一种超窄线宽波长可调的复合腔光纤激光器
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504950A (en) * 1982-03-02 1985-03-12 California Institute Of Technology Tunable graded rod laser assembly
GB2236426B (en) * 1989-09-20 1994-01-26 Stc Plc Laser source
US5237577A (en) * 1991-11-06 1993-08-17 At&T Bell Laboratories Monolithically integrated fabry-perot saturable absorber
US5251230A (en) * 1992-05-08 1993-10-05 Honeywell, Inc. Resonant cavity dither with index of refraction modulator
US5278855A (en) * 1992-05-11 1994-01-11 At&T Bell Laboratories Broadband semiconductor saturable absorber
US5276701A (en) * 1992-09-18 1994-01-04 Fujitsu Limited Ring laser employing unidirectional attenuator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014114733A1 (de) * 2014-10-10 2016-04-14 Trumpf Laser Gmbh Herstellungsverfahren eines sättigbaren halbleiter-absorberelements und sättigbares halbleiter-absorberelement
DE102014114733B4 (de) * 2014-10-10 2016-11-24 Trumpf Laser Gmbh Herstellungsverfahren eines sättigbaren halbleiter-absorberelements und sättigbares halbleiter-absorberelement

Also Published As

Publication number Publication date
JPH07307511A (ja) 1995-11-21
US5436925A (en) 1995-07-25
DE69502642D1 (de) 1998-07-02
EP0670617B1 (de) 1998-05-27
EP0670617A1 (de) 1995-09-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8339 Ceased/non-payment of the annual fee