US5689519A
(en)
|
1993-12-20 |
1997-11-18 |
Imra America, Inc. |
Environmentally stable passively modelocked fiber laser pulse source
|
IL109102A
(en)
*
|
1994-03-24 |
1998-06-15 |
Technion Res & Dev Foundation |
Method and device for narrowing line-width and single-action operation of lasers with non-linear wave mixing within the resonator
|
US5828682A
(en)
*
|
1996-12-13 |
1998-10-27 |
Massachusetts Institute Of Technology |
Rational-harmonic apparatus and technique
|
US6097741A
(en)
*
|
1998-02-17 |
2000-08-01 |
Calmar Optcom, Inc. |
Passively mode-locked fiber lasers
|
US6072811A
(en)
*
|
1998-02-11 |
2000-06-06 |
Imra America |
Integrated passively modelocked fiber lasers and method for constructing the same
|
US6034975A
(en)
*
|
1998-03-09 |
2000-03-07 |
Imra America, Inc. |
High power, passively modelocked fiber laser, and method of construction
|
US6252892B1
(en)
*
|
1998-09-08 |
2001-06-26 |
Imra America, Inc. |
Resonant fabry-perot semiconductor saturable absorbers and two photon absorption power limiters
|
US6275512B1
(en)
*
|
1998-11-25 |
2001-08-14 |
Imra America, Inc. |
Mode-locked multimode fiber laser pulse source
|
US7190705B2
(en)
|
2000-05-23 |
2007-03-13 |
Imra America. Inc. |
Pulsed laser sources
|
US7088756B2
(en)
*
|
2003-07-25 |
2006-08-08 |
Imra America, Inc. |
Polarization maintaining dispersion controlled fiber laser source of ultrashort pulses
|
US20040161006A1
(en)
*
|
2003-02-18 |
2004-08-19 |
Ying-Lan Chang |
Method and apparatus for improving wavelength stability for InGaAsN devices
|
US7804864B2
(en)
|
2004-03-31 |
2010-09-28 |
Imra America, Inc. |
High power short pulse fiber laser
|
US7602825B1
(en)
|
2004-10-20 |
2009-10-13 |
Calmar Optcom, Inc. |
Tunable passively mode-locked lasers with phase-lock feedback for low timing jitters
|
FI121040B
(fi)
*
|
2005-05-10 |
2010-06-15 |
Reflekron Oy |
Moodilukittu kuitulaser
|
US7560758B2
(en)
*
|
2006-06-29 |
2009-07-14 |
International Business Machines Corporation |
MOSFETs comprising source/drain recesses with slanted sidewall surfaces, and methods for fabricating the same
|
DE102007022561B4
(de)
*
|
2007-05-14 |
2010-09-16 |
Meos Ag |
Aktiver Rotationssensor
|
US8036537B2
(en)
*
|
2007-06-13 |
2011-10-11 |
International Business Machines Corporation |
Optical pulse amplication apparatus and method
|
DE102007057856B4
(de)
|
2007-11-29 |
2017-08-10 |
Toptica Photonics Ag |
Faserlaser mit ringförmigem Resonator
|
US7680372B2
(en)
*
|
2008-06-27 |
2010-03-16 |
Honeywell International Inc. |
Micro-optics photonic bandgap fiber coupler
|
US20110064096A1
(en)
*
|
2009-09-16 |
2011-03-17 |
University Of Central Florida Research Foundation, Inc. |
Mid-IR laser employing Tm fiber laser and optical parametric oscillator
|
JP5368360B2
(ja)
*
|
2010-04-09 |
2013-12-18 |
浜松ホトニクス株式会社 |
パルスファイバレーザ装置
|
JP5675219B2
(ja)
*
|
2010-08-27 |
2015-02-25 |
キヤノン株式会社 |
光パルス発生装置、テラヘルツ分光装置およびトモグラフィ装置
|
CN102074880B
(zh)
*
|
2010-12-20 |
2012-06-27 |
北京交通大学 |
微型谐振腔体结构的单模光纤激光器
|
CN102684794A
(zh)
*
|
2012-06-06 |
2012-09-19 |
苏州旭创科技有限公司 |
应用于高速并行长距离传输的新型波分复用解复用光组件
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
Corning Incorporated |
Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
US9687936B2
(en)
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
EP3166895B1
(de)
|
2014-07-08 |
2021-11-24 |
Corning Incorporated |
Verfahren und vorrichtung zur laserbearbeitung von materialien
|
US10335902B2
(en)
|
2014-07-14 |
2019-07-02 |
Corning Incorporated |
Method and system for arresting crack propagation
|
EP3169635B1
(de)
|
2014-07-14 |
2022-11-23 |
Corning Incorporated |
Verfahren und system zur herstellung von perforationen
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
JP2017530867A
(ja)
*
|
2014-07-14 |
2017-10-19 |
コーニング インコーポレイテッド |
長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
|
CN107073641B
(zh)
|
2014-07-14 |
2020-11-10 |
康宁股份有限公司 |
接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
|
DE102014114733B4
(de)
*
|
2014-10-10 |
2016-11-24 |
Trumpf Laser Gmbh |
Herstellungsverfahren eines sättigbaren halbleiter-absorberelements und sättigbares halbleiter-absorberelement
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
WO2016115017A1
(en)
|
2015-01-12 |
2016-07-21 |
Corning Incorporated |
Laser cutting of thermally tempered substrates using the multi photon absorption method
|
WO2016154284A1
(en)
|
2015-03-24 |
2016-09-29 |
Corning Incorporated |
Laser cutting and processing of display glass compositions
|
WO2016160391A1
(en)
|
2015-03-27 |
2016-10-06 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
KR102499697B1
(ko)
|
2015-07-10 |
2023-02-14 |
코닝 인코포레이티드 |
유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
|
MY194570A
(en)
|
2016-05-06 |
2022-12-02 |
Corning Inc |
Laser cutting and removal of contoured shapes from transparent substrates
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
ES2649046A1
(es)
*
|
2016-06-06 |
2018-01-09 |
Universidad De Alcalá |
Láser pulsado anclado en modos con absorbente saturable
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
WO2018022476A1
(en)
|
2016-07-29 |
2018-02-01 |
Corning Incorporated |
Apparatuses and methods for laser processing
|
JP2019532908A
(ja)
|
2016-08-30 |
2019-11-14 |
コーニング インコーポレイテッド |
強度マッピング光学システムによる材料のレーザー切断
|
JP6923284B2
(ja)
|
2016-09-30 |
2021-08-18 |
コーニング インコーポレイテッド |
非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
|
JP7066701B2
(ja)
|
2016-10-24 |
2022-05-13 |
コーニング インコーポレイテッド |
シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
CN107248692B
(zh)
*
|
2017-05-19 |
2020-01-14 |
武汉理工大学 |
一种超窄线宽波长可调的复合腔光纤激光器
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|