DE69520699T2 - Elektrisches Bauelement und Verfahren zu seiner Herstellung - Google Patents

Elektrisches Bauelement und Verfahren zu seiner Herstellung

Info

Publication number
DE69520699T2
DE69520699T2 DE69520699T DE69520699T DE69520699T2 DE 69520699 T2 DE69520699 T2 DE 69520699T2 DE 69520699 T DE69520699 T DE 69520699T DE 69520699 T DE69520699 T DE 69520699T DE 69520699 T2 DE69520699 T2 DE 69520699T2
Authority
DE
Germany
Prior art keywords
production
electrical component
electrical
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69520699T
Other languages
English (en)
Other versions
DE69520699D1 (de
Inventor
Daizo Ando
Tadashi Nakamura
Shinji Umeda
Kunihiko Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69520699D1 publication Critical patent/DE69520699D1/de
Application granted granted Critical
Publication of DE69520699T2 publication Critical patent/DE69520699T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
DE69520699T 1994-01-31 1995-01-27 Elektrisches Bauelement und Verfahren zu seiner Herstellung Expired - Lifetime DE69520699T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6009202A JPH07221589A (ja) 1994-01-31 1994-01-31 電子部品とその製造方法

Publications (2)

Publication Number Publication Date
DE69520699D1 DE69520699D1 (de) 2001-05-23
DE69520699T2 true DE69520699T2 (de) 2001-08-02

Family

ID=11713905

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69520699T Expired - Lifetime DE69520699T2 (de) 1994-01-31 1995-01-27 Elektrisches Bauelement und Verfahren zu seiner Herstellung

Country Status (6)

Country Link
US (2) US5644478A (de)
EP (1) EP0665644B1 (de)
JP (1) JPH07221589A (de)
KR (1) KR0151764B1 (de)
CN (1) CN1053786C (de)
DE (1) DE69520699T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3336913B2 (ja) * 1997-06-30 2002-10-21 株式会社村田製作所 電子部品のパッケージ構造
US6960870B2 (en) 1997-07-29 2005-11-01 Seiko Epson Corporation Piezo-electric resonator and manufacturing method thereof
US6976295B2 (en) 1997-07-29 2005-12-20 Seiko Epson Corporation Method of manufacturing a piezoelectric device
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
JP2007516602A (ja) * 2003-09-26 2007-06-21 テッセラ，インコーポレイテッド 流動可能な伝導媒体を含むキャップ付きチップの製造構造および方法
JP2005167969A (ja) * 2003-11-14 2005-06-23 Fujitsu Media Device Kk 弾性波素子および弾性波素子の製造方法
JP2006217226A (ja) * 2005-02-03 2006-08-17 Matsushita Electric Ind Co Ltd 弾性表面波素子およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2146839B (en) * 1983-07-27 1987-04-01 Nihon Dempa Kogyo Co Piezoelectric resonator
US4639631A (en) * 1985-07-01 1987-01-27 Motorola, Inc. Electrostatically sealed piezoelectric device
EP0375776B1 (de) * 1986-12-19 1995-02-15 Fanuc Ltd. Motorantriebseinheit
JP2794965B2 (ja) * 1991-02-28 1998-09-10 三菱電機株式会社 制御装置のベースユニット
JPH06350376A (ja) * 1993-01-25 1994-12-22 Matsushita Electric Ind Co Ltd 気密封止された圧電デバイスおよび気密封止パッケージ
KR0171921B1 (ko) * 1993-09-13 1999-03-30 모리시타 요이찌 전자부품과 그 제조방법
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
JPH07221590A (ja) * 1994-01-31 1995-08-18 Matsushita Electric Ind Co Ltd 電子部品とその製造方法

Also Published As

Publication number Publication date
CN1108453A (zh) 1995-09-13
EP0665644A1 (de) 1995-08-02
US5850688A (en) 1998-12-22
CN1053786C (zh) 2000-06-21
KR0151764B1 (ko) 1998-12-15
US5644478A (en) 1997-07-01
EP0665644B1 (de) 2001-04-18
JPH07221589A (ja) 1995-08-18
DE69520699D1 (de) 2001-05-23
KR950024419A (ko) 1995-08-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)