DE69514987D1 - Keramische Grünfolie und Verfahren zur Herstellung keramisches Substrat - Google Patents

Keramische Grünfolie und Verfahren zur Herstellung keramisches Substrat

Info

Publication number
DE69514987D1
DE69514987D1 DE69514987T DE69514987T DE69514987D1 DE 69514987 D1 DE69514987 D1 DE 69514987D1 DE 69514987 T DE69514987 T DE 69514987T DE 69514987 T DE69514987 T DE 69514987T DE 69514987 D1 DE69514987 D1 DE 69514987D1
Authority
DE
Germany
Prior art keywords
green sheet
making
ceramic
ceramic substrate
ceramic green
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69514987T
Other languages
English (en)
Other versions
DE69514987T2 (de
Inventor
Yukihisa Takeuchi
Tsutomu Nanataki
Hisanori Yamamoto
Takahiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE69514987D1 publication Critical patent/DE69514987D1/de
Application granted granted Critical
Publication of DE69514987T2 publication Critical patent/DE69514987T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807Ceramic parts
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111Fine ceramics
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/486Fine ceramics
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15Ceramic or glass substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
DE69514987T 1994-11-09 1995-11-07 Keramische Grünfolie und Verfahren zur Herstellung keramisches Substrat Expired - Lifetime DE69514987T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27503894 1994-11-09

Publications (2)

Publication Number Publication Date
DE69514987D1 true DE69514987D1 (de) 2000-03-16
DE69514987T2 DE69514987T2 (de) 2000-06-29

Family

ID=17550006

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69514987T Expired - Lifetime DE69514987T2 (de) 1994-11-09 1995-11-07 Keramische Grünfolie und Verfahren zur Herstellung keramisches Substrat
DE69518548T Expired - Lifetime DE69518548T2 (de) 1994-11-09 1995-11-07 Verfahren zur Herstellung eines keramischen Substrates

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69518548T Expired - Lifetime DE69518548T2 (de) 1994-11-09 1995-11-07 Verfahren zur Herstellung eines keramischen Substrates

Country Status (3)

Country Link
US (2) US5733499A (de)
EP (2) EP0711738B1 (de)
DE (2) DE69514987T2 (de)

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US6395117B1 (en) * 1994-10-19 2002-05-28 Ngk Insulators Method for producing ceramic green sheet
US6051171A (en) * 1994-10-19 2000-04-18 Ngk Insulators, Ltd. Method for controlling firing shrinkage of ceramic green body
DE69514987T2 (de) * 1994-11-09 2000-06-29 Ngk Insulators, Ltd. Keramische Grünfolie und Verfahren zur Herstellung keramisches Substrat
EP1018496B1 (de) 1998-04-10 2008-09-24 Nippon Shokubai Co., Ltd. Keramikplatte und verfahren zum herstellen der keramikplatte
US7655586B1 (en) 2003-05-29 2010-02-02 Pentron Ceramics, Inc. Dental restorations using nanocrystalline materials and methods of manufacture
AU757500B2 (en) * 1999-06-24 2003-02-20 Nippon Shokubai Co., Ltd. Ceramic sheet and process for producing the same
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JP3767362B2 (ja) * 1999-12-13 2006-04-19 株式会社村田製作所 積層型セラミック電子部品の製造方法
DE10038987A1 (de) * 2000-08-10 2002-02-28 Bosch Gmbh Robert Keramische Schicht, keramischer Schichtkörper mit derartigen Schichten und Verfahren zu deren Herstellung
US6905993B2 (en) * 2001-10-18 2005-06-14 Nikkato Corporation Zirconia based sintered body excellent in durability and wear resistant parts using the same
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US7067208B2 (en) * 2002-02-20 2006-06-27 Ion America Corporation Load matched power generation system including a solid oxide fuel cell and a heat pump and an optional turbine
US7781045B2 (en) 2002-10-11 2010-08-24 Nippon Shokubai Co., Ltd. Electrolyte sheets for solid oxide fuel cell and method for manufacturing same
JP4468767B2 (ja) * 2004-08-26 2010-05-26 日本碍子株式会社 セラミックス成形体の割掛率制御方法
US8962749B2 (en) * 2008-02-19 2015-02-24 Ngk Insulators, Ltd. Ceramic green sheet and method for producing the same
DE102008046336A1 (de) * 2008-09-09 2010-03-11 Osram Gesellschaft mit beschränkter Haftung LTCC-Schichtstapel
US8652697B2 (en) 2009-02-25 2014-02-18 Bloom Energy Corporation Controlling a fuel cell system based on fuel cell impedance characteristic
US8663869B2 (en) * 2009-03-20 2014-03-04 Bloom Energy Corporation Crack free SOFC electrolyte
CN104716371A (zh) 2009-10-23 2015-06-17 株式会社日本触媒 一种氧化钪稳定氧化锆烧结粉末
WO2012114865A1 (ja) 2011-02-21 2012-08-30 日本碍子株式会社 粉末成形体の製造方法及び粉末成形体
US11561185B2 (en) 2011-03-30 2023-01-24 Nippon Shokubai Co., Ltd. Electrolyte sheet for solid oxide fuel cell, unit cell for solid oxide fuel cell and solid oxide fuel cell equipped with same, method for testing electrolyte sheet for solid oxide fuel cell, and method for manufacturing electrolyte sheet for solid oxide fuel cell
TWI552417B (zh) 2011-11-17 2016-10-01 博隆能源股份有限公司 對氧化鋯為主之電解質提供抗腐蝕性之多層塗層
TWI549348B (zh) 2011-11-18 2016-09-11 博隆能源股份有限公司 燃料電池之互連體及製造方法
US9452475B2 (en) 2012-03-01 2016-09-27 Bloom Energy Corporation Coatings for SOFC metallic interconnects
US9847520B1 (en) 2012-07-19 2017-12-19 Bloom Energy Corporation Thermal processing of interconnects
WO2014036058A1 (en) 2012-08-29 2014-03-06 Bloom Energy Corporation Interconnect for fuel cell stack
US9478812B1 (en) 2012-10-17 2016-10-25 Bloom Energy Corporation Interconnect for fuel cell stack
US9368810B2 (en) 2012-11-06 2016-06-14 Bloom Energy Corporation Interconnect and end plate design for fuel cell stack
US9583771B2 (en) 2013-05-16 2017-02-28 Bloom Energy Coporation Corrosion resistant barrier layer for a solid oxide fuel cell stack and method of making thereof
US9502721B2 (en) 2013-10-01 2016-11-22 Bloom Energy Corporation Pre-formed powder delivery to powder press machine
US9468736B2 (en) 2013-11-27 2016-10-18 Bloom Energy Corporation Fuel cell interconnect with reduced voltage degradation over time
US10079393B1 (en) 2014-01-09 2018-09-18 Bloom Energy Corporation Method of fabricating an interconnect for a fuel cell stack
EP3105810B1 (de) 2014-02-12 2022-08-17 Bloom Energy Corporation Struktur und verfahren für ein brennstoffzellensystem, in dem mehrere brennstoffzellen und leistungselektronische vorrichtungen ladungen parallel zuführen und die integrierte elektrochemische impedanzspektroskopie (eis) ermöglichen
US9461319B2 (en) 2014-02-21 2016-10-04 Bloom Energy Corporation Electrochemical impedance spectroscopy (EIS) analyzer and method of using thereof
WO2015130644A1 (en) 2014-02-25 2015-09-03 Bloom Energy Corporation Composition and processing of metallic interconnects for sofc stacks
US9923211B2 (en) 2014-04-24 2018-03-20 Bloom Energy Corporation Fuel cell interconnect with reduced voltage degradation over time
WO2016018106A1 (ko) * 2014-07-30 2016-02-04 주식회사 엘지화학 치밀도가 향상된 무기 전해질막의 제조방법, 이를 위한 무기 전해질막 제조용 조성물 및 이를 통해 제조된 무기 전해질막
US10658691B2 (en) 2014-07-30 2020-05-19 Lg Chem, Ltd. Method for manufacturing inorganic electrolyte membrane having improved compactness, composition for manufacturing inorganic electrolyte membrane, and inorganic electrolyte membrane manufactured using same
US10573910B2 (en) 2015-09-14 2020-02-25 Bloom Energy Corporation Electrochemical impedance spectroscopy (“EIS”) analyzer and method of using thereof
US10763533B1 (en) 2017-03-30 2020-09-01 Bloom Energy Corporation Solid oxide fuel cell interconnect having a magnesium containing corrosion barrier layer and method of making thereof
US20190006254A1 (en) * 2017-06-30 2019-01-03 Kyocera International, Inc. Microelectronic package construction enabled through ceramic insulator strengthening and design
JP6800546B2 (ja) * 2018-04-23 2020-12-16 森村Sofcテクノロジー株式会社 複合体、および、電気化学反応セルスタック

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DE69514987T2 (de) * 1994-11-09 2000-06-29 Ngk Insulators, Ltd. Keramische Grünfolie und Verfahren zur Herstellung keramisches Substrat

Also Published As

Publication number Publication date
EP0857702A1 (de) 1998-08-12
DE69514987T2 (de) 2000-06-29
DE69518548T2 (de) 2001-04-19
EP0711738A2 (de) 1996-05-15
US5733499A (en) 1998-03-31
EP0711738B1 (de) 2000-02-09
DE69518548D1 (de) 2000-09-28
US5955392A (en) 1999-09-21
EP0711738A3 (de) 1996-08-07
EP0857702B1 (de) 2000-08-23

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