DE69510156T2 - Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifische Position - Google Patents

Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifische Position

Info

Publication number
DE69510156T2
DE69510156T2 DE69510156T DE69510156T DE69510156T2 DE 69510156 T2 DE69510156 T2 DE 69510156T2 DE 69510156 T DE69510156 T DE 69510156T DE 69510156 T DE69510156 T DE 69510156T DE 69510156 T2 DE69510156 T2 DE 69510156T2
Authority
DE
Germany
Prior art keywords
assembling
specific position
specific
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69510156T
Other languages
English (en)
Other versions
DE69510156D1 (de
Inventor
Kazuhisa Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of DE69510156D1 publication Critical patent/DE69510156D1/de
Application granted granted Critical
Publication of DE69510156T2 publication Critical patent/DE69510156T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
DE69510156T 1994-11-11 1995-11-13 Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifische Position Expired - Fee Related DE69510156T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6278137A JPH08139499A (ja) 1994-11-11 1994-11-11 円筒状部品の認識方法

Publications (2)

Publication Number Publication Date
DE69510156D1 DE69510156D1 (de) 1999-07-15
DE69510156T2 true DE69510156T2 (de) 1999-10-14

Family

ID=17593112

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69510156T Expired - Fee Related DE69510156T2 (de) 1994-11-11 1995-11-13 Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifische Position

Country Status (4)

Country Link
US (1) US5745241A (de)
EP (1) EP0712269B1 (de)
JP (1) JPH08139499A (de)
DE (1) DE69510156T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6400459B1 (en) 1995-02-24 2002-06-04 Cyberoptics Corp. Methods and apparatus for using optical sensors in component replacement heads
US6024526A (en) * 1995-10-20 2000-02-15 Aesop, Inc. Integrated prober, handler and tester for semiconductor components
US6298547B1 (en) * 1997-09-25 2001-10-09 Matsushita Electric Industrial Co., Ltd. Apparatus for holding component, apparatus for mounting component, and method for mounting component
US6895662B2 (en) * 1997-09-25 2005-05-24 Matsushita Electric Industrial Co., Ltd. Apparatus for holding and mounting a component
JP3929583B2 (ja) * 1998-01-30 2007-06-13 ヤマハ発動機株式会社 部品装着方法及び同装置
JP4126762B2 (ja) * 1998-07-30 2008-07-30 松下電器産業株式会社 電子部品の実装方法
KR100311749B1 (ko) * 1999-05-27 2001-10-18 정문술 표면실장장치의 모듈 헤드 원점조정장치 및 방법
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
JP2004103923A (ja) * 2002-09-11 2004-04-02 Tdk Corp 電子部品の実装装置および実装方法
CN100488348C (zh) * 2003-07-03 2009-05-13 阿森姆布里昂股份有限公司 一种元件定位装置
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
DE112006002473T5 (de) * 2005-09-14 2008-08-14 Cyberoptics Corp., Golden Valley Bestückungsmaschine mit verbesserter Bauteil-Aufnahmebild-Identifizierungsverarbeitung
WO2007053557A1 (en) * 2005-10-31 2007-05-10 Cyberoptics Corporation Electronics assembly machine with embedded solder paste inspection
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
WO2008115532A1 (en) 2007-03-20 2008-09-25 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
US8068664B2 (en) * 2007-06-05 2011-11-29 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
US8994494B2 (en) * 2008-10-10 2015-03-31 Polaris Industries Inc. Vehicle security system
NZ603326A (en) 2010-06-30 2014-08-29 Weyerhaeuser Nr Co Pick-up and delivery system and associated methods
US8793931B2 (en) * 2010-06-30 2014-08-05 Weyerhaeuser Nr Company Pick-up and delivery system and associated methods
JP6714729B2 (ja) * 2016-12-07 2020-06-24 ヤマハ発動機株式会社 表面実装機、部品認識装置、部品認識方法
JP7339028B2 (ja) * 2019-06-18 2023-09-05 Juki株式会社 ノズル格納状態検出装置
CN114751151B (zh) * 2021-01-12 2024-03-26 贵州中烟工业有限责任公司 一种检测装置安装区域的计算方法及存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6354000A (ja) * 1986-08-22 1988-03-08 三洋電機株式会社 電子部品の位置検出装置
DE69300853T3 (de) * 1992-07-01 1999-05-12 Yamaha Motor Co Ltd Verfahren zum Montieren von Bauteilen und Vorrichtung dafür.
JP2528418B2 (ja) 1992-07-01 1996-08-28 ヤマハ発動機株式会社 部品装着方法及び装置
JP2816787B2 (ja) * 1992-11-09 1998-10-27 ヤマハ発動機株式会社 実装機の吸着ノズル制御装置
JPH06244592A (ja) * 1993-02-17 1994-09-02 Matsushita Electric Ind Co Ltd チップ部品装着機
JPH077297A (ja) * 1993-06-17 1995-01-10 Nec Corp フラットパッケージicの搭載装置

Also Published As

Publication number Publication date
EP0712269A1 (de) 1996-05-15
JPH08139499A (ja) 1996-05-31
EP0712269B1 (de) 1999-06-09
US5745241A (en) 1998-04-28
DE69510156D1 (de) 1999-07-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee