DE69503178D1 - Laserbearbeitungsapparat und Verfahren zu seiner Steuerung - Google Patents

Laserbearbeitungsapparat und Verfahren zu seiner Steuerung

Info

Publication number
DE69503178D1
DE69503178D1 DE69503178T DE69503178T DE69503178D1 DE 69503178 D1 DE69503178 D1 DE 69503178D1 DE 69503178 T DE69503178 T DE 69503178T DE 69503178 T DE69503178 T DE 69503178T DE 69503178 D1 DE69503178 D1 DE 69503178D1
Authority
DE
Germany
Prior art keywords
control
processing apparatus
laser processing
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69503178T
Other languages
English (en)
Other versions
DE69503178T2 (de
Inventor
Teiji Takahashi
Yoshihito Imai
Atsushi Morita
Masato Matsubara
Osamu Nagano
Tsukasa Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69503178D1 publication Critical patent/DE69503178D1/de
Publication of DE69503178T2 publication Critical patent/DE69503178T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/131—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/134—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/104—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
DE69503178T 1994-04-27 1995-04-27 Laserbearbeitungsapparat und Verfahren zu seiner Steuerung Expired - Lifetime DE69503178T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP8991994 1994-04-27
JP11455894 1994-04-30
JP25362494 1994-10-19
JP09213795A JP3315556B2 (ja) 1994-04-27 1995-04-18 レーザ加工装置

Publications (2)

Publication Number Publication Date
DE69503178D1 true DE69503178D1 (de) 1998-08-06
DE69503178T2 DE69503178T2 (de) 1998-12-10

Family

ID=27467702

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69503178T Expired - Lifetime DE69503178T2 (de) 1994-04-27 1995-04-27 Laserbearbeitungsapparat und Verfahren zu seiner Steuerung

Country Status (6)

Country Link
US (2) US5841096A (de)
EP (1) EP0680121B1 (de)
JP (1) JP3315556B2 (de)
KR (1) KR0169551B1 (de)
CN (1) CN1096329C (de)
DE (1) DE69503178T2 (de)

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EP1437806B1 (de) * 2001-10-16 2014-11-19 Kataoka Corporation Pulsierender festkörperlaser und laserbearbeitungsvorrichtung
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JP2003320466A (ja) * 2002-05-07 2003-11-11 Disco Abrasive Syst Ltd レーザビームを使用した加工機
JP3660328B2 (ja) * 2002-06-21 2005-06-15 ファナック株式会社 レーザ加工機
US6804574B2 (en) * 2002-07-25 2004-10-12 Matsushita Electric Industrial Co., Ltd. Method of using a computer with a laser drilling system
US6829517B2 (en) * 2002-07-25 2004-12-07 Matsushita Electronic Industrial Co., Ltd. Computer system for use with laser drilling system
JP3795854B2 (ja) * 2002-11-20 2006-07-12 ファナック株式会社 レーザ加工装置
JP4231349B2 (ja) * 2003-07-02 2009-02-25 株式会社ディスコ レーザー加工方法およびレーザー加工装置
KR100544200B1 (ko) * 2003-11-20 2006-01-23 삼성전자주식회사 광전력 보상을 통한 레이저 다이오드의 출력 제어 장치 및방법
KR100597908B1 (ko) * 2005-01-05 2006-07-06 고등기술연구원연구조합 용접끝점의 부분함몰 방지를 위한 레이저 용접장치 및이를 이용한 용접방법
US7244906B2 (en) * 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
DE102005050205A1 (de) 2005-10-20 2007-04-26 Mtu Aero Engines Gmbh Verfahren und Vorrichtung zum Kompensieren von Lage-und Formabweichungen
DE102005050209A1 (de) * 2005-10-20 2007-04-26 Ott, Reinhold, Waterloo Vorrichtung zur Einspeisung eines Videosignals in eine Anzeigevorrichtung und Betriebsverfahren hierfür
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DE102006022304A1 (de) * 2006-05-11 2007-11-22 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur dezentralen Steuerung einer Bearbeitungsmaschine, insbesondere einer Laserbearbeitungsmaschine
DE102007027987B3 (de) * 2007-06-14 2008-10-30 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung zur Aufnahme von plattenförmigen Materialien für zumindest einen Trennvorgang
US7830942B2 (en) * 2007-09-11 2010-11-09 Cymer, Inc. Ultraviolet laser light source pulse energy control system
US8391329B2 (en) 2009-01-26 2013-03-05 Coherent, Inc. Gas laser discharge pre-ionization using a simmer-discharge
WO2010093857A1 (en) * 2009-02-13 2010-08-19 Videojet Technologies Inc. Laser parameter adjustment
JP5303305B2 (ja) * 2009-02-16 2013-10-02 東芝Ｉｔコントロールシステム株式会社 レーザ制御装置
US8369373B2 (en) * 2009-10-13 2013-02-05 Coherent, Inc. Pre-ionization method for CO2 gas-discharge laser
JP5091287B2 (ja) 2010-08-06 2012-12-05 ファナック株式会社 加工点にエネルギー又は物質を供給する加工機における加工情報取得装置
WO2012091910A2 (en) * 2010-12-30 2012-07-05 Applied Materials, Inc. Protection device for solid state laser
JP5068863B2 (ja) * 2011-02-17 2012-11-07 ファナック株式会社 精確にレーザ出力を補正できる高出力レーザ装置
JP2015023202A (ja) * 2013-07-22 2015-02-02 パナソニック株式会社 ガスレーザ発振装置
US9148918B2 (en) 2013-12-04 2015-09-29 Infineon Technologies Ag Feedforward circuit for fast analog dimming in LED drivers
CN104836099A (zh) * 2015-05-19 2015-08-12 大族激光科技产业集团股份有限公司 光纤激光器系统及其监控装置
CN106881525B (zh) * 2015-12-15 2019-06-18 新代科技股份有限公司 激光加工控制系统及其控制方法
JP6342949B2 (ja) * 2016-05-17 2018-06-13 ファナック株式会社 反射光を抑制しながらレーザ加工を行うレーザ加工装置及びレーザ加工方法
DE112017005856B4 (de) * 2017-02-14 2023-03-16 Mitsubishi Electric Corporation Laserdiode-Treiberstromquelle und Laserbearbeitungseinrichtung
JP6599912B2 (ja) 2017-02-15 2019-10-30 ファナック株式会社 レーザ加工装置、レーザ発振器の診断方法、及びレーザ発振器の診断用プログラム
CN107745589B (zh) * 2017-09-28 2019-06-14 大族激光科技产业集团股份有限公司 一种激光打标机及其打标方法
JP6619410B2 (ja) * 2017-12-05 2019-12-11 ファナック株式会社 レーザ加工装置
JP7132718B2 (ja) 2018-01-17 2022-09-07 住友重機械工業株式会社 電源装置、レーザ装置
CN108803680A (zh) * 2018-07-25 2018-11-13 方焕辉 一种mems传感器的控制装置及方法
CN109542449A (zh) * 2018-10-29 2019-03-29 大族激光科技产业集团股份有限公司 一种非线性激光功率控制nc编程方法及激光功率控制系统
CN112782972B (zh) * 2019-11-07 2022-12-02 大族激光科技产业集团股份有限公司 激光加热温度控制方法
JPWO2021140969A1 (de) * 2020-01-09 2021-07-15
CN111319090B (zh) * 2020-03-16 2021-07-06 信泰电子（西安）有限公司 一种切角自动化作业方法及装置
KR20210138258A (ko) 2020-05-12 2021-11-19 서강대학교산학협력단 링거 주입 장치

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Also Published As

Publication number Publication date
KR950028857A (ko) 1995-11-22
CN1096329C (zh) 2002-12-18
US5841096A (en) 1998-11-24
EP0680121A1 (de) 1995-11-02
JPH08168891A (ja) 1996-07-02
CN1115703A (zh) 1996-01-31
DE69503178T2 (de) 1998-12-10
JP3315556B2 (ja) 2002-08-19
EP0680121B1 (de) 1998-07-01
KR0169551B1 (ko) 1999-01-15
US5961857A (en) 1999-10-05

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