DE69503020D1 - Plattierungsverfahren mittels stromloser Goldplattierungslösung und Vorrichtung dafür - Google Patents

Plattierungsverfahren mittels stromloser Goldplattierungslösung und Vorrichtung dafür

Info

Publication number
DE69503020D1
DE69503020D1 DE69503020T DE69503020T DE69503020D1 DE 69503020 D1 DE69503020 D1 DE 69503020D1 DE 69503020 T DE69503020 T DE 69503020T DE 69503020 T DE69503020 T DE 69503020T DE 69503020 D1 DE69503020 D1 DE 69503020D1
Authority
DE
Germany
Prior art keywords
apparatus therefor
electroless gold
plating solution
plating method
gold plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69503020T
Other languages
English (en)
Other versions
DE69503020T2 (de
Inventor
Takayuki Sone
Hiroshi Wachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Publication of DE69503020D1 publication Critical patent/DE69503020D1/de
Application granted granted Critical
Publication of DE69503020T2 publication Critical patent/DE69503020T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/168—Control of temperature, e.g. temperature of bath, substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE69503020T 1994-10-26 1995-10-25 Plattierungsverfahren mittels stromloser Goldplattierungslösung und Vorrichtung dafür Expired - Fee Related DE69503020T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26289394 1994-10-26
JP30738194A JP3441539B2 (ja) 1994-10-26 1994-12-12 無電解金めっき液によるめっき方法及びその装置

Publications (2)

Publication Number Publication Date
DE69503020D1 true DE69503020D1 (de) 1998-07-23
DE69503020T2 DE69503020T2 (de) 1998-11-19

Family

ID=26545759

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69503020T Expired - Fee Related DE69503020T2 (de) 1994-10-26 1995-10-25 Plattierungsverfahren mittels stromloser Goldplattierungslösung und Vorrichtung dafür

Country Status (5)

Country Link
US (1) US5691003A (de)
EP (1) EP0709490B1 (de)
JP (1) JP3441539B2 (de)
DE (1) DE69503020T2 (de)
ES (1) ES2117836T3 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUP0004595A3 (en) 1997-07-31 2001-12-28 Procter & Gamble Acyclic metalloprotease inhibitors
US8257781B1 (en) * 2002-06-28 2012-09-04 Novellus Systems, Inc. Electroless plating-liquid system
DE10235032B3 (de) * 2002-07-31 2004-04-08 Hydrometer Gmbh Verfahren zum Betrieb eines Ultraschall-Durchflußmessers und entsprechender Ultraschall-Durchflußmesser
JP4923773B2 (ja) * 2006-06-19 2012-04-25 セイコーエプソン株式会社 めっき装置及びめっき方法
JP5813649B2 (ja) * 2010-10-14 2015-11-17 東京エレクトロン株式会社 液処理装置、液処理方法
CN113873774B (zh) * 2021-09-15 2023-08-29 江苏贺鸿电子有限公司 一种印刷电路板制作的水平沉铜装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4152467A (en) * 1978-03-10 1979-05-01 International Business Machines Corporation Electroless copper plating process with dissolved oxygen maintained in bath
US4388346A (en) * 1981-11-25 1983-06-14 Beggs James M Administrator Of Electrodes for solid state devices
US4616596A (en) * 1985-10-21 1986-10-14 Hughes Aircraft Company Electroless plating apparatus
JPS63312983A (ja) * 1987-06-16 1988-12-21 Hitachi Ltd 無電解銅めっき方法
JP2866676B2 (ja) * 1989-09-18 1999-03-08 株式会社日立製作所 無電解金めっき液及びそれを用いた金めっき方法
JPH0539579A (ja) * 1991-08-02 1993-02-19 Mitsubishi Electric Corp 無電解めつき装置

Also Published As

Publication number Publication date
EP0709490A1 (de) 1996-05-01
US5691003A (en) 1997-11-25
JPH08176839A (ja) 1996-07-09
JP3441539B2 (ja) 2003-09-02
EP0709490B1 (de) 1998-06-17
ES2117836T3 (es) 1998-08-16
DE69503020T2 (de) 1998-11-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee