ES2117836T3 - Metodo de chapado por medio de una solucion anelectrolitica para chapado con oro y un sistema para el mismo. - Google Patents

Metodo de chapado por medio de una solucion anelectrolitica para chapado con oro y un sistema para el mismo.

Info

Publication number
ES2117836T3
ES2117836T3 ES95307577T ES95307577T ES2117836T3 ES 2117836 T3 ES2117836 T3 ES 2117836T3 ES 95307577 T ES95307577 T ES 95307577T ES 95307577 T ES95307577 T ES 95307577T ES 2117836 T3 ES2117836 T3 ES 2117836T3
Authority
ES
Spain
Prior art keywords
deposit
solution
plating
anelectrolytic
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95307577T
Other languages
English (en)
Inventor
Takayuki Sone
Hiroshi Wachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Application granted granted Critical
Publication of ES2117836T3 publication Critical patent/ES2117836T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/168—Control of temperature, e.g. temperature of bath, substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

UN METODO DE DEPOSICION MEDIANTE UNA SOLUCION DE ORO NO ELECTROLITICA BAJO UN SUMINISTRO DE AIRE A MODO DE BURBUJAS DE AIRE DESDE UNOS CUERPOS DISPERSORES DE AIRE (2,15) COLOCADOS SOBRE EL FONDO DE UN DEPOSITO DE DEPOSICION (1), CON LO QUE SE PUEDE CONSEGUIR UNA DEPOSICION MAS UNIFORME Y SE PUEDE AUMENTAR LA DURACION DE LA SOLUCION DE DEPOSICION. LAS BURBUJAS DE AIRE SON SUMINISTRADAS DE MANERA UNIFORME POR TODA LA REGION DE DEPOSITO DE DEPOSICION CORRESPONDIENTE A LA REGION DE DEPOSICION DE UNA SUSTANCIA A METALIZAR Y COLOCADA EN EL DEPOSITO DE DEPOSICION, Y EL SUMINISTRO DE AIRE SE AJUSTA DEPENDIENDO DE LA TEMPERATURA DEL LIQUIDO DE LA SOLUCION DE DEPOSICION.
ES95307577T 1994-10-26 1995-10-25 Metodo de chapado por medio de una solucion anelectrolitica para chapado con oro y un sistema para el mismo. Expired - Lifetime ES2117836T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26289394 1994-10-26
JP30738194A JP3441539B2 (ja) 1994-10-26 1994-12-12 無電解金めっき液によるめっき方法及びその装置

Publications (1)

Publication Number Publication Date
ES2117836T3 true ES2117836T3 (es) 1998-08-16

Family

ID=26545759

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95307577T Expired - Lifetime ES2117836T3 (es) 1994-10-26 1995-10-25 Metodo de chapado por medio de una solucion anelectrolitica para chapado con oro y un sistema para el mismo.

Country Status (5)

Country Link
US (1) US5691003A (es)
EP (1) EP0709490B1 (es)
JP (1) JP3441539B2 (es)
DE (1) DE69503020T2 (es)
ES (1) ES2117836T3 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1265647A (zh) 1997-07-31 2000-09-06 普罗克特和甘保尔公司 无环金属蛋白酶抑制剂
US8257781B1 (en) * 2002-06-28 2012-09-04 Novellus Systems, Inc. Electroless plating-liquid system
DE10235032B3 (de) * 2002-07-31 2004-04-08 Hydrometer Gmbh Verfahren zum Betrieb eines Ultraschall-Durchflußmessers und entsprechender Ultraschall-Durchflußmesser
JP4923773B2 (ja) * 2006-06-19 2012-04-25 セイコーエプソン株式会社 めっき装置及びめっき方法
WO2012049913A1 (ja) * 2010-10-14 2012-04-19 東京エレクトロン株式会社 液処理装置、液処理方法
CN113873774B (zh) * 2021-09-15 2023-08-29 江苏贺鸿电子有限公司 一种印刷电路板制作的水平沉铜装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4152467A (en) * 1978-03-10 1979-05-01 International Business Machines Corporation Electroless copper plating process with dissolved oxygen maintained in bath
US4388346A (en) * 1981-11-25 1983-06-14 Beggs James M Administrator Of Electrodes for solid state devices
US4616596A (en) * 1985-10-21 1986-10-14 Hughes Aircraft Company Electroless plating apparatus
JPS63312983A (ja) * 1987-06-16 1988-12-21 Hitachi Ltd 無電解銅めっき方法
JP2866676B2 (ja) * 1989-09-18 1999-03-08 株式会社日立製作所 無電解金めっき液及びそれを用いた金めっき方法
JPH0539579A (ja) * 1991-08-02 1993-02-19 Mitsubishi Electric Corp 無電解めつき装置

Also Published As

Publication number Publication date
DE69503020D1 (de) 1998-07-23
EP0709490B1 (en) 1998-06-17
JP3441539B2 (ja) 2003-09-02
EP0709490A1 (en) 1996-05-01
US5691003A (en) 1997-11-25
DE69503020T2 (de) 1998-11-19
JPH08176839A (ja) 1996-07-09

Similar Documents

Publication Publication Date Title
DE69111077D1 (de) Chinazolinderivate um die antitumorwirkung zu verbessern.
NO20025921L (no) Fordeler modul for bruk i telekommunikasjons- og datasystemteknikk
ES2145621T3 (es) Dispositivo para retirar las virutas proyectadas por la cabeza de mecanizacion de una maquina herramienta.
DE69015909T2 (de) Vorrichtung mit eingekapselten Flüssigkristallen mit niedriger ausseraxialer Trübung betrieben mit sinusförmiger Stromversorgung.
TR200202804T2 (tr) Bitki tohumlarından yapılan fiberler ve kullanımları
ES2143500T3 (es) Metodo y aparato para comunicar señales.
DE59106095D1 (de) Vorrichtung für die rekombination von wasserstoff und sauerstoff sowie verwendung der vorrichtung.
AR024274A1 (es) Equipo de procesamiento y metodo para proveer un fluido biologico substancialmente libre de agentes patgenos.
GB1077867A (en) Improvements in or relating to electrical interconnections
ES2117836T3 (es) Metodo de chapado por medio de una solucion anelectrolitica para chapado con oro y un sistema para el mismo.
ATE319405T1 (de) Verfahren und vorrichtung zum herstellen von löslichen tabletten
ATE319208T1 (de) Montagesystem insbesondere für einen schaltschrank
NO902210D0 (no) Pletteringssystem.
ES2108974T3 (es) Instalacion de hilado para hilos termoplasticos.
ES2063004T3 (es) Antibioticos ab-006 y procedimiento para su produccion.
DE69007374D1 (de) Injektionssystem für die Behandlung von Zellen.
DE69506344D1 (de) Goldlösung für stromloses Plattieren
ATA145796A (de) Aufteileinrichtung
ES2059104T3 (es) Bastidor de distribucion en una red de telecomunicacion.
KR970702390A (ko) 팔라듐 콜로이드 용액 및 이의 용도(palladium colloid solution and its utilisation)
ES2168400T3 (es) Sistema de comunicacion constituido de forma modular.
DE59009340D1 (de) Schaltungsanordnung zur Herstellung von Konferenzverbindungen.
ES265344U (es) "maletin para aparato de radio y similares".
DE69501528T2 (de) Nichtelektrolytische Goldplattierlösung
IT1256611B (it) Disposotivo per macchine lavabiancheria per l'attivazione delle sostanze di lavaggio (sapone, ipoclorito, fosfati) mediante l'applicazione di campi elettrici ad alta frequenza.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 709490

Country of ref document: ES