NO902210D0 - Pletteringssystem. - Google Patents

Pletteringssystem.

Info

Publication number
NO902210D0
NO902210D0 NO902210A NO902210A NO902210D0 NO 902210 D0 NO902210 D0 NO 902210D0 NO 902210 A NO902210 A NO 902210A NO 902210 A NO902210 A NO 902210A NO 902210 D0 NO902210 D0 NO 902210D0
Authority
NO
Norway
Prior art keywords
pair
plating
anode
cathode
electrolyte
Prior art date
Application number
NO902210A
Other languages
English (en)
Other versions
NO902210L (no
Inventor
Ah Tee Sim
Original Assignee
Sun Ind Coatings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Ind Coatings filed Critical Sun Ind Coatings
Publication of NO902210D0 publication Critical patent/NO902210D0/no
Publication of NO902210L publication Critical patent/NO902210L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Glass Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemically Coating (AREA)
  • Electric Clocks (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
NO90902210A 1989-05-19 1990-05-18 Pletteringssystem. NO902210L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898911566A GB8911566D0 (en) 1989-05-19 1989-05-19 Plating system

Publications (2)

Publication Number Publication Date
NO902210D0 true NO902210D0 (no) 1990-05-18
NO902210L NO902210L (no) 1990-11-20

Family

ID=10657040

Family Applications (1)

Application Number Title Priority Date Filing Date
NO90902210A NO902210L (no) 1989-05-19 1990-05-18 Pletteringssystem.

Country Status (11)

Country Link
US (2) US5087333A (no)
EP (2) EP0398735B1 (no)
JP (1) JPH0336299A (no)
KR (1) KR960002124B1 (no)
CN (1) CN1047540A (no)
AT (1) ATE141655T1 (no)
BR (1) BR9002345A (no)
CA (1) CA2017011A1 (no)
DE (2) DE637640T1 (no)
GB (1) GB8911566D0 (no)
NO (1) NO902210L (no)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9325297D0 (en) 1993-12-10 1994-02-16 Process Automation Internation Improvements in or relating to clamps and the use thereof
GB2292952A (en) * 1994-09-12 1996-03-13 Yee Kiong Khong Holder for electroplating and chemically treating contact elements of plastics moulded or ceramic encapsulated electronic components
US5858196A (en) * 1996-01-31 1999-01-12 Kawasaki Steel Corporation Method of controlling component concentration of plating solution in continuous electroplating
EP0897023A1 (fr) * 1997-08-14 1999-02-17 Suntec Trading Ag Dispositif de transport de substrats à revêtir par électrodéposition
EP0999295A3 (de) * 1998-10-23 2006-05-17 SMS Demag AG Anordnung zur elektrogalvanischen Metallbeschichtung von Bändern
TW483950B (en) * 1998-12-31 2002-04-21 Semitool Inc Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
FR2801062B1 (fr) 1999-11-12 2001-12-28 Lorraine Laminage Installation et procede de dissolution electrolytique par oxydation d'un metal
ATE385863T1 (de) * 2000-08-18 2008-03-15 Ti Group Automotive Sys Ltd Verfahren zur plattierung eines metallbandes zur herstellung eines mehrwandigen rohrs
US6413390B1 (en) * 2000-10-02 2002-07-02 Advanced Micro Devices, Inc. Plating system with remote secondary anode for semiconductor manufacturing
CN101220498B (zh) * 2007-09-26 2010-05-19 江门市自由人科技有限公司 一种多槽式卷料连续电镀生产线机架
CN103132127B (zh) * 2011-12-05 2015-05-13 华通电脑股份有限公司 电镀挂架夹点电流监控装置及其方法
CN103422150A (zh) * 2012-05-22 2013-12-04 泰州宏瑞新材料有限责任公司 用于电镀的重金属离子浓度调节槽及电镀装置
CN106929903A (zh) * 2017-04-24 2017-07-07 惠安县金旺达工业设计有限公司 一种镀液充分利用的滚镀清洗生产线
CN108359800B (zh) * 2018-03-14 2019-02-05 广东溢丰环保科技有限公司 一种电镀污染减排装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2190440A (en) * 1937-06-12 1940-02-13 Trumbull Metal Products Compan Electric etching or deposition frame
NL71231C (no) * 1948-04-22
US3039951A (en) * 1958-01-02 1962-06-19 Hughes Aircraft Co Electroplating fixture
US3290238A (en) * 1962-03-16 1966-12-06 Reynolds Metals Co Anodizing rack construction
US3909368A (en) * 1974-07-12 1975-09-30 Louis W Raymond Electroplating method and apparatus
US4088559A (en) * 1975-01-17 1978-05-09 Sulzer Brothers Ltd. Holding device for small parts to be electroplated
DE3026105A1 (de) * 1980-07-10 1982-01-28 Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen Aufnahmevorrichtung fuer zu eloxierende aluminium-werkstuecke
JPS6021398A (ja) * 1983-07-12 1985-02-02 Rihei Tomono 合金めつき方法及び合金めつき装置
CH659259A5 (fr) * 1983-12-01 1987-01-15 Em Microelectronic Marin Sa Dispositif pour le depot electrolytique d'un materiau conducteur sur des plaques de circuits integres.
JPS60251294A (ja) * 1984-05-28 1985-12-11 Toppan Printing Co Ltd ニッケルめっき装置
CH659485A5 (de) * 1984-05-30 1987-01-30 Balzers Hochvakuum Mehrfach-haltevorrichtung fuer zu behandelnde substrate.
ES2024439B3 (es) * 1986-02-28 1992-03-01 Schering Ag Berlin Und Bergkamen Armazones alargados y piezas correspondientes para la fijacion soltable de placas de circuito impreso que han de galvanizarse, y placas de circuito impreso correspondientes.
US4696729A (en) * 1986-02-28 1987-09-29 International Business Machines Electroplating cell
DE3726674A1 (de) * 1987-08-11 1989-02-23 Heraeus Elektroden Elektrodenstruktur fuer elektrochemische zellen
US4899966A (en) * 1988-11-10 1990-02-13 The Boeing Company Rack clip for anodizing and painting

Also Published As

Publication number Publication date
US5087333A (en) 1992-02-11
EP0398735B1 (en) 1996-08-21
EP0637640A3 (en) 1996-01-03
ATE141655T1 (de) 1996-09-15
CA2017011A1 (en) 1990-11-19
DE69028137D1 (de) 1996-09-26
CN1047540A (zh) 1990-12-05
NO902210L (no) 1990-11-20
JPH0336299A (ja) 1991-02-15
KR900018422A (ko) 1990-12-21
DE69028137T2 (de) 1997-01-02
EP0398735A2 (en) 1990-11-22
DE637640T1 (de) 1995-10-12
EP0637640A2 (en) 1995-02-08
GB8911566D0 (en) 1989-07-05
EP0398735A3 (en) 1990-12-19
US5152881A (en) 1992-10-06
KR960002124B1 (ko) 1996-02-10
BR9002345A (pt) 1991-08-06

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