DE69500586D1 - Herstellungsverfahren für ein Halbleiter-Bauelement zur Speicherung mehrerer Zustände - Google Patents

Herstellungsverfahren für ein Halbleiter-Bauelement zur Speicherung mehrerer Zustände

Info

Publication number
DE69500586D1
DE69500586D1 DE69500586T DE69500586T DE69500586D1 DE 69500586 D1 DE69500586 D1 DE 69500586D1 DE 69500586 T DE69500586 T DE 69500586T DE 69500586 T DE69500586 T DE 69500586T DE 69500586 D1 DE69500586 D1 DE 69500586D1
Authority
DE
Germany
Prior art keywords
semiconductor device
manufacturing process
storing multiple
multiple states
states
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69500586T
Other languages
English (en)
Other versions
DE69500586T2 (de
Inventor
Tutomu Tamaki
Kiyomi Naruke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69500586D1 publication Critical patent/DE69500586D1/de
Application granted granted Critical
Publication of DE69500586T2 publication Critical patent/DE69500586T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5692—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency read-only digital stores using storage elements with more than two stable states
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Dram (AREA)
  • Read Only Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69500586T 1994-02-12 1995-02-10 Herstellungsverfahren für ein Halbleiter-Bauelement zur Speicherung mehrerer Zustände Expired - Lifetime DE69500586T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3768794A JPH07226446A (ja) 1994-02-12 1994-02-12 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
DE69500586D1 true DE69500586D1 (de) 1997-10-02
DE69500586T2 DE69500586T2 (de) 1998-02-05

Family

ID=12504495

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69500586T Expired - Lifetime DE69500586T2 (de) 1994-02-12 1995-02-10 Herstellungsverfahren für ein Halbleiter-Bauelement zur Speicherung mehrerer Zustände

Country Status (6)

Country Link
US (2) US5629548A (de)
EP (1) EP0667644B1 (de)
JP (1) JPH07226446A (de)
KR (1) KR950025987A (de)
DE (1) DE69500586T2 (de)
TW (1) TW275149B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693551A (en) * 1995-09-19 1997-12-02 United Microelectronics, Corporation Method for fabricating a tri-state read-only memory device
JP3634086B2 (ja) 1996-08-13 2005-03-30 株式会社半導体エネルギー研究所 絶縁ゲイト型半導体装置の作製方法
JP4014676B2 (ja) 1996-08-13 2007-11-28 株式会社半導体エネルギー研究所 絶縁ゲイト型半導体装置およびその作製方法
JP4103968B2 (ja) 1996-09-18 2008-06-18 株式会社半導体エネルギー研究所 絶縁ゲイト型半導体装置
US6590230B1 (en) 1996-10-15 2003-07-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP4104701B2 (ja) * 1997-06-26 2008-06-18 株式会社半導体エネルギー研究所 半導体装置
US6686623B2 (en) 1997-11-18 2004-02-03 Semiconductor Energy Laboratory Co., Ltd. Nonvolatile memory and electronic apparatus
JP4236722B2 (ja) * 1998-02-05 2009-03-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6238982B1 (en) * 1999-04-13 2001-05-29 Advanced Micro Devices Multiple threshold voltage semiconductor device fabrication technology
US6724037B2 (en) * 2000-07-21 2004-04-20 Semiconductor Energy Laboratory Co., Ltd. Nonvolatile memory and semiconductor device
US6683337B2 (en) * 2001-02-09 2004-01-27 Micron Technology, Inc. Dynamic memory based on single electron storage
KR100650867B1 (ko) * 2005-12-29 2006-11-28 동부일렉트로닉스 주식회사 협채널 금속 산화물 반도체 트랜지스터
US20120244668A1 (en) * 2011-03-25 2012-09-27 Jeesung Jung Semiconductor devices with layout controlled channel and associated processes of manufacturing
US8742481B2 (en) * 2011-08-16 2014-06-03 Micron Technology, Inc. Apparatuses and methods comprising a channel region having different minority carrier lifetimes
US10069015B2 (en) 2016-09-26 2018-09-04 International Business Machines Corporation Width adjustment of stacked nanowires

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4272830A (en) * 1978-12-22 1981-06-09 Motorola, Inc. ROM Storage location having more than two states
US4317273A (en) * 1979-11-13 1982-03-02 Texas Instruments Incorporated Method of making high coupling ratio DMOS electrically programmable ROM
US4395725A (en) * 1980-10-14 1983-07-26 Parekh Rajesh H Segmented channel field effect transistors
JPS59148360A (ja) * 1983-02-14 1984-08-25 Fujitsu Ltd 半導体記憶装置及びその製造方法
US4811066A (en) * 1987-10-19 1989-03-07 Motorola, Inc. Compact multi-state ROM cell
US5168465A (en) * 1988-06-08 1992-12-01 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
JPH03185758A (ja) * 1989-12-14 1991-08-13 Sharp Corp 半導体装置の製造方法
IT1240669B (it) * 1990-02-27 1993-12-17 Sgs Thomson Microelectronics Procedimento di programmazione atto a definire almeno quattro differenti livelli di corrente in una cella di memoria rom
US5285069A (en) * 1990-11-21 1994-02-08 Ricoh Company, Ltd. Array of field effect transistors of different threshold voltages in same semiconductor integrated circuit
JPH0555566A (ja) * 1991-08-28 1993-03-05 Nec Corp 半導体装置
US5306657A (en) * 1993-03-22 1994-04-26 United Microelectronics Corporation Process for forming an FET read only memory device

Also Published As

Publication number Publication date
US5629548A (en) 1997-05-13
KR950025987A (ko) 1995-09-18
US5885872A (en) 1999-03-23
TW275149B (de) 1996-05-01
EP0667644A1 (de) 1995-08-16
JPH07226446A (ja) 1995-08-22
DE69500586T2 (de) 1998-02-05
EP0667644B1 (de) 1997-08-27

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