DE69408549T2 - Gehäuse für ein Halbleiterbauelement - Google Patents

Gehäuse für ein Halbleiterbauelement

Info

Publication number
DE69408549T2
DE69408549T2 DE69408549T DE69408549T DE69408549T2 DE 69408549 T2 DE69408549 T2 DE 69408549T2 DE 69408549 T DE69408549 T DE 69408549T DE 69408549 T DE69408549 T DE 69408549T DE 69408549 T2 DE69408549 T2 DE 69408549T2
Authority
DE
Germany
Prior art keywords
housing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69408549T
Other languages
English (en)
Other versions
DE69408549D1 (de
Inventor
Frank Poradish
John T Mckinley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69408549D1 publication Critical patent/DE69408549D1/de
Application granted granted Critical
Publication of DE69408549T2 publication Critical patent/DE69408549T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
DE69408549T 1993-03-16 1994-03-15 Gehäuse für ein Halbleiterbauelement Expired - Fee Related DE69408549T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/033,687 US5293511A (en) 1993-03-16 1993-03-16 Package for a semiconductor device

Publications (2)

Publication Number Publication Date
DE69408549D1 DE69408549D1 (de) 1998-03-26
DE69408549T2 true DE69408549T2 (de) 1998-09-10

Family

ID=21871861

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69408549T Expired - Fee Related DE69408549T2 (de) 1993-03-16 1994-03-15 Gehäuse für ein Halbleiterbauelement

Country Status (7)

Country Link
US (1) US5293511A (de)
EP (1) EP0616238B1 (de)
JP (1) JP2799288B2 (de)
KR (1) KR100319360B1 (de)
CN (1) CN1048093C (de)
DE (1) DE69408549T2 (de)
SG (1) SG43325A1 (de)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
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US6219015B1 (en) 1992-04-28 2001-04-17 The Board Of Directors Of The Leland Stanford, Junior University Method and apparatus for using an array of grating light valves to produce multicolor optical images
US5455386A (en) * 1994-01-14 1995-10-03 Olin Corporation Chamfered electronic package component
JP2600617B2 (ja) * 1994-08-18 1997-04-16 日本電気株式会社 半導体装置およびその製造方法
US5550398A (en) * 1994-10-31 1996-08-27 Texas Instruments Incorporated Hermetic packaging with optical
US5579151A (en) * 1995-02-17 1996-11-26 Texas Instruments Incorporated Spatial light modulator
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
US5641713A (en) * 1995-03-23 1997-06-24 Texas Instruments Incorporated Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring
US5841579A (en) 1995-06-07 1998-11-24 Silicon Light Machines Flat diffraction grating light valve
US6969635B2 (en) 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US5837562A (en) * 1995-07-07 1998-11-17 The Charles Stark Draper Laboratory, Inc. Process for bonding a shell to a substrate for packaging a semiconductor
US5939785A (en) * 1996-04-12 1999-08-17 Texas Instruments Incorporated Micromechanical device including time-release passivant
US5936758A (en) * 1996-04-12 1999-08-10 Texas Instruments Incorporated Method of passivating a micromechanical device within a hermetic package
TW409192B (en) * 1996-07-23 2000-10-21 Ibm A spatial light modulator and a method of assembling the same
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US6025951A (en) * 1996-11-27 2000-02-15 National Optics Institute Light modulating microdevice and method
US5982553A (en) 1997-03-20 1999-11-09 Silicon Light Machines Display device incorporating one-dimensional grating light-valve array
US6088102A (en) 1997-10-31 2000-07-11 Silicon Light Machines Display apparatus including grating light-valve array and interferometric optical system
US6827449B1 (en) * 1997-12-31 2004-12-07 Texas Instruments Incorporated Adhesive-sealed window lid for micromechanical devices
US6271808B1 (en) 1998-06-05 2001-08-07 Silicon Light Machines Stereo head mounted display using a single display device
US6130770A (en) 1998-06-23 2000-10-10 Silicon Light Machines Electron gun activated grating light valve
US6101036A (en) 1998-06-23 2000-08-08 Silicon Light Machines Embossed diffraction grating alone and in combination with changeable image display
US6215579B1 (en) 1998-06-24 2001-04-10 Silicon Light Machines Method and apparatus for modulating an incident light beam for forming a two-dimensional image
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US6962419B2 (en) 1998-09-24 2005-11-08 Reflectivity, Inc Micromirror elements, package for the micromirror elements, and projection system therefor
FR2785449B1 (fr) 1998-10-29 2002-11-29 Commissariat Energie Atomique Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites
JP3695260B2 (ja) * 1999-11-04 2005-09-14 株式会社日立製作所 半導体モジュール
US7026710B2 (en) * 2000-01-21 2006-04-11 Texas Instruments Incorporated Molded package for micromechanical devices and method of fabrication
US6489178B2 (en) 2000-01-26 2002-12-03 Texas Instruments Incorporated Method of fabricating a molded package for micromechanical devices
US6656768B2 (en) * 2001-02-08 2003-12-02 Texas Instruments Incorporated Flip-chip assembly of protected micromechanical devices
US6507082B2 (en) * 2000-02-22 2003-01-14 Texas Instruments Incorporated Flip-chip assembly of protected micromechanical devices
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US7018052B2 (en) * 2000-08-30 2006-03-28 Reflectivity, Inc Projection TV with improved micromirror array
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US6995034B2 (en) * 2000-12-07 2006-02-07 Reflectivity, Inc Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US7307775B2 (en) * 2000-12-07 2007-12-11 Texas Instruments Incorporated Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6649435B2 (en) * 2000-12-29 2003-11-18 Texas Instruments Incorporated Precision micromirror positioning
CA2478142C (en) * 2001-03-09 2009-09-15 Datec Coating Corporation Sol-gel derived resistive and conductive coating
US6534850B2 (en) * 2001-04-16 2003-03-18 Hewlett-Packard Company Electronic device sealed under vacuum containing a getter and method of operation
US6974517B2 (en) * 2001-06-13 2005-12-13 Raytheon Company Lid with window hermetically sealed to frame, and a method of making it
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US7023606B2 (en) * 2001-08-03 2006-04-04 Reflectivity, Inc Micromirror array for projection TV
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6745449B2 (en) * 2001-11-06 2004-06-08 Raytheon Company Method and apparatus for making a lid with an optically transmissive window
KR20030059705A (ko) * 2002-01-04 2003-07-10 엘지전자 주식회사 포토 마스크가 없는 노광장치
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
DE10229038B4 (de) * 2002-06-28 2013-08-14 Robert Bosch Gmbh Verkapptes Mikrostrukturbauelement mit Hochfrequenzdurchführung
FR2842022B1 (fr) * 2002-07-03 2005-05-06 Commissariat Energie Atomique Dispositif de maintien d'un objet sous vide et procedes de fabrication de ce dispositif, application aux detecteurs intrarouges non refroidis
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
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US7405860B2 (en) * 2002-11-26 2008-07-29 Texas Instruments Incorporated Spatial light modulators with light blocking/absorbing areas
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US8619352B2 (en) * 2003-07-29 2013-12-31 Silicon Quest Kabushiki-Kaisha Projection display system using laser light source
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US20090207164A1 (en) * 2003-11-01 2009-08-20 Naoya Sugimoto Mirror control within time slot for SLM
US20090195858A1 (en) * 2003-11-01 2009-08-06 Naoya Sugimoto Changing an electrode function
US20090207325A1 (en) * 2003-11-01 2009-08-20 Naoya Sugimoto Algorithm for SLM of single hinge type
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US20060076631A1 (en) * 2004-09-27 2006-04-13 Lauren Palmateer Method and system for providing MEMS device package with secondary seal
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US7508063B2 (en) * 2005-04-05 2009-03-24 Texas Instruments Incorporated Low cost hermetically sealed package
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US7561334B2 (en) * 2005-12-20 2009-07-14 Qualcomm Mems Technologies, Inc. Method and apparatus for reducing back-glass deflection in an interferometric modulator display device
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CH633902A5 (fr) * 1980-03-11 1982-12-31 Centre Electron Horloger Dispositif de modulation de lumiere.
US5061049A (en) * 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method

Also Published As

Publication number Publication date
DE69408549D1 (de) 1998-03-26
JP2799288B2 (ja) 1998-09-17
JPH06318646A (ja) 1994-11-15
EP0616238B1 (de) 1998-02-18
KR100319360B1 (ko) 2002-04-06
CN1048093C (zh) 2000-01-05
SG43325A1 (en) 1997-10-17
KR940022805A (ko) 1994-10-21
EP0616238A1 (de) 1994-09-21
CN1099520A (zh) 1995-03-01
US5293511A (en) 1994-03-08

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