FR2785449B1 - Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites - Google Patents

Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites

Info

Publication number
FR2785449B1
FR2785449B1 FR9813583A FR9813583A FR2785449B1 FR 2785449 B1 FR2785449 B1 FR 2785449B1 FR 9813583 A FR9813583 A FR 9813583A FR 9813583 A FR9813583 A FR 9813583A FR 2785449 B1 FR2785449 B1 FR 2785449B1
Authority
FR
France
Prior art keywords
assembly system
substrate assembly
hanging areas
cavity hanging
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9813583A
Other languages
English (en)
Other versions
FR2785449A1 (fr
Inventor
Francois Baleras
Pierre Renard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR9813583A priority Critical patent/FR2785449B1/fr
Priority to US09/807,688 priority patent/US6531232B1/en
Priority to PCT/FR1999/002626 priority patent/WO2000026958A1/fr
Priority to EP99950858A priority patent/EP1129479A1/fr
Publication of FR2785449A1 publication Critical patent/FR2785449A1/fr
Application granted granted Critical
Publication of FR2785449B1 publication Critical patent/FR2785449B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Micromachines (AREA)
FR9813583A 1998-10-29 1998-10-29 Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites Expired - Fee Related FR2785449B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9813583A FR2785449B1 (fr) 1998-10-29 1998-10-29 Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites
US09/807,688 US6531232B1 (en) 1998-10-29 1999-10-28 System for assembling substrates to bonding zones provided with cavities
PCT/FR1999/002626 WO2000026958A1 (fr) 1998-10-29 1999-10-28 Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites
EP99950858A EP1129479A1 (fr) 1998-10-29 1999-10-28 Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9813583A FR2785449B1 (fr) 1998-10-29 1998-10-29 Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites

Publications (2)

Publication Number Publication Date
FR2785449A1 FR2785449A1 (fr) 2000-05-05
FR2785449B1 true FR2785449B1 (fr) 2002-11-29

Family

ID=9532141

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9813583A Expired - Fee Related FR2785449B1 (fr) 1998-10-29 1998-10-29 Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites

Country Status (4)

Country Link
US (1) US6531232B1 (fr)
EP (1) EP1129479A1 (fr)
FR (1) FR2785449B1 (fr)
WO (1) WO2000026958A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6809305B2 (en) * 2002-07-22 2004-10-26 California Institute Of Technology Microwave bonding of thin film metal coated substrates
WO2004010739A1 (fr) * 1999-04-22 2004-01-29 California Institute Of Technology Assemblage par micro-ondes de substrats recouverts d'un film mince de metal
DE10037821A1 (de) * 2000-08-03 2002-02-21 Bosch Gmbh Robert Baugruppe, insbesondere Wafer-Baugruppe
FR2834282B1 (fr) * 2001-12-28 2004-02-27 Commissariat Energie Atomique Procede de renforcement d'une microstructure mecanique
US6774327B1 (en) * 2003-09-24 2004-08-10 Agilent Technologies, Inc. Hermetic seals for electronic components
KR100611204B1 (ko) 2005-05-10 2006-08-10 삼성전자주식회사 멀티 스택 패키징 칩 및 그 제조방법
US20080088977A1 (en) 2006-10-11 2008-04-17 Nitto Denko Corporation Heat transfer for a hard-drive pre-amp
JP2012119637A (ja) 2010-12-03 2012-06-21 Sumitomo Electric Device Innovations Inc 光半導体装置の製造方法
US8987871B2 (en) * 2012-05-31 2015-03-24 Stmicroelectronics Pte Ltd. Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917271A (ja) * 1982-07-20 1984-01-28 Nec Corp セラミツクパツケ−ジ半導体装置
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
US5293511A (en) * 1993-03-16 1994-03-08 Texas Instruments Incorporated Package for a semiconductor device
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5643831A (en) * 1994-01-20 1997-07-01 Fujitsu Limited Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
US5561085A (en) * 1994-12-19 1996-10-01 Martin Marietta Corporation Structure for protecting air bridges on semiconductor chips from damage
US6448169B1 (en) * 1995-12-21 2002-09-10 International Business Machines Corporation Apparatus and method for use in manufacturing semiconductor devices
US5825092A (en) * 1996-05-20 1998-10-20 Harris Corporation Integrated circuit with an air bridge having a lid
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
US6105852A (en) * 1998-02-05 2000-08-22 International Business Machines Corporation Etched glass solder bump transfer for flip chip integrated circuit devices

Also Published As

Publication number Publication date
EP1129479A1 (fr) 2001-09-05
FR2785449A1 (fr) 2000-05-05
US6531232B1 (en) 2003-03-11
WO2000026958A1 (fr) 2000-05-11

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090630