DE69433895D1 - Ein Hydroxylamin und ein Alkanolamin enthaltende wässrige Abbeiz-Zusammensetzungen und ihre Verwendung. - Google Patents

Ein Hydroxylamin und ein Alkanolamin enthaltende wässrige Abbeiz-Zusammensetzungen und ihre Verwendung.

Info

Publication number
DE69433895D1
DE69433895D1 DE69433895T DE69433895T DE69433895D1 DE 69433895 D1 DE69433895 D1 DE 69433895D1 DE 69433895 T DE69433895 T DE 69433895T DE 69433895 T DE69433895 T DE 69433895T DE 69433895 D1 DE69433895 D1 DE 69433895D1
Authority
DE
Germany
Prior art keywords
hydroxylamine
alkanolamine
compositions containing
paint compositions
aqueous paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69433895T
Other languages
English (en)
Other versions
DE69433895T2 (de
Inventor
Irl E Ward
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Publication of DE69433895D1 publication Critical patent/DE69433895D1/de
Application granted granted Critical
Publication of DE69433895T2 publication Critical patent/DE69433895T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005Other compounding ingredients characterised by their effect
    • C11D3/0073Anticorrosion compositions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00Chemical paint or ink removers
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3218Alkanolamines or alkanolimines
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/16Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions using inhibitors
    • C23G1/18Organic inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Detergent Compositions (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Paints Or Removers (AREA)
  • Biological Depolymerization Polymers (AREA)
DE69433895T 1993-12-02 1994-11-30 Ein Hydroxylamin und ein Alkanolamin enthaltende wässrige Abbeiz-Zusammensetzungen und ihre Verwendung. Expired - Lifetime DE69433895T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US162429 1980-06-24
US08/162,429 US5419779A (en) 1993-12-02 1993-12-02 Stripping with aqueous composition containing hydroxylamine and an alkanolamine

Publications (2)

Publication Number Publication Date
DE69433895D1 true DE69433895D1 (de) 2004-08-19
DE69433895T2 DE69433895T2 (de) 2005-07-28

Family

ID=22585582

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69433895T Expired - Lifetime DE69433895T2 (de) 1993-12-02 1994-11-30 Ein Hydroxylamin und ein Alkanolamin enthaltende wässrige Abbeiz-Zusammensetzungen und ihre Verwendung.

Country Status (9)

Country Link
US (1) US5419779A (de)
EP (1) EP0656405B1 (de)
JP (1) JPH07325404A (de)
KR (1) KR950018340A (de)
AT (1) ATE271105T1 (de)
DE (1) DE69433895T2 (de)
ES (1) ES2223044T3 (de)
SG (1) SG42993A1 (de)
TW (1) TW349986B (de)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7205265B2 (en) * 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US5981454A (en) * 1993-06-21 1999-11-09 Ekc Technology, Inc. Post clean treatment composition comprising an organic acid and hydroxylamine
US6546939B1 (en) 1990-11-05 2003-04-15 Ekc Technology, Inc. Post clean treatment
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US6121217A (en) 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
US6187730B1 (en) * 1990-11-05 2001-02-13 Ekc Technology, Inc. Hydroxylamine-gallic compound composition and process
US6492311B2 (en) 1990-11-05 2002-12-10 Ekc Technology, Inc. Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process
US6242400B1 (en) * 1990-11-05 2001-06-05 Ekc Technology, Inc. Method of stripping resists from substrates using hydroxylamine and alkanolamine
US5556482A (en) * 1991-01-25 1996-09-17 Ashland, Inc. Method of stripping photoresist with composition containing inhibitor
US5928430A (en) * 1991-01-25 1999-07-27 Advanced Scientific Concepts, Inc. Aqueous stripping and cleaning compositions containing hydroxylamine and use thereof
US5988186A (en) * 1991-01-25 1999-11-23 Ashland, Inc. Aqueous stripping and cleaning compositions
US5753601A (en) * 1991-01-25 1998-05-19 Ashland Inc Organic stripping composition
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5597678A (en) * 1994-04-18 1997-01-28 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5612304A (en) * 1995-07-07 1997-03-18 Olin Microelectronic Chemicals, Inc. Redox reagent-containing post-etch residue cleaning composition
JP2911792B2 (ja) * 1995-09-29 1999-06-23 東京応化工業株式会社 レジスト用剥離液組成物
EP0843841B1 (de) * 1996-06-10 2002-09-04 Koninklijke Philips Electronics N.V. Entschichtungsmittel
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US5709756A (en) * 1996-11-05 1998-01-20 Ashland Inc. Basic stripping and cleaning composition
WO1998022568A1 (en) * 1996-11-22 1998-05-28 Advanced Chemical Systems International, Inc. Stripping formulation including catechol, hydroxylamine, non-alkanolamine, water for post plasma ashed wafer cleaning
US5888308A (en) * 1997-02-28 1999-03-30 International Business Machines Corporation Process for removing residue from screening masks with alkaline solution
US5780363A (en) * 1997-04-04 1998-07-14 International Business Machines Coporation Etching composition and use thereof
US5965465A (en) * 1997-09-18 1999-10-12 International Business Machines Corporation Etching of silicon nitride
US6033996A (en) * 1997-11-13 2000-03-07 International Business Machines Corporation Process for removing etching residues, etching mask and silicon nitride and/or silicon dioxide
US6150282A (en) * 1997-11-13 2000-11-21 International Business Machines Corporation Selective removal of etching residues
US6432209B2 (en) 1998-03-03 2002-08-13 Silicon Valley Chemlabs Composition and method for removing resist and etching residues using hydroxylazmmonium carboxylates
US6319884B2 (en) 1998-06-16 2001-11-20 International Business Machines Corporation Method for removal of cured polyimide and other polymers
US6368421B1 (en) 1998-07-10 2002-04-09 Clariant Finance (Bvi) Limited Composition for stripping photoresist and organic materials from substrate surfaces
US6117796A (en) * 1998-08-13 2000-09-12 International Business Machines Corporation Removal of silicon oxide
US6200891B1 (en) 1998-08-13 2001-03-13 International Business Machines Corporation Removal of dielectric oxides
GB2342727A (en) * 1998-10-12 2000-04-19 Ekc Technology Ltd Composition to remove resists and tp inhibit titanium corrosion
JP4224651B2 (ja) * 1999-02-25 2009-02-18 三菱瓦斯化学株式会社 レジスト剥離剤およびそれを用いた半導体素子の製造方法
US6274504B2 (en) 1999-06-15 2001-08-14 Advanced Micro Devices, Inc. Minimizing metal corrosion during post metal solvent clean
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6723691B2 (en) 1999-11-16 2004-04-20 Advanced Technology Materials, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6194366B1 (en) 1999-11-16 2001-02-27 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
KR100366974B1 (ko) * 1999-12-30 2003-01-14 유니켐스 (주) 드라이필름용 박리액 조성물 및 이를 이용한 드라이필름의박리방법
JP2001356496A (ja) * 2000-06-15 2001-12-26 Nagase Kasei Kogyo Kk フォトレジスト剥離剤組成物及びその使用方法
US6627587B2 (en) 2001-04-19 2003-09-30 Esc Inc. Cleaning compositions
US6652666B2 (en) * 2001-05-02 2003-11-25 Taiwan Semiconductor Manufacturing Co. Ltd Wet dip method for photoresist and polymer stripping without buffer treatment step
US6551973B1 (en) 2001-10-09 2003-04-22 General Chemical Corporation Stable metal-safe stripper for removing cured negative-tone novolak and acrylic photoresists and post-etch residue
ATE405622T1 (de) * 2002-10-22 2008-09-15 Ekc Technology Inc Wässrige phosphorsäurezusammensetzung zur reinigung von halbleiter-vorrichtungen
JP4085262B2 (ja) * 2003-01-09 2008-05-14 三菱瓦斯化学株式会社 レジスト剥離剤
US7335600B2 (en) * 2003-05-01 2008-02-26 United Microelectronics Corp. Method for removing photoresist
JP2005159295A (ja) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd 基板処理装置及び処理方法
CA2544198C (en) * 2003-10-29 2011-07-26 Mallinckrodt Baker, Inc. Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
US20060154186A1 (en) * 2005-01-07 2006-07-13 Advanced Technology Materials, Inc. Composition useful for removal of post-etch photoresist and bottom anti-reflection coatings
US7879782B2 (en) * 2005-10-13 2011-02-01 Air Products And Chemicals, Inc. Aqueous cleaning composition and method for using same
US8263539B2 (en) * 2005-10-28 2012-09-11 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and methods for its use
US7632796B2 (en) * 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
KR101251594B1 (ko) * 2006-03-23 2013-04-08 주식회사 동진쎄미켐 레지스트 스트리퍼 제거용 케미칼 린스 조성물
US7655608B2 (en) * 2007-08-03 2010-02-02 Dynaloy, Llc Reduced metal etch rates using stripper solutions containing a copper salt
TWI450052B (zh) * 2008-06-24 2014-08-21 Dynaloy Llc 用於後段製程操作有效之剝離溶液
US20100151206A1 (en) 2008-12-11 2010-06-17 Air Products And Chemicals, Inc. Method for Removal of Carbon From An Organosilicate Material
JP5646882B2 (ja) 2009-09-30 2014-12-24 富士フイルム株式会社 洗浄組成物、洗浄方法、及び半導体装置の製造方法
US8101561B2 (en) 2009-11-17 2012-01-24 Wai Mun Lee Composition and method for treating semiconductor substrate surface
TWI539493B (zh) 2010-03-08 2016-06-21 黛納羅伊有限責任公司 用於摻雜具有分子單層之矽基材之方法及組合物
US10189712B2 (en) 2013-03-15 2019-01-29 International Business Machines Corporation Oxidation of porous, carbon-containing materials using fuel and oxidizing agent
RU2642635C1 (ru) * 2016-12-27 2018-01-25 Публичное акционерное общество Научно-производственное объединение "Искра" Биодеградируемый композиционный материал

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1908625B2 (de) * 1969-02-21 1971-08-12 Bergische Metallwarenfabrik Dillen berg & Co KG, 5601 Gruiten Bad zu elektrolytischen abloesen von metallueberzuegen von grundkoerpern aus rostfreiem stahl
US3972839A (en) * 1973-01-17 1976-08-03 Oxy Metal Industries Corporation Amine stripping composition and method
US4067690A (en) * 1976-05-04 1978-01-10 Chemed Corporation Boiler water treatment
US4078102A (en) * 1976-10-29 1978-03-07 International Business Machines Corporation Process for stripping resist layers from substrates
US4170478A (en) * 1977-06-06 1979-10-09 Eastman Kodak Company Photographic color developer compositions
JPS5479131A (en) * 1977-12-07 1979-06-23 Okuno Chem Ind Co Electrolytic bath for removing electrodeposited metal on stainless steel substrate
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4350606A (en) * 1980-10-03 1982-09-21 Dearborn Chemical Company Composition and method for inhibiting corrosion
US4363741A (en) * 1980-12-19 1982-12-14 Borden, Inc. Automotive cooling system cleaner
US4509989A (en) * 1983-03-25 1985-04-09 United States Steel Corporation Cleaning method for removing sulfur containing deposits from coke oven gas lines
CA1210930A (en) * 1984-04-18 1986-09-09 Harvey W. Thompson Composition and method for deoxygenation
SU1244211A1 (ru) * 1984-11-22 1986-07-15 Киевский Ордена Трудового Красного Знамени Технологический Институт Пищевой Промышленности Электролит дл осаждени сплава на основе вольфрама и никел
DE3501675A1 (de) * 1985-01-19 1986-07-24 Merck Patent Gmbh, 6100 Darmstadt Mittel und verfahren zur entfernung von fotoresist- und stripperresten von halbleitersubstraten
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
US4770713A (en) * 1986-12-10 1988-09-13 Advanced Chemical Technologies, Inc. Stripping compositions containing an alkylamide and an alkanolamine and use thereof
JP2542898B2 (ja) * 1988-04-07 1996-10-09 富士写真フイルム株式会社 水なしps版用現像液
US4941941A (en) * 1989-10-03 1990-07-17 International Business Machines Corporation Method of anisotropically etching silicon wafers and wafer etching solution
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5091108A (en) * 1991-02-21 1992-02-25 Nalco Chemical Company Method of retarding corrosion of metal surfaces in contact with boiler water systems which corrosion is caused by dissolved oxygen

Also Published As

Publication number Publication date
SG42993A1 (en) 1997-10-17
EP0656405A3 (de) 1996-07-03
ATE271105T1 (de) 2004-07-15
TW349986B (en) 1999-01-11
DE69433895T2 (de) 2005-07-28
KR950018340A (ko) 1995-07-22
ES2223044T3 (es) 2005-02-16
US5419779A (en) 1995-05-30
EP0656405A2 (de) 1995-06-07
JPH07325404A (ja) 1995-12-12
EP0656405B1 (de) 2004-07-14

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