DE69433142D1 - Vorrichtung und Verfahren zur Projektionsbelichtung - Google Patents

Vorrichtung und Verfahren zur Projektionsbelichtung

Info

Publication number
DE69433142D1
DE69433142D1 DE69433142T DE69433142T DE69433142D1 DE 69433142 D1 DE69433142 D1 DE 69433142D1 DE 69433142 T DE69433142 T DE 69433142T DE 69433142 T DE69433142 T DE 69433142T DE 69433142 D1 DE69433142 D1 DE 69433142D1
Authority
DE
Germany
Prior art keywords
exposure apparatus
projection exposure
projection
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69433142T
Other languages
English (en)
Other versions
DE69433142T2 (de
Inventor
Naomasa Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15991406&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69433142(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of DE69433142D1 publication Critical patent/DE69433142D1/de
Publication of DE69433142T2 publication Critical patent/DE69433142T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/701—Off-axis setting using an aperture
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G03F7/70333—Focus drilling, i.e. increase in depth of focus for exposure by modulating focus during exposure [FLEX]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69433142T 1993-07-15 1994-07-15 Vorrichtung und Verfahren zur Projektionsbelichtung Revoked DE69433142T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17516593 1993-07-15
JP17516593A JP3291849B2 (ja) 1993-07-15 1993-07-15 露光方法、デバイス形成方法、及び露光装置

Publications (2)

Publication Number Publication Date
DE69433142D1 true DE69433142D1 (de) 2003-10-16
DE69433142T2 DE69433142T2 (de) 2004-04-01

Family

ID=15991406

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69415610T Expired - Fee Related DE69415610T2 (de) 1993-07-15 1994-07-15 Vorrichtung und Verfahren zur Projektionsbelichtung
DE69433142T Revoked DE69433142T2 (de) 1993-07-15 1994-07-15 Vorrichtung und Verfahren zur Projektionsbelichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69415610T Expired - Fee Related DE69415610T2 (de) 1993-07-15 1994-07-15 Vorrichtung und Verfahren zur Projektionsbelichtung

Country Status (5)

Country Link
US (1) US5448336A (de)
EP (2) EP0834771B1 (de)
JP (1) JP3291849B2 (de)
KR (1) KR100306953B1 (de)
DE (2) DE69415610T2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3303436B2 (ja) * 1993-05-14 2002-07-22 キヤノン株式会社 投影露光装置及び半導体素子の製造方法
DE69434080T2 (de) * 1993-06-11 2005-10-20 Nikon Corp. Abtastbelichtungsvorrichtung
JP3291849B2 (ja) * 1993-07-15 2002-06-17 株式会社ニコン 露光方法、デバイス形成方法、及び露光装置
US6304317B1 (en) * 1993-07-15 2001-10-16 Nikon Corporation Projection apparatus and method
US5995263A (en) * 1993-11-12 1999-11-30 Nikon Corporation Projection exposure apparatus
JPH07220988A (ja) * 1994-01-27 1995-08-18 Canon Inc 投影露光方法及び装置及びこれを用いたデバイス製造方法
US5636004A (en) * 1994-08-19 1997-06-03 Nippon Telegraph And Telephone Corporation Projection exposure method and apparatus
US5739899A (en) * 1995-05-19 1998-04-14 Nikon Corporation Projection exposure apparatus correcting tilt of telecentricity
JP3491212B2 (ja) * 1995-06-23 2004-01-26 株式会社ニコン 露光装置、照明光学装置、照明光学系の設計方法及び露光方法
JPH09167731A (ja) 1995-12-14 1997-06-24 Mitsubishi Electric Corp 投影露光装置、収差評価用マスクパタン、収差量評価方法、収差除去フィルター及び半導体装置の製造方法
US5883703A (en) * 1996-02-08 1999-03-16 Megapanel Corporation Methods and apparatus for detecting and compensating for focus errors in a photolithography tool
US5866481A (en) * 1996-06-07 1999-02-02 Taiwan Semiconductor Manufacturing Company Ltd. Selective partial curing of spin-on-glass by ultraviolet radiation to protect integrated circuit dice near the wafer edge
JP4310816B2 (ja) * 1997-03-14 2009-08-12 株式会社ニコン 照明装置、投影露光装置、デバイスの製造方法、及び投影露光装置の調整方法
US6600550B1 (en) * 1999-06-03 2003-07-29 Nikon Corporation Exposure apparatus, a photolithography method, and a device manufactured by the same
JP2001291653A (ja) * 2000-04-06 2001-10-19 Promos Technologies Inc 露光ステッパの露光解像力を向上させる方法及び装置
DE10220324A1 (de) * 2002-04-29 2003-11-13 Zeiss Carl Smt Ag Projektionsverfahren mit Pupillenfilterung und Projektionsobjektiv hierfür
KR20170018113A (ko) 2003-04-09 2017-02-15 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
TWI573175B (zh) 2003-10-28 2017-03-01 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造 方法
WO2005050323A1 (en) * 2003-10-29 2005-06-02 Carl Zeiss Smt Ag Optical assembly for photolithography
TWI512335B (zh) 2003-11-20 2015-12-11 尼康股份有限公司 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
TWI505329B (zh) 2004-02-06 2015-10-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
WO2005076084A1 (en) * 2004-02-09 2005-08-18 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
DE102004017082A1 (de) * 2004-04-07 2005-11-10 Carl Zeiss Smt Ag Optische Abbildungsvorrichtung
US8525075B2 (en) * 2004-05-06 2013-09-03 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
US20050287483A1 (en) * 2004-06-23 2005-12-29 International Business Machines Corporation Contact hole printing method and apparatus with single mask, multiple exposures, and optimized pupil filtering
CN101228615B (zh) * 2005-07-26 2012-03-21 富士通半导体股份有限公司 对位方法
DE102006018928A1 (de) * 2006-04-24 2007-11-08 Carl Zeiss Smt Ag Projektionsbelichtungssystem und Verwendung desselben
JP5299937B2 (ja) 2006-05-18 2013-09-25 カール・ツァイス・エスエムティー・ゲーエムベーハー 光近接効果を補正する方法
US20080239263A1 (en) * 2007-03-29 2008-10-02 Asml Netherlands B.V. Lithographic system and device manufacturing method
DE102008001216A1 (de) * 2007-04-18 2008-10-23 Carl Zeiss Smt Ag Projektionsobjektiv für die Mikrolithographie
JP4843580B2 (ja) * 2007-08-10 2011-12-21 株式会社東芝 光学像強度分布のシミュレーション方法、シミュレーションプログラム及びパターンデータ作成方法
US8001495B2 (en) * 2008-04-17 2011-08-16 International Business Machines Corporation System and method of predicting problematic areas for lithography in a circuit design
JP2009290206A (ja) * 2008-05-01 2009-12-10 Dainippon Printing Co Ltd 露光装置用瞳フィルタ、回折光学素子及びそれを備えた露光装置
JP2010087388A (ja) * 2008-10-02 2010-04-15 Ushio Inc 露光装置
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
KR102207841B1 (ko) * 2014-02-12 2021-01-26 삼성디스플레이 주식회사 표시 장치의 제조 방법
US10634623B2 (en) * 2016-10-07 2020-04-28 Kla-Tencor Corporation Phase contrast monitoring for extreme ultra-violet (EUV) masks defect inspection
CN108195305B (zh) * 2018-02-09 2020-03-31 京东方科技集团股份有限公司 一种双目检测系统及其深度检测方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4771180A (en) * 1985-10-11 1988-09-13 Matsushita Electric Industrial Co. Ltd. Exposure apparatus including an optical system for aligning a reticle and a wafer
US5208654A (en) * 1990-05-16 1993-05-04 The United States Of America As Represented By The United States Department Of Energy Laser metrology for coherent multi-telescope arrays
JP3245882B2 (ja) * 1990-10-24 2002-01-15 株式会社日立製作所 パターン形成方法、および投影露光装置
US5144362A (en) * 1990-11-14 1992-09-01 Mitsubishi Denki Kabushiki Kaisha Projection aligner
JP2705312B2 (ja) * 1990-12-06 1998-01-28 ソニー株式会社 投影露光方法
DE69215942T2 (de) * 1991-04-05 1997-07-24 Nippon Telegraph & Telephone Verfahren und System zur optischen Projetkionsbelichtung
US5348837A (en) * 1991-09-24 1994-09-20 Hitachi, Ltd. Projection exposure apparatus and pattern forming method for use therewith
US5311249A (en) * 1992-02-13 1994-05-10 Mitsubishi Denki Kabushiki Kaisha Projection exposure apparatus
JPH0684746A (ja) * 1992-03-09 1994-03-25 Hitachi Ltd 投影露光装置及びパタン形成方法
JP3278896B2 (ja) * 1992-03-31 2002-04-30 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5329336A (en) * 1992-07-06 1994-07-12 Nikon Corporation Exposure method and apparatus
JP3291849B2 (ja) * 1993-07-15 2002-06-17 株式会社ニコン 露光方法、デバイス形成方法、及び露光装置

Also Published As

Publication number Publication date
DE69415610D1 (de) 1999-02-11
EP0834771A1 (de) 1998-04-08
KR100306953B1 (ko) 2001-11-30
KR950004373A (ko) 1995-02-17
DE69433142T2 (de) 2004-04-01
EP0638847A1 (de) 1995-02-15
EP0638847B1 (de) 1998-12-30
EP0834771B1 (de) 2003-09-10
JP3291849B2 (ja) 2002-06-17
JPH0729808A (ja) 1995-01-31
US5448336A (en) 1995-09-05
DE69415610T2 (de) 1999-07-22

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8363 Opposition against the patent
8331 Complete revocation