DE69430706D1 - Rezyklieren von zur reinigung von halbleiterscheiben verwendeten stoffen - Google Patents

Rezyklieren von zur reinigung von halbleiterscheiben verwendeten stoffen

Info

Publication number
DE69430706D1
DE69430706D1 DE69430706T DE69430706T DE69430706D1 DE 69430706 D1 DE69430706 D1 DE 69430706D1 DE 69430706 T DE69430706 T DE 69430706T DE 69430706 T DE69430706 T DE 69430706T DE 69430706 D1 DE69430706 D1 DE 69430706D1
Authority
DE
Germany
Prior art keywords
recycling
materials used
clean semiconductor
semiconductor disc
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69430706T
Other languages
English (en)
Other versions
DE69430706T2 (de
Inventor
C Grant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
FSI INTERNATIONAL CHASKA
FSI International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSI INTERNATIONAL CHASKA, FSI International Inc filed Critical FSI INTERNATIONAL CHASKA
Publication of DE69430706D1 publication Critical patent/DE69430706D1/de
Application granted granted Critical
Publication of DE69430706T2 publication Critical patent/DE69430706T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00—Halogens; Halogen acids
    • C01B7/01—Chlorine; Hydrogen chloride
    • C01B7/07—Purification ; Separation
    • C01B7/0706—Purification ; Separation of hydrogen chloride
    • C01B7/0712—Purification ; Separation of hydrogen chloride by distillation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D3/00—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping
    • B01D3/34—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping with one or more auxiliary substances
    • B01D3/343—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping with one or more auxiliary substances the substance being a gas
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/20—Nitrogen oxides; Oxyacids of nitrogen; Salts thereof
    • C01B21/38—Nitric acid
    • C01B21/46—Purification; Separation ; Stabilisation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00—Halogens; Halogen acids
    • C01B7/09—Bromine; Hydrogen bromide
    • C01B7/093—Hydrogen bromide
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00—Halogens; Halogen acids
    • C01B7/19—Fluorine; Hydrogen fluoride
    • C01B7/191—Hydrogen fluoride
    • C01B7/195—Separation; Purification
    • C01B7/196—Separation; Purification by distillation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S159/00—Concentrating evaporators
    • Y10S159/19—Acid

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69430706T 1994-01-12 1994-11-14 Rezyklieren von zur reinigung von halbleiterscheiben verwendeten stoffen Expired - Fee Related DE69430706T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/180,546 US5632866A (en) 1994-01-12 1994-01-12 Point-of-use recycling of wafer cleaning substances
PCT/US1994/012750 WO1995019211A1 (en) 1994-01-12 1994-11-14 Recycling of wafer cleaning substances

Publications (2)

Publication Number Publication Date
DE69430706D1 true DE69430706D1 (de) 2002-07-04
DE69430706T2 DE69430706T2 (de) 2002-09-12

Family

ID=22660849

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69430706T Expired - Fee Related DE69430706T2 (de) 1994-01-12 1994-11-14 Rezyklieren von zur reinigung von halbleiterscheiben verwendeten stoffen

Country Status (6)

Country Link
US (1) US5632866A (de)
EP (1) EP0739228B1 (de)
JP (1) JP3600834B2 (de)
AU (1) AU1254395A (de)
DE (1) DE69430706T2 (de)
WO (1) WO1995019211A1 (de)

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US5785820A (en) * 1994-01-07 1998-07-28 Startec Ventures, Inc. On-site manufacture of ultra-high-purity hydrofluoric acid for semiconductor processing
US6004433A (en) * 1997-02-03 1999-12-21 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes George Claude Purification of electronic specialty gases by vapor phase transfilling
US6310017B1 (en) 1999-02-01 2001-10-30 Ct Associates, Inc. Cleaner composition, method for making and using same
SG92720A1 (en) * 1999-07-14 2002-11-19 Nisso Engineering Co Ltd Method and apparatus for etching silicon
DE19948206A1 (de) * 1999-10-07 2001-04-12 Merck Patent Gmbh Verfahren zur Herstellung hochreiner Salzsäure
US6423290B1 (en) 2000-05-31 2002-07-23 International Business Machines Corporation Method for recovering an organic solvent from an acidic waste stream such as in integrated chip manufacturing
US6551412B1 (en) 2001-07-16 2003-04-22 Taiwan Semiconductor Manufacturing Company Non-tubular type recycle system of wet bench tank
US6737034B2 (en) * 2001-08-02 2004-05-18 The United States Of America As Represented By The Secretary Of The Army Nitric acid production
US20060196541A1 (en) * 2005-03-04 2006-09-07 David Gerken Control of fluid conditions in bulk fluid distribution systems
US7810516B2 (en) * 2005-03-04 2010-10-12 Air Liquide Electronics U.S. Lp Control of fluid conditions in bulk fluid distribution systems
US20060266737A1 (en) * 2005-05-27 2006-11-30 Hanestad Ronald J Process for removal of metals and alloys from a substrate
CN101028918B (zh) * 2006-02-27 2012-03-28 三菱化学工程株式会社 氟酸的回收方法
CN101028919B (zh) * 2006-02-27 2011-07-20 三菱化学工程株式会社 氟酸的回收方法
US7743783B2 (en) * 2006-04-04 2010-06-29 Air Liquide Electronics U.S. Lp Method and apparatus for recycling process fluids
US20070251585A1 (en) * 2006-04-28 2007-11-01 David Paul Edwards Fluid distribution system
JP5188064B2 (ja) * 2006-12-15 2013-04-24 ステラケミファ株式会社 フッ酸及び塩酸の回収方法
JP5143440B2 (ja) * 2007-02-01 2013-02-13 森田化学工業株式会社 フッ化水素酸、塩酸およびケイフッ化水素酸を含有する廃液から酸成分を分離・回収する方法およびその装置
US20110079250A1 (en) * 2009-10-01 2011-04-07 Mt Systems, Inc. Post-texturing cleaning method for photovoltaic silicon substrates
US9102604B1 (en) * 2010-02-15 2015-08-11 Baxter International Inc. Methods for cleaning distilling columns
US20120091099A1 (en) * 2010-10-18 2012-04-19 Applied Materials, Inc. Methods and apparatus for recovery and reuse of reagents
US9298521B1 (en) * 2013-04-29 2016-03-29 Seagate Technology Llc Command sets and functions
RU2601007C2 (ru) * 2013-10-29 2016-10-27 Общество с ограниченной ответственностью "Новые химические продукты" Способ извлечения фтористого водорода из его водных растворов

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Publication number Priority date Publication date Assignee Title
US3394056A (en) * 1965-08-31 1968-07-23 Exxon Research Engineering Co Recovery of anhydrous hci from aqueous azeotropes by plural stage distillation
DE1914579A1 (de) * 1969-03-21 1970-09-24 Sigri Elektrographit Gmbh Verfahren und Vorrichtung zur vollstaendigen Zerlegung waessriger Salzsaeure
US3635664A (en) * 1969-08-20 1972-01-18 Daido Chem Eng Corp REGENERATION OF HYDROCHLORIC ACID PICKLING WASTE BY H{11 SO{11 {0 ADDITION, DISTILLATION AND FeSO{11 {0 Precipitation
US4261791A (en) * 1979-09-25 1981-04-14 Rca Corporation Two step method of cleaning silicon wafers
FI67409C (fi) * 1983-01-25 1985-03-11 Outokumpu Oy Foerfarande foer regenerering av betningssyror
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
DE3504292C1 (de) * 1985-02-08 1986-07-24 Richard Wolf Gmbh, 7134 Knittlingen Instrument fuer endoskopische Eingriffe,insbesondere zur perkutanen Gallensteinentfernung oder Gallenblasenveroedung
JPS62235218A (ja) * 1986-04-04 1987-10-15 Unitika Ltd ウランおよびフツ酸の分離回収法
US4855023A (en) * 1986-10-06 1989-08-08 Athens, Inc. Method and apparatus for the continuous on-site chemical reprocessing of ultrapure liquids used in semiconductor wafer cleaning
DE3728693A1 (de) * 1987-08-27 1989-03-09 Wacker Chemitronic Verfahren und vorrichtung zum aetzen von halbleiteroberflaechen
US4936955A (en) * 1988-08-12 1990-06-26 Alameda Instruments, Inc. Hydrofluoric acid reprocessing for semiconductor standards
US4980032A (en) * 1988-08-12 1990-12-25 Alameda Instruments, Inc. Distillation method and apparatus for reprocessing sulfuric acid
US5061348A (en) * 1988-08-12 1991-10-29 Alameda Instruments Sulfuric acid reprocessor with continuous purge of second distillation vessel
US5288333A (en) * 1989-05-06 1994-02-22 Dainippon Screen Mfg. Co., Ltd. Wafer cleaning method and apparatus therefore
JP2787788B2 (ja) * 1990-09-26 1998-08-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 残留物除去方法
US5089084A (en) * 1990-12-03 1992-02-18 Micron Technology, Inc. Hydrofluoric acid etcher and cascade rinser
CA2059841A1 (en) * 1991-01-24 1992-07-25 Ichiro Hayashida Surface treating solutions and cleaning method
US5174865A (en) * 1991-01-25 1992-12-29 Dow Deutschland Inc. Process for purifying crude hydrochloric acid
US5185111A (en) * 1991-02-13 1993-02-09 Polypore, Inc. Method of producing elastomeric open cell structures
US5242468A (en) * 1991-03-19 1993-09-07 Startec Ventures, Inc. Manufacture of high precision electronic components with ultra-high purity liquids
US5188986A (en) * 1991-05-17 1993-02-23 United Microelectronics Corporation Hydrogen peroxide in basic solution to clean polycrystalline silicon after phosphorous diffusion
US5176699A (en) * 1991-06-05 1993-01-05 Harold Markham Surgical device with double jaw actuation
JP3085549B2 (ja) * 1991-06-29 2000-09-11 アサカ理研工業株式会社 塩化銅廃液からの塩酸及び硫酸銅の回収方法
US5164093A (en) * 1991-11-29 1992-11-17 Motorola, Inc. Apparatus and method for removing metallic contamination from fluids using silicon beads
US5277715A (en) * 1992-06-04 1994-01-11 Micron Semiconductor, Inc. Method of reducing particulate concentration in process fluids

Also Published As

Publication number Publication date
AU1254395A (en) 1995-08-01
EP0739228B1 (de) 2002-05-29
US5632866A (en) 1997-05-27
JPH09507613A (ja) 1997-07-29
JP3600834B2 (ja) 2004-12-15
EP0739228A1 (de) 1996-10-30
WO1995019211A1 (en) 1995-07-20
EP0739228A4 (de) 1998-05-20
DE69430706T2 (de) 2002-09-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: THE BOC GROUP,INC.(N.D.GES.D.STAATES DELAWARE), MU

8339 Ceased/non-payment of the annual fee