DE69418399D1 - Dünnfilmanordnung und Verfahren zur Herstellung - Google Patents
Dünnfilmanordnung und Verfahren zur HerstellungInfo
- Publication number
- DE69418399D1 DE69418399D1 DE69418399T DE69418399T DE69418399D1 DE 69418399 D1 DE69418399 D1 DE 69418399D1 DE 69418399 T DE69418399 T DE 69418399T DE 69418399 T DE69418399 T DE 69418399T DE 69418399 D1 DE69418399 D1 DE 69418399D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- thin film
- film assembly
- assembly
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21123893A JP3106786B2 (ja) | 1993-08-26 | 1993-08-26 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69418399D1 true DE69418399D1 (de) | 1999-06-17 |
DE69418399T2 DE69418399T2 (de) | 1999-09-30 |
Family
ID=16602579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69418399T Expired - Fee Related DE69418399T2 (de) | 1993-08-26 | 1994-08-26 | Dünnfilmanordnung und Verfahren zur Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5660971A (de) |
EP (1) | EP0641028B1 (de) |
JP (1) | JP3106786B2 (de) |
KR (1) | KR0171648B1 (de) |
DE (1) | DE69418399T2 (de) |
TW (1) | TW399741U (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5834100A (en) * | 1996-06-25 | 1998-11-10 | Northwestern University | Organic light-emitting dioddes and methods for assembly and emission control |
US6586763B2 (en) * | 1996-06-25 | 2003-07-01 | Northwestern University | Organic light-emitting diodes and methods for assembly and emission control |
US6939625B2 (en) * | 1996-06-25 | 2005-09-06 | Nôrthwestern University | Organic light-emitting diodes and methods for assembly and enhanced charge injection |
US6579749B2 (en) * | 1998-11-17 | 2003-06-17 | Nec Corporation | Fabrication method and fabrication apparatus for thin film transistor |
KR100375870B1 (ko) * | 2000-05-22 | 2003-03-15 | 상산소재 주식회사 | 인조대리석 판재의 성형방법과 이 방법으로 제조된 보울일체식 세면대 |
KR100684928B1 (ko) * | 2000-07-07 | 2007-02-20 | 학교법인연세대학교 | 네트웍 구조의 확산방지층을 구비한 화합물 반도체 소자및 그 제조방법 |
CN1267780C (zh) * | 2002-11-11 | 2006-08-02 | Lg.飞利浦Lcd有限公司 | 用于液晶显示器的阵列基板及其制造方法 |
JP2006171344A (ja) * | 2004-12-15 | 2006-06-29 | Nippon Sheet Glass Co Ltd | 光学膜 |
JP2006210477A (ja) * | 2005-01-26 | 2006-08-10 | Idemitsu Kosan Co Ltd | 薄膜トランジスタ及びその製造方法並びに薄膜トランジスタ基板及びその製造方法並びに該薄膜トランジスタを用いた液晶表示装置及び有機el表示装置並びに透明導電積層基板 |
WO2008057068A2 (en) | 2005-08-29 | 2008-05-15 | University Of South Florida | Micro-aluminum galvanic cells and methods for constructing the same |
JP5089139B2 (ja) * | 2005-11-15 | 2012-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
CN101667544B (zh) | 2005-11-15 | 2012-09-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
CN109212854B (zh) * | 2018-08-29 | 2021-06-01 | 武汉华星光电技术有限公司 | 一种ltps阵列基板的制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4420504A (en) * | 1980-12-22 | 1983-12-13 | Raytheon Company | Programmable read only memory |
DE3107943A1 (de) * | 1981-03-02 | 1982-09-16 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von loetbaren und temperfaehigen edelmetallfreien duennschichtleiterbahnen |
JPS59198774A (ja) * | 1983-04-26 | 1984-11-10 | Fuji Electric Co Ltd | アモルフアスシリコン太陽電池 |
EP0211402B1 (de) * | 1985-08-02 | 1991-05-08 | General Electric Company | Verfahren und Struktur für dünnfilmtransistorgesteuerte Flüssigkristallmatrixanordnungen |
JPS63289533A (ja) * | 1987-05-22 | 1988-11-28 | Oki Electric Ind Co Ltd | 液晶ディスプレイ装置 |
JP2673460B2 (ja) * | 1990-02-26 | 1997-11-05 | キヤノン株式会社 | 液晶表示素子 |
JPH04326723A (ja) * | 1991-04-26 | 1992-11-16 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及びその製造装置 |
JP3392440B2 (ja) * | 1991-12-09 | 2003-03-31 | 株式会社東芝 | 多層導体層構造デバイス |
-
1993
- 1993-08-26 JP JP21123893A patent/JP3106786B2/ja not_active Expired - Fee Related
-
1994
- 1994-08-25 KR KR1019940021005A patent/KR0171648B1/ko not_active IP Right Cessation
- 1994-08-25 TW TW086203141U patent/TW399741U/zh not_active IP Right Cessation
- 1994-08-26 EP EP94113361A patent/EP0641028B1/de not_active Expired - Lifetime
- 1994-08-26 DE DE69418399T patent/DE69418399T2/de not_active Expired - Fee Related
-
1996
- 1996-04-15 US US08/632,637 patent/US5660971A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW399741U (en) | 2000-07-21 |
JP3106786B2 (ja) | 2000-11-06 |
EP0641028A2 (de) | 1995-03-01 |
KR0171648B1 (ko) | 1999-02-01 |
EP0641028A3 (de) | 1995-09-27 |
DE69418399T2 (de) | 1999-09-30 |
US5660971A (en) | 1997-08-26 |
JPH0766417A (ja) | 1995-03-10 |
KR950007157A (ko) | 1995-03-21 |
EP0641028B1 (de) | 1999-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69124009D1 (de) | Dünnfilmtransistor und Verfahren zur Herstellung | |
DE69626266D1 (de) | Beschlagfreier Film, optischer Gegenstand und Verfahren zur Herstellung | |
DE69528111T2 (de) | Biosensor und Verfahren zur Herstellung desselben | |
DE69515189T2 (de) | SOI-Substrat und Verfahren zur Herstellung | |
DE69328411T2 (de) | Rechteckige Zelle und Verfahren zur Herstellung | |
DE68913444D1 (de) | Dünnfilm-SOI-MOSFET und Verfahren zur Herstellung. | |
DE59401845D1 (de) | Rotor und Verfahren zur Herstellung desselben | |
DE69116934D1 (de) | Schiffsrumpf und Verfahren zur Herstellung | |
DE69635445D1 (de) | Alkalialuminiumhydroxycarbonatzusammensetzung und verfahren zur herstellung | |
DE69525296D1 (de) | Etikettenband und Verfahren zur Herstellung desselben | |
DE69614804T2 (de) | Verbundwerkstoff und Verfahren zur Herstellung desselben | |
DE69407659D1 (de) | RTV-Organopolysiloxanzusammensetzung und Verfahren zur Herstellung | |
DE69220591T2 (de) | Enzymbiosensor und Verfahren zur Herstellung desselben | |
DE69418399D1 (de) | Dünnfilmanordnung und Verfahren zur Herstellung | |
DE69327416D1 (de) | Organischer magnetischer Film und Verfahren zur Herstellung desselben | |
DE69404348D1 (de) | Kathodenvorrichtung und Verfahren zur Herstellung derselben | |
DE69434736D1 (de) | Isolationsstruktur und Verfahren zur Herstellung | |
DE69218501D1 (de) | Dünnfilm-Transistoren und Verfahren zur Herstellung | |
DE69314282T2 (de) | Dünnfilmtransistor und Verfahren zur seiner Herstellung | |
DE69637225D1 (de) | BiCMOS-Bauteil und Verfahren zur Herstellung desselben | |
DE69422230T2 (de) | Oxyd-Supraleiter und Verfahren zur Herstellung | |
DE69605615D1 (de) | Stormbegrenzungsanordnung und Verfahren zur Herstellung | |
DE69124563T2 (de) | Dünnfilm-Transistor und Verfahren zur Herstellung | |
DE69431695D1 (de) | Polymerverbundmaterial und Verfahren zur Herstellung | |
DE69737140D1 (de) | Langmuir-Blodgett Film und Verfahren zur Herstellung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |