DE69417762D1 - Galvanisiervorrichtung - Google Patents

Galvanisiervorrichtung

Info

Publication number
DE69417762D1
DE69417762D1 DE69417762T DE69417762T DE69417762D1 DE 69417762 D1 DE69417762 D1 DE 69417762D1 DE 69417762 T DE69417762 T DE 69417762T DE 69417762 T DE69417762 T DE 69417762T DE 69417762 D1 DE69417762 D1 DE 69417762D1
Authority
DE
Germany
Prior art keywords
workpiece
pct
conveying
endless chain
treatment zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69417762T
Other languages
English (en)
Other versions
DE69417762T2 (de
Inventor
Eric Zwerner
Mariano Aparicio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suntec Trading AG
Original Assignee
Suntec Trading AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suntec Trading AG filed Critical Suntec Trading AG
Publication of DE69417762D1 publication Critical patent/DE69417762D1/de
Application granted granted Critical
Publication of DE69417762T2 publication Critical patent/DE69417762T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Coating With Molten Metal (AREA)
DE69417762T 1993-11-04 1994-11-04 Galvanisiervorrichtung Expired - Fee Related DE69417762T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9322769A GB2283497B (en) 1993-11-04 1993-11-04 Electroplating apparatus
PCT/GB1994/002398 WO1995012696A1 (en) 1993-11-04 1994-11-04 Electroplating apparatus

Publications (2)

Publication Number Publication Date
DE69417762D1 true DE69417762D1 (de) 1999-05-12
DE69417762T2 DE69417762T2 (de) 1999-10-07

Family

ID=10744652

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69417762T Expired - Fee Related DE69417762T2 (de) 1993-11-04 1994-11-04 Galvanisiervorrichtung

Country Status (12)

Country Link
US (1) US5705043A (de)
EP (1) EP0726972B1 (de)
JP (1) JP3461832B2 (de)
KR (1) KR960705963A (de)
CN (1) CN1099475C (de)
AT (1) ATE178664T1 (de)
DE (1) DE69417762T2 (de)
GB (1) GB2283497B (de)
HK (1) HK1014199A1 (de)
MY (1) MY114138A (de)
SG (1) SG49177A1 (de)
WO (1) WO1995012696A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7282240B1 (en) 1998-04-21 2007-10-16 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices
WO2000006806A2 (de) * 1998-07-27 2000-02-10 Siemens Electromechanical Components Gmbh & Co. Kg Vorrichtung zum galvanischen abscheiden und abtragen von metall
AU4365601A (en) 2000-03-17 2001-10-03 Harvard College Cell patterning technique
EP1213091B1 (de) * 2000-07-04 2004-10-06 Schumag Aktiengesellschaft Werkstückhalter für eine Bearbeitungsmaschine und entsprechende Ablängmaschine
JP4330380B2 (ja) * 2003-05-29 2009-09-16 株式会社荏原製作所 めっき装置及びめっき方法
DE102004034078B4 (de) * 2004-07-15 2014-02-13 Robert Bosch Gmbh Verfahren zur Erzeugung einer lokalen Beschichtung
US7655117B2 (en) * 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
DE102005024102A1 (de) * 2005-05-25 2006-11-30 Atotech Deutschland Gmbh Verfahren, Klammer und Vorrichtung zum Transport eines Behandlungsgutes in einer Elektrolyseanlage
US9583125B1 (en) * 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
SG191114A1 (en) * 2010-12-23 2013-07-31 Framatome Connectors Int Plating method and apparatus, and strip obtained by this method
KR101215859B1 (ko) * 2012-06-15 2012-12-31 (주)아이케이텍 리드프레임 스폿 도금장치
JP6024613B2 (ja) * 2013-07-19 2016-11-16 株式会社デンソー 電気めっき装置
TW201508080A (zh) * 2013-08-22 2015-03-01 Diji Tang 一種對連續條料選擇性施鍍的設備
CN110190000B (zh) * 2019-05-27 2020-10-13 山东新恒汇电子科技有限公司 一种引线框架的生产系统
CN112323111B (zh) * 2020-11-02 2021-07-23 昆山一鼎工业科技有限公司 连续端子的电解方法
CN113089068B (zh) * 2021-03-11 2022-09-20 深圳市鸿鑫源实业发展有限公司 连续电镀装置
CN114059134A (zh) * 2021-11-15 2022-02-18 东莞奥美特科技有限公司 高密度多排框架电镀装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4155815A (en) * 1978-04-03 1979-05-22 Francis William L Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals
EP0052125A4 (de) * 1980-05-07 1982-09-03 Kontakta Alkatreszgyar Vorrichtung zum plattieren von bandmaterial.
DE3028635A1 (de) * 1980-07-29 1982-03-04 Degussa Ag, 6000 Frankfurt Vorrichtung zum partiellen galvanischen beschichten
GB2094344B (en) * 1980-12-23 1983-09-07 Owen S G Ltd Improvements in or relating to selective plating
US4425213A (en) * 1982-03-22 1984-01-10 National Semiconductor Corporation Discrete length strip plater
US4582583A (en) * 1984-12-07 1986-04-15 National Semiconductor Corporation Continuous stripe plating apparatus
CH663038A5 (en) * 1985-07-29 1987-11-13 Vanguard S A Cell for selective electrolytic deposition
GB2214930A (en) * 1988-02-11 1989-09-13 Twickenham Plating & Enamellin Mask for use in electriplating on elongate substrate

Also Published As

Publication number Publication date
GB2283497A (en) 1995-05-10
ATE178664T1 (de) 1999-04-15
GB9322769D0 (en) 1993-12-22
EP0726972A1 (de) 1996-08-21
CN1137810A (zh) 1996-12-11
WO1995012696A1 (en) 1995-05-11
GB2283497B (en) 1997-07-30
EP0726972B1 (de) 1999-04-07
JP3461832B2 (ja) 2003-10-27
DE69417762T2 (de) 1999-10-07
SG49177A1 (en) 1998-05-18
US5705043A (en) 1998-01-06
HK1014199A1 (en) 1999-09-24
MY114138A (en) 2002-08-30
KR960705963A (ko) 1996-11-08
JPH09504576A (ja) 1997-05-06
CN1099475C (zh) 2003-01-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8339 Ceased/non-payment of the annual fee