DE69412679T2 - Verfahren und Vorrichtung zur Vorbehandlung eines Herstellungsrahmens für elektronische Komponenten - Google Patents
Verfahren und Vorrichtung zur Vorbehandlung eines Herstellungsrahmens für elektronische KomponentenInfo
- Publication number
- DE69412679T2 DE69412679T2 DE69412679T DE69412679T DE69412679T2 DE 69412679 T2 DE69412679 T2 DE 69412679T2 DE 69412679 T DE69412679 T DE 69412679T DE 69412679 T DE69412679 T DE 69412679T DE 69412679 T2 DE69412679 T2 DE 69412679T2
- Authority
- DE
- Germany
- Prior art keywords
- pretreating
- electronic components
- manufacturing frame
- manufacturing
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6222793 | 1993-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69412679D1 DE69412679D1 (de) | 1998-10-01 |
DE69412679T2 true DE69412679T2 (de) | 1999-05-06 |
Family
ID=13194067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69412679T Expired - Fee Related DE69412679T2 (de) | 1993-03-22 | 1994-03-22 | Verfahren und Vorrichtung zur Vorbehandlung eines Herstellungsrahmens für elektronische Komponenten |
Country Status (5)
Country | Link |
---|---|
US (1) | US5533922A (de) |
EP (1) | EP0618041B1 (de) |
KR (1) | KR940022817A (de) |
CN (1) | CN1034895C (de) |
DE (1) | DE69412679T2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6165819A (en) | 1992-10-20 | 2000-12-26 | Fujitsu Limited | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
WO1995021044A1 (en) * | 1994-02-01 | 1995-08-10 | A.M.D. International Pty. Ltd. | Cutting cores from amorphous material by non corrosive liquids and abrasives |
US5554569A (en) * | 1994-06-06 | 1996-09-10 | Motorola, Inc. | Method and apparatus for improving interfacial adhesion between a polymer and a metal |
US5643057A (en) * | 1995-06-16 | 1997-07-01 | Masonry Processes, Inc. | Method and apparatus for uniformly texturizing objects using abrasive blasting |
US6977909B2 (en) * | 2000-01-19 | 2005-12-20 | Phonepages Of Sweden, Inc. | Method and apparatus for exchange of information in a communication network |
US20070129074A1 (en) * | 2000-01-19 | 2007-06-07 | Bloebaum L S | System, Method and Device For Providing Secondary Information To A Communication Device |
US6996072B1 (en) * | 2000-01-19 | 2006-02-07 | The Phonepages Of Sweden Ab | Method and apparatus for exchange of information in a communication network |
US7248862B2 (en) * | 2000-01-19 | 2007-07-24 | Sony Ericsson Mobile Communications Ab | Method and apparatus for retrieving calling party information in a mobile communications system |
US8400946B2 (en) * | 2000-01-19 | 2013-03-19 | Sony Corporation | System and method for sharing common location-related information between communication devices |
US6922721B1 (en) * | 2000-10-17 | 2005-07-26 | The Phonepages Of Sweden Ab | Exchange of information in a communication system |
US20070127645A1 (en) * | 2000-01-19 | 2007-06-07 | Sony Ericsson Mobile Communications Ab | Technique for providing secondary information to a user equipment |
US20070124481A1 (en) * | 2000-01-19 | 2007-05-31 | Sony Ericsson Mobile Communications Ab | System and method for sharing event-triggered, location-related information between communication devices |
US6419566B1 (en) * | 2000-02-11 | 2002-07-16 | International Business Machines Corporation | System for cleaning contamination from magnetic recording media rows |
SE0102729D0 (sv) * | 2001-08-15 | 2001-08-15 | Phone Pages Sweden Ab | Method and apparatus for exchange of information in a communication network |
US7077724B1 (en) * | 2005-06-06 | 2006-07-18 | The Material Works, Ltd. | Sheet metal scale removing water jet process |
JP4969118B2 (ja) * | 2006-03-15 | 2012-07-04 | 三菱重工業株式会社 | 成形体の前処理方法、接着物品及びその製造方法、並びに塗装物品及びその製造方法 |
TW200820331A (en) * | 2006-10-24 | 2008-05-01 | Kuei-Min Liao | Stripping equipment for destroying circuit on wafer surface |
JP2012192679A (ja) * | 2011-03-17 | 2012-10-11 | Macoho Co Ltd | サポート材除去方法 |
EP3399867B1 (de) | 2016-01-08 | 2019-10-02 | Unilever Plc. | Vorrichtung zur abgabe von eiskonfekt mit partikelmaterial |
US11259542B2 (en) | 2016-01-08 | 2022-03-01 | Conopco, Inc. | Apparatus for delivering frozen confection comprising particulate material |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58157141A (ja) * | 1982-03-13 | 1983-09-19 | Fuji Seiki Seizosho:Kk | リ−ドフレ−ムケ−ス連続送出し装置 |
JPS59115532A (ja) * | 1982-12-23 | 1984-07-04 | Fuji Seiki Seizosho:Kk | リ−ドフレ−ム連続加工装置 |
US4674238A (en) * | 1984-10-03 | 1987-06-23 | Fuji Seiki Machine Works, Ltd. | Lead frame handling apparatus for blasting machine |
JPH02148820A (ja) * | 1988-11-30 | 1990-06-07 | Hitachi Condenser Co Ltd | モールド型電子部品の製造方法 |
JP2890599B2 (ja) * | 1990-02-06 | 1999-05-17 | ソニー株式会社 | 加工方法 |
JPH05212730A (ja) * | 1992-02-03 | 1993-08-24 | Eikichi Yamaharu | リードフレーム上に形成された樹脂モールド部のバリ取り装置 |
JP2945911B2 (ja) * | 1992-02-12 | 1999-09-06 | 澁谷工業株式会社 | リードフレーム上に形成された樹脂モールド部のバリ取り装置 |
-
1994
- 1994-03-18 US US08/214,698 patent/US5533922A/en not_active Expired - Fee Related
- 1994-03-22 EP EP94302034A patent/EP0618041B1/de not_active Expired - Lifetime
- 1994-03-22 DE DE69412679T patent/DE69412679T2/de not_active Expired - Fee Related
- 1994-03-22 KR KR1019940005807A patent/KR940022817A/ko not_active Application Discontinuation
- 1994-03-22 CN CN94104893A patent/CN1034895C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69412679D1 (de) | 1998-10-01 |
US5533922A (en) | 1996-07-09 |
CN1093492A (zh) | 1994-10-12 |
KR940022817A (ko) | 1994-10-21 |
EP0618041B1 (de) | 1998-08-26 |
CN1034895C (zh) | 1997-05-14 |
EP0618041A1 (de) | 1994-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SHIBUYA KOGYO CO., LTD., KANAZAWA, ISHIKAWA, JP |
|
8381 | Inventor (new situation) |
Free format text: YAMAHARU, EIKICHI, HIRAKATA, OSAKA, JP |
|
8339 | Ceased/non-payment of the annual fee |