DE69409795T2 - Rückstandsarmes, von flüchtigen organischen verbindungen freies und keine reinigung erforderndes flussmittel sowie verfahren zu dessen verwendung - Google Patents
Rückstandsarmes, von flüchtigen organischen verbindungen freies und keine reinigung erforderndes flussmittel sowie verfahren zu dessen verwendungInfo
- Publication number
- DE69409795T2 DE69409795T2 DE69409795T DE69409795T DE69409795T2 DE 69409795 T2 DE69409795 T2 DE 69409795T2 DE 69409795 T DE69409795 T DE 69409795T DE 69409795 T DE69409795 T DE 69409795T DE 69409795 T2 DE69409795 T2 DE 69409795T2
- Authority
- DE
- Germany
- Prior art keywords
- soldering
- flux
- flux solution
- weight
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000004140 cleaning Methods 0.000 title claims description 6
- 239000012855 volatile organic compound Substances 0.000 title description 9
- 239000012530 fluid Substances 0.000 title 1
- 230000004907 flux Effects 0.000 claims description 196
- 238000005476 soldering Methods 0.000 claims description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 43
- 239000002904 solvent Substances 0.000 claims description 35
- 239000006260 foam Substances 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 27
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 17
- 239000002736 nonionic surfactant Substances 0.000 claims description 17
- 239000006184 cosolvent Substances 0.000 claims description 15
- 239000003960 organic solvent Substances 0.000 claims description 13
- 150000002763 monocarboxylic acids Chemical class 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000004094 surface-active agent Substances 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 239000003112 inhibitor Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 description 25
- 150000007513 acids Chemical class 0.000 description 21
- 238000012360 testing method Methods 0.000 description 21
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 14
- -1 citric acid Chemical class 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 12
- 150000001261 hydroxy acids Chemical class 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 239000008367 deionised water Substances 0.000 description 10
- 229910021641 deionized water Inorganic materials 0.000 description 10
- 238000005187 foaming Methods 0.000 description 10
- 238000001704 evaporation Methods 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 9
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000001361 adipic acid Substances 0.000 description 6
- 235000011037 adipic acid Nutrition 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000009736 wetting Methods 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000004088 foaming agent Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 150000007524 organic acids Chemical class 0.000 description 5
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N Heptanedioic acid Natural products OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Nonanedioid acid Natural products OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 238000005273 aeration Methods 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000001384 succinic acid Substances 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- WLJVXDMOQOGPHL-UHFFFAOYSA-N phenylacetic acid Chemical compound OC(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-N 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- ARIWANIATODDMH-AWEZNQCLSA-N 1-lauroyl-sn-glycerol Chemical compound CCCCCCCCCCCC(=O)OC[C@@H](O)CO ARIWANIATODDMH-AWEZNQCLSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- ARIWANIATODDMH-UHFFFAOYSA-N Lauric acid monoglyceride Natural products CCCCCCCCCCCC(=O)OCC(O)CO ARIWANIATODDMH-UHFFFAOYSA-N 0.000 description 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Natural products OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N Suberic acid Natural products OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229960004050 aminobenzoic acid Drugs 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005115 demineralization Methods 0.000 description 2
- 238000000502 dialysis Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000006552 photochemical reaction Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- HFVMEOPYDLEHBR-UHFFFAOYSA-N (2-fluorophenyl)-phenylmethanol Chemical compound C=1C=CC=C(F)C=1C(O)C1=CC=CC=C1 HFVMEOPYDLEHBR-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- QXQAPNSHUJORMC-UHFFFAOYSA-N 1-chloro-4-propylbenzene Chemical compound CCCC1=CC=C(Cl)C=C1 QXQAPNSHUJORMC-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- XSZBRHHUQAOBTR-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propyl acetate Chemical compound COC(C)COC(C)COC(C)COC(C)=O XSZBRHHUQAOBTR-UHFFFAOYSA-N 0.000 description 1
- WHFKYDMBUMLWDA-UHFFFAOYSA-N 2-phenoxyethyl acetate Chemical compound CC(=O)OCCOC1=CC=CC=C1 WHFKYDMBUMLWDA-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- WXBLLCUINBKULX-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1 WXBLLCUINBKULX-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- WZHCOOQXZCIUNC-UHFFFAOYSA-N cyclandelate Chemical compound C1C(C)(C)CC(C)CC1OC(=O)C(O)C1=CC=CC=C1 WZHCOOQXZCIUNC-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002311 glutaric acids Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- UYDLBVPAAFVANX-UHFFFAOYSA-N octylphenoxy polyethoxyethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCO)C=C1 UYDLBVPAAFVANX-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229960003424 phenylacetic acid Drugs 0.000 description 1
- 239000003279 phenylacetic acid Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000008237 rinsing water Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000005437 stratosphere Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Solid Fuels And Fuel-Associated Substances (AREA)
- Nonmetallic Welding Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08014201 US5334260B1 (en) | 1993-02-05 | 1993-02-05 | No-clean, low-residue, volatile organic conpound free soldering flux and method of use |
| US08/014,203 US5281281A (en) | 1993-02-05 | 1993-02-05 | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
| PCT/US1994/000942 WO1994017950A1 (en) | 1993-02-05 | 1994-02-04 | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69409795D1 DE69409795D1 (de) | 1998-05-28 |
| DE69409795T2 true DE69409795T2 (de) | 1998-12-03 |
Family
ID=26685791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69409795T Expired - Fee Related DE69409795T2 (de) | 1993-02-05 | 1994-02-04 | Rückstandsarmes, von flüchtigen organischen verbindungen freies und keine reinigung erforderndes flussmittel sowie verfahren zu dessen verwendung |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0686073B1 (enExample) |
| JP (1) | JP3368502B2 (enExample) |
| KR (1) | KR100324084B1 (enExample) |
| CA (1) | CA2154782C (enExample) |
| DE (1) | DE69409795T2 (enExample) |
| ES (1) | ES2117261T3 (enExample) |
| MX (1) | MX9400876A (enExample) |
| TW (1) | TW282427B (enExample) |
| WO (1) | WO1994017950A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10117404A1 (de) * | 2001-04-06 | 2002-10-17 | Paff Stannol Loetmittel | Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6524398B2 (en) * | 2000-04-13 | 2003-02-25 | Fry's Metals, Inc. | Low-residue, low-solder-ball flux |
| US20030221748A1 (en) * | 2002-05-30 | 2003-12-04 | Fry's Metals, Inc. | Solder paste flux system |
| KR101621091B1 (ko) * | 2009-05-25 | 2016-05-16 | 동우 화인켐 주식회사 | 땜납용 플럭스 조성물 |
| HUE039370T2 (hu) * | 2010-03-15 | 2018-12-28 | Dowa Electronics Materials Co Ltd | Kötõanyag és rögzítési eljárás annak használatával |
| CN104985354A (zh) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | 无铅焊料助焊剂及其制备方法 |
| CN106112313A (zh) * | 2016-08-05 | 2016-11-16 | 雷春生 | 一种环保型电子基板焊接剂的制备方法 |
| CN108274159A (zh) * | 2018-02-07 | 2018-07-13 | 合肥安力电力工程有限公司 | 一种电路焊接用环保助焊剂及其制备方法 |
| TWI784839B (zh) * | 2021-12-15 | 2022-11-21 | 廣化科技股份有限公司 | 甲酸焊接製程方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3424625A (en) * | 1965-11-09 | 1969-01-28 | Ernest G Tiegel | Process for welding lead onto lead utilizing a special flux composition |
| US3723191A (en) * | 1971-03-09 | 1973-03-27 | Philips Corp | Soldering flux composition |
| US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
| US4601763A (en) * | 1984-10-11 | 1986-07-22 | Lgz Landis & Gyr Zug Ag | Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent |
| US4708751A (en) * | 1984-12-14 | 1987-11-24 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free foam fluxes |
| JPS6457999A (en) * | 1987-08-26 | 1989-03-06 | Shikoku Chem | Water soluble flux for soldering |
| US5004509A (en) * | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
| US5190208A (en) * | 1990-05-15 | 1993-03-02 | Hughes Aircraft Company | Foaming flux for automatic soldering process |
| US5085365B1 (en) * | 1990-05-15 | 1995-08-08 | Hughes Aircraft Co | Water soluble soldering flux |
| US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
| US5281281A (en) * | 1993-02-05 | 1994-01-25 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
-
1994
- 1994-02-03 TW TW083100897A patent/TW282427B/zh active
- 1994-02-03 MX MX9400876A patent/MX9400876A/es not_active IP Right Cessation
- 1994-02-04 WO PCT/US1994/000942 patent/WO1994017950A1/en not_active Ceased
- 1994-02-04 JP JP51809794A patent/JP3368502B2/ja not_active Expired - Fee Related
- 1994-02-04 ES ES94909498T patent/ES2117261T3/es not_active Expired - Lifetime
- 1994-02-04 EP EP94909498A patent/EP0686073B1/en not_active Expired - Lifetime
- 1994-02-04 DE DE69409795T patent/DE69409795T2/de not_active Expired - Fee Related
- 1994-02-04 CA CA002154782A patent/CA2154782C/en not_active Expired - Fee Related
- 1994-04-02 KR KR1019950703256A patent/KR100324084B1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10117404A1 (de) * | 2001-04-06 | 2002-10-17 | Paff Stannol Loetmittel | Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0686073A4 (en) | 1996-04-24 |
| CA2154782A1 (en) | 1994-08-18 |
| DE69409795D1 (de) | 1998-05-28 |
| WO1994017950A1 (en) | 1994-08-18 |
| MX9400876A (es) | 1994-08-31 |
| JP3368502B2 (ja) | 2003-01-20 |
| ES2117261T3 (es) | 1998-08-01 |
| KR100324084B1 (ko) | 2002-07-03 |
| JPH08506528A (ja) | 1996-07-16 |
| EP0686073A1 (en) | 1995-12-13 |
| CA2154782C (en) | 2003-08-19 |
| TW282427B (enExample) | 1996-08-01 |
| EP0686073B1 (en) | 1998-04-22 |
| KR960700854A (ko) | 1996-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2820656C3 (de) | Lötflußmittel und dessen Anwendung | |
| DE69323321T2 (de) | Flussmittel ohne reinigungsmittel und dessen verwendung | |
| US5334260A (en) | No-clean, low-residue, volatile organic compound free soldering flux and method of use | |
| DE2247398C2 (de) | Verfahren zum Reinigen von Gegenständen | |
| US4495007A (en) | Soldering flux | |
| DE69114930T2 (de) | Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten. | |
| DE69519148T2 (de) | Flussmittelzusammensetzung | |
| US5281281A (en) | No-clean, low-residue, volatile organic compound free soldering flux and method of use | |
| DE69409795T2 (de) | Rückstandsarmes, von flüchtigen organischen verbindungen freies und keine reinigung erforderndes flussmittel sowie verfahren zu dessen verwendung | |
| US4194931A (en) | Soldering flux | |
| EP0595881B1 (de) | Verwendung von halogenkohlenwasserstoff-freien reinigungsmitteln zur fluxentfernung von elektronischen und elektrischen baugruppen | |
| US4561913A (en) | Soldering flux additive | |
| US4523712A (en) | Soldering composition and method of soldering therewith | |
| US3305406A (en) | Method of fluxing an article to be soldered with noncorrosive fluxing compositions | |
| DE69025594T2 (de) | Nichttoxische, nichtentflammbare reiniger zum reinigen von gedruckten schaltungen | |
| DE69033413T2 (de) | Mittel zur Behandlung von Metalloberflächen | |
| DE69127226T2 (de) | Wasserlöslisches Weichlötflussmittel | |
| DE69229321T2 (de) | Schäumendes Flussmittel für automatisches Lötverfahren | |
| US5452840A (en) | Water-soluble soldering flux | |
| DE69231958T2 (de) | Schäumendes Flussmittel für automatisches Lötverfahren | |
| DE4216414C2 (de) | Prozeßflüssigkeit für das Vorverzinnen und Löten | |
| DE4130494A1 (de) | Reinigungsfluessigkeit | |
| DE102023124887A1 (de) | Flussmittel-Zusammensetzung, Lötmittel-Zusammensetzung und elektronische Leiterplatte | |
| DE69201028T2 (de) | Reinigungsmittel. | |
| DE2238874C3 (de) | Verfahren zum Löten und Flußmittel zur Durchfuhrung dieses Verfahrens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8363 | Opposition against the patent | ||
| 8365 | Fully valid after opposition proceedings | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: LITTON SYSTEMS, INC., LOS ANGELES, CALIF., US |
|
| 8381 | Inventor (new situation) |
Inventor name: STEFANOWSKI, KRYSTANA, MT.PROSPECT, III., US |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: KAC HOLDINGS, INC., DES PLAINES, ILL., US |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: KESTER, INC. (N.D.GES.D. STAATES DELAWARE), DE, US |
|
| 8339 | Ceased/non-payment of the annual fee |