ES2117261T3 - Fundente de soldadura libre de compuestos organicos volatiles, de bajo residuo, sin necesidad de limpieza y procedimiento de utilizacion. - Google Patents
Fundente de soldadura libre de compuestos organicos volatiles, de bajo residuo, sin necesidad de limpieza y procedimiento de utilizacion.Info
- Publication number
- ES2117261T3 ES2117261T3 ES94909498T ES94909498T ES2117261T3 ES 2117261 T3 ES2117261 T3 ES 2117261T3 ES 94909498 T ES94909498 T ES 94909498T ES 94909498 T ES94909498 T ES 94909498T ES 2117261 T3 ES2117261 T3 ES 2117261T3
- Authority
- ES
- Spain
- Prior art keywords
- weight
- volatile organic
- around
- cleaning
- need
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
- Solid Fuels And Fuel-Associated Substances (AREA)
Abstract
SE DESCRIBEN FUNDENTES PARA SOLDAR NO LAVABLES Y METODOS DE UTILIZACION DE LOS MISMOS. LOS FUNDENTES CONTIENEN DESDE ALREDEDOR DEL 1 % A ALREDEDOR DEL 4 % DE PESO DE AGENTES FUNDENTES. ESTAN PRESENTES AL MENOS DOS AGENTES FUNDENTES SELECCIONADOS DE ACIDOS MONOCARBOXILICO, DICARBOXILICO Y/O HIDROXI. SE INCORPORA SURFACTANTE NO IONICO EN LOS FUNDENTES EN UNA CANTIDAD MENOR DE ALREDEDOR DEL 1 % DE PESO. EL SISTEMA DISOLVENTE PUEDE SER AGUA DESMINERALIZADA SIN OTROS CODISOLVENTES O UN SISTEMA CODISOLVENTE COMPRENDIDO POR (I) AL MENOS ALREDEDOR DEL 90 % DE PESO DE AGUA DESMINERALIZADA BASADA EN EL PESO TOTAL DE LA SOLUCION DEL FUNDENTE PARA SOLDAR Y (II) DESDE ALREDEDOR DEL 1 % DE PESO A ALREDEDOR DEL 5 % DE PESO BASADO EN EL PESO TOTAL DE LA SOLUCION DE FUNDENTE PARA SOLDAR DE UN DISOLVENTE ORGANICO NO VOLATIL QUE FORMA UN CODISOLVENTE CON DICHA AGUA DESMINERALIZADA, DICHO DISOLVENTE ORGANICO NO VOLATIL TENIENDO UN PUNTO DE EBULLICION POR ENCIMA DE ALREDEDOR DE LOS 190 (GRADOS) C Y UNA PRESIONDE VAPOR POR DEBAJO DE 0,1 MILIMETROS HG A 25 (GRADOS) C.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08014201 US5334260B1 (en) | 1993-02-05 | 1993-02-05 | No-clean, low-residue, volatile organic conpound free soldering flux and method of use |
US08/014,203 US5281281A (en) | 1993-02-05 | 1993-02-05 | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2117261T3 true ES2117261T3 (es) | 1998-08-01 |
Family
ID=26685791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES94909498T Expired - Lifetime ES2117261T3 (es) | 1993-02-05 | 1994-02-04 | Fundente de soldadura libre de compuestos organicos volatiles, de bajo residuo, sin necesidad de limpieza y procedimiento de utilizacion. |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0686073B1 (es) |
JP (1) | JP3368502B2 (es) |
KR (1) | KR100324084B1 (es) |
CA (1) | CA2154782C (es) |
DE (1) | DE69409795T2 (es) |
ES (1) | ES2117261T3 (es) |
MX (1) | MX9400876A (es) |
TW (1) | TW282427B (es) |
WO (1) | WO1994017950A1 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6524398B2 (en) * | 2000-04-13 | 2003-02-25 | Fry's Metals, Inc. | Low-residue, low-solder-ball flux |
DE10117404A1 (de) * | 2001-04-06 | 2002-10-17 | Paff Stannol Loetmittel | Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten |
US20030221748A1 (en) * | 2002-05-30 | 2003-12-04 | Fry's Metals, Inc. | Solder paste flux system |
KR101621091B1 (ko) * | 2009-05-25 | 2016-05-16 | 동우 화인켐 주식회사 | 땜납용 플럭스 조성물 |
WO2011114543A1 (ja) * | 2010-03-15 | 2011-09-22 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
CN104985354A (zh) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | 无铅焊料助焊剂及其制备方法 |
CN106112313A (zh) * | 2016-08-05 | 2016-11-16 | 雷春生 | 一种环保型电子基板焊接剂的制备方法 |
CN108274159A (zh) * | 2018-02-07 | 2018-07-13 | 合肥安力电力工程有限公司 | 一种电路焊接用环保助焊剂及其制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3424625A (en) * | 1965-11-09 | 1969-01-28 | Ernest G Tiegel | Process for welding lead onto lead utilizing a special flux composition |
US3723191A (en) * | 1971-03-09 | 1973-03-27 | Philips Corp | Soldering flux composition |
US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
US4601763A (en) * | 1984-10-11 | 1986-07-22 | Lgz Landis & Gyr Zug Ag | Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent |
US4708751A (en) * | 1984-12-14 | 1987-11-24 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free foam fluxes |
JPS6457999A (en) * | 1987-08-26 | 1989-03-06 | Shikoku Chem | Water soluble flux for soldering |
US5004509A (en) * | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
US5085365B1 (en) * | 1990-05-15 | 1995-08-08 | Hughes Aircraft Co | Water soluble soldering flux |
US5190208A (en) * | 1990-05-15 | 1993-03-02 | Hughes Aircraft Company | Foaming flux for automatic soldering process |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
US5281281A (en) * | 1993-02-05 | 1994-01-25 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
-
1994
- 1994-02-03 TW TW083100897A patent/TW282427B/zh active
- 1994-02-03 MX MX9400876A patent/MX9400876A/es not_active IP Right Cessation
- 1994-02-04 ES ES94909498T patent/ES2117261T3/es not_active Expired - Lifetime
- 1994-02-04 EP EP94909498A patent/EP0686073B1/en not_active Expired - Lifetime
- 1994-02-04 CA CA002154782A patent/CA2154782C/en not_active Expired - Fee Related
- 1994-02-04 DE DE69409795T patent/DE69409795T2/de not_active Expired - Fee Related
- 1994-02-04 JP JP51809794A patent/JP3368502B2/ja not_active Expired - Fee Related
- 1994-02-04 WO PCT/US1994/000942 patent/WO1994017950A1/en active IP Right Grant
- 1994-04-02 KR KR1019950703256A patent/KR100324084B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2154782A1 (en) | 1994-08-18 |
JP3368502B2 (ja) | 2003-01-20 |
DE69409795D1 (de) | 1998-05-28 |
EP0686073A1 (en) | 1995-12-13 |
EP0686073B1 (en) | 1998-04-22 |
TW282427B (es) | 1996-08-01 |
DE69409795T2 (de) | 1998-12-03 |
EP0686073A4 (en) | 1996-04-24 |
MX9400876A (es) | 1994-08-31 |
KR100324084B1 (ko) | 2002-07-03 |
CA2154782C (en) | 2003-08-19 |
KR960700854A (ko) | 1996-02-24 |
WO1994017950A1 (en) | 1994-08-18 |
JPH08506528A (ja) | 1996-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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