KR100324084B1 - 잔유물이적고휘발성유기화합물이없는납땜용융제및제조방법 - Google Patents

잔유물이적고휘발성유기화합물이없는납땜용융제및제조방법 Download PDF

Info

Publication number
KR100324084B1
KR100324084B1 KR1019950703256A KR19950703256A KR100324084B1 KR 100324084 B1 KR100324084 B1 KR 100324084B1 KR 1019950703256 A KR1019950703256 A KR 1019950703256A KR 19950703256 A KR19950703256 A KR 19950703256A KR 100324084 B1 KR100324084 B1 KR 100324084B1
Authority
KR
South Korea
Prior art keywords
soldering
melt
solvent
weight
bubble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950703256A
Other languages
English (en)
Korean (ko)
Other versions
KR960700854A (ko
Inventor
크리스티나 스테파노프스키
Original Assignee
크리스티나 스테파노프스키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26685791&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100324084(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08014201 external-priority patent/US5334260B1/en
Priority claimed from US08/014,203 external-priority patent/US5281281A/en
Application filed by 크리스티나 스테파노프스키 filed Critical 크리스티나 스테파노프스키
Publication of KR960700854A publication Critical patent/KR960700854A/ko
Application granted granted Critical
Publication of KR100324084B1 publication Critical patent/KR100324084B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Solid Fuels And Fuel-Associated Substances (AREA)
KR1019950703256A 1993-02-05 1994-04-02 잔유물이적고휘발성유기화합물이없는납땜용융제및제조방법 Expired - Fee Related KR100324084B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US08/014,203 1993-02-05
US08/014203 1993-02-05
US08/014201 1993-02-05
US08014201 US5334260B1 (en) 1993-02-05 1993-02-05 No-clean, low-residue, volatile organic conpound free soldering flux and method of use
US08/014,203 US5281281A (en) 1993-02-05 1993-02-05 No-clean, low-residue, volatile organic compound free soldering flux and method of use
US08/014,201 1993-02-05
PCT/US1994/000942 WO1994017950A1 (en) 1993-02-05 1994-02-04 No-clean, low-residue, volatile organic compound free soldering flux and method of use

Publications (2)

Publication Number Publication Date
KR960700854A KR960700854A (ko) 1996-02-24
KR100324084B1 true KR100324084B1 (ko) 2002-07-03

Family

ID=26685791

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950703256A Expired - Fee Related KR100324084B1 (ko) 1993-02-05 1994-04-02 잔유물이적고휘발성유기화합물이없는납땜용융제및제조방법

Country Status (9)

Country Link
EP (1) EP0686073B1 (enExample)
JP (1) JP3368502B2 (enExample)
KR (1) KR100324084B1 (enExample)
CA (1) CA2154782C (enExample)
DE (1) DE69409795T2 (enExample)
ES (1) ES2117261T3 (enExample)
MX (1) MX9400876A (enExample)
TW (1) TW282427B (enExample)
WO (1) WO1994017950A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101621091B1 (ko) * 2009-05-25 2016-05-16 동우 화인켐 주식회사 땜납용 플럭스 조성물

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6524398B2 (en) * 2000-04-13 2003-02-25 Fry's Metals, Inc. Low-residue, low-solder-ball flux
DE10117404A1 (de) * 2001-04-06 2002-10-17 Paff Stannol Loetmittel Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten
US20030221748A1 (en) * 2002-05-30 2003-12-04 Fry's Metals, Inc. Solder paste flux system
HUE039370T2 (hu) * 2010-03-15 2018-12-28 Dowa Electronics Materials Co Ltd Kötõanyag és rögzítési eljárás annak használatával
CN104985354A (zh) * 2015-07-01 2015-10-21 芜湖市爱德运输机械有限公司 无铅焊料助焊剂及其制备方法
CN106112313A (zh) * 2016-08-05 2016-11-16 雷春生 一种环保型电子基板焊接剂的制备方法
CN108274159A (zh) * 2018-02-07 2018-07-13 合肥安力电力工程有限公司 一种电路焊接用环保助焊剂及其制备方法
TWI784839B (zh) * 2021-12-15 2022-11-21 廣化科技股份有限公司 甲酸焊接製程方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3424625A (en) * 1965-11-09 1969-01-28 Ernest G Tiegel Process for welding lead onto lead utilizing a special flux composition
US3723191A (en) * 1971-03-09 1973-03-27 Philips Corp Soldering flux composition
US4478650A (en) * 1983-10-19 1984-10-23 At&T Technologies, Inc. Water soluble flux
US4601763A (en) * 1984-10-11 1986-07-22 Lgz Landis & Gyr Zug Ag Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent
US4708751A (en) * 1984-12-14 1987-11-24 Alpha Grillo-Lotsysteme Gmbh Halogen-free foam fluxes
JPS6457999A (en) * 1987-08-26 1989-03-06 Shikoku Chem Water soluble flux for soldering
US5004509A (en) * 1990-05-04 1991-04-02 Delco Electronics Corporation Low residue soldering flux
US5190208A (en) * 1990-05-15 1993-03-02 Hughes Aircraft Company Foaming flux for automatic soldering process
US5085365B1 (en) * 1990-05-15 1995-08-08 Hughes Aircraft Co Water soluble soldering flux
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
US5281281A (en) * 1993-02-05 1994-01-25 Litton Systems, Inc. No-clean, low-residue, volatile organic compound free soldering flux and method of use

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101621091B1 (ko) * 2009-05-25 2016-05-16 동우 화인켐 주식회사 땜납용 플럭스 조성물

Also Published As

Publication number Publication date
EP0686073A4 (en) 1996-04-24
CA2154782A1 (en) 1994-08-18
DE69409795D1 (de) 1998-05-28
WO1994017950A1 (en) 1994-08-18
MX9400876A (es) 1994-08-31
JP3368502B2 (ja) 2003-01-20
ES2117261T3 (es) 1998-08-01
DE69409795T2 (de) 1998-12-03
JPH08506528A (ja) 1996-07-16
EP0686073A1 (en) 1995-12-13
CA2154782C (en) 2003-08-19
TW282427B (enExample) 1996-08-01
EP0686073B1 (en) 1998-04-22
KR960700854A (ko) 1996-02-24

Similar Documents

Publication Publication Date Title
US5334260A (en) No-clean, low-residue, volatile organic compound free soldering flux and method of use
EP0668808B1 (en) No-clean soldering flux and method using the same
EP0183705B1 (en) Soldering flux
KR100786593B1 (ko) 양이온성 계면활성제를 가진 납땜 용제 및 이를 이용한 땜납의 도포를 위한 기판 표면의 제조 방법
US4168996A (en) Soldering flux
US5571340A (en) Rosin-free, low VOC, no-clean soldering flux and method using the same
US5281281A (en) No-clean, low-residue, volatile organic compound free soldering flux and method of use
US6599372B2 (en) Soldering flux
CA2022625A1 (en) Cleaning composition of dibasic ester, hydrocarbon solvent, compatibilizing surfactant and water
EP0710522B1 (en) Flux formulation
US4561913A (en) Soldering flux additive
KR100324084B1 (ko) 잔유물이적고휘발성유기화합물이없는납땜용융제및제조방법
US4194931A (en) Soldering flux
US4523712A (en) Soldering composition and method of soldering therewith
JP4186184B2 (ja) 回路基板はんだ付用フラックス及びソルダーペースト
EP0538821B1 (en) Foaming flux for automatic soldering process
EP0549616A1 (en) METHOD FOR CLEANING PRINTED CIRCUIT BOARDS USING WATER.
EP0538822B1 (en) Foaming flux for automatic soldering process
JPH0857685A (ja) はんだ付け用フラックス
KR20250139227A (ko) 플럭스 조성물, 땜납 조성물, 및 전자기판
JP2025141814A (ja) フラックス組成物、はんだ組成物、および電子基板
KR20250139228A (ko) 플럭스 조성물, 땜납 조성물, 및 전자기판
JP2024139686A (ja) フラックス組成物、およびはんだ組成物、並びに、電子基板の製造方法
HK1008311B (en) No-clean soldering flux and method using the same

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20080129

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20090130

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20090130