DE69328220D1 - Verfahren zur Herstellung einer Phasenschiebermaske oder eines Phasenschiebermasken-Rohlings - Google Patents

Verfahren zur Herstellung einer Phasenschiebermaske oder eines Phasenschiebermasken-Rohlings

Info

Publication number
DE69328220D1
DE69328220D1 DE69328220T DE69328220T DE69328220D1 DE 69328220 D1 DE69328220 D1 DE 69328220D1 DE 69328220 T DE69328220 T DE 69328220T DE 69328220 T DE69328220 T DE 69328220T DE 69328220 D1 DE69328220 D1 DE 69328220D1
Authority
DE
Germany
Prior art keywords
phase shift
shift mask
production
mask blank
blank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69328220T
Other languages
English (en)
Other versions
DE69328220T2 (de
Inventor
Norihiro Tarumoto
Hiroyuki Miyashita
Yukio Iimura
Koichi Mikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23373192A external-priority patent/JPH0683028A/ja
Priority claimed from JP28115492A external-priority patent/JPH06110196A/ja
Priority claimed from JP28115392A external-priority patent/JP3234995B2/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of DE69328220D1 publication Critical patent/DE69328220D1/de
Application granted granted Critical
Publication of DE69328220T2 publication Critical patent/DE69328220T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/29—Rim PSM or outrigger PSM; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
DE69328220T 1992-09-01 1993-08-31 Verfahren zur Herstellung einer Phasenschiebermaske oder eines Phasenschiebermasken-Rohlings Expired - Fee Related DE69328220T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23373192A JPH0683028A (ja) 1992-09-01 1992-09-01 位相シフトフォトマスクブランク、その製造方法及び位相シフトフォトマスク
JP28115492A JPH06110196A (ja) 1992-09-28 1992-09-28 位相シフトマスクブランク及び位相シフトマスクの製造方法
JP28115392A JP3234995B2 (ja) 1992-09-28 1992-09-28 位相シフトマスクブランクと位相シフトマスクブランクの製造方法、及び位相シフトマスクの製造方法

Publications (2)

Publication Number Publication Date
DE69328220D1 true DE69328220D1 (de) 2000-05-04
DE69328220T2 DE69328220T2 (de) 2000-08-24

Family

ID=27332034

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69328220T Expired - Fee Related DE69328220T2 (de) 1992-09-01 1993-08-31 Verfahren zur Herstellung einer Phasenschiebermaske oder eines Phasenschiebermasken-Rohlings

Country Status (4)

Country Link
US (1) US5702847A (de)
EP (1) EP0585872B1 (de)
KR (1) KR100298610B1 (de)
DE (1) DE69328220T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100555447B1 (ko) * 1998-02-17 2006-04-21 삼성전자주식회사 하프톤 위상반전 마스크 및 그 제조방법
US6242136B1 (en) 1999-02-12 2001-06-05 Corning Incorporated Vacuum ultraviolet transmitting silicon oxyfluoride lithography glass
US6265115B1 (en) 1999-03-15 2001-07-24 Corning Incorporated Projection lithography photomask blanks, preforms and methods of making
US6782716B2 (en) * 1999-02-12 2004-08-31 Corning Incorporated Vacuum ultraviolet transmitting silicon oxyfluoride lithography glass
US6682859B2 (en) * 1999-02-12 2004-01-27 Corning Incorporated Vacuum ultraviolet trasmitting silicon oxyfluoride lithography glass
US6783898B2 (en) 1999-02-12 2004-08-31 Corning Incorporated Projection lithography photomask blanks, preforms and method of making
US6319634B1 (en) 1999-03-12 2001-11-20 Corning Incorporated Projection lithography photomasks and methods of making
US6261725B1 (en) 1999-10-28 2001-07-17 Taiwan Semiconductor Manufacturing Company Phase angle modulation of PSM by chemical treatment method
US6428938B1 (en) 2000-06-19 2002-08-06 Taiwan Semiconductor Manufacturing Company Phase-shift mask for printing high-resolution images and a method of fabrication
US6503666B1 (en) 2000-07-05 2003-01-07 Numerical Technologies, Inc. Phase shift masking for complex patterns
US6524752B1 (en) 2000-07-05 2003-02-25 Numerical Technologies, Inc. Phase shift masking for intersecting lines
US6777141B2 (en) 2000-07-05 2004-08-17 Numerical Technologies, Inc. Phase shift mask including sub-resolution assist features for isolated spaces
US6541165B1 (en) 2000-07-05 2003-04-01 Numerical Technologies, Inc. Phase shift mask sub-resolution assist features
ATE502321T1 (de) 2000-07-05 2011-04-15 Synopsys Inc Verfahren zum entwerfen einer phasenschiebermaske für komplexe muster
US6787271B2 (en) * 2000-07-05 2004-09-07 Numerical Technologies, Inc. Design and layout of phase shifting photolithographic masks
US6551750B2 (en) 2001-03-16 2003-04-22 Numerical Technologies, Inc. Self-aligned fabrication technique for tri-tone attenuated phase-shifting masks
US6635393B2 (en) 2001-03-23 2003-10-21 Numerical Technologies, Inc. Blank for alternating PSM photomask with charge dissipation layer
US7086291B2 (en) * 2004-04-29 2006-08-08 International Business Machines Corporation Overstress indication
KR100745065B1 (ko) * 2004-12-27 2007-08-01 주식회사 하이닉스반도체 위상반전 마스크의 성장성 이물질 제거방법
US9005848B2 (en) * 2008-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same
TWI476507B (zh) * 2008-09-30 2015-03-11 Hoya Corp A mask substrate, a mask, a manufacturing method thereof, and a method of manufacturing the semiconductor element
US20100187609A1 (en) 2009-01-27 2010-07-29 Synopsys, Inc. Boosting transistor performance with non-rectangular channels
US9005849B2 (en) * 2009-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same
WO2015048400A1 (en) 2013-09-26 2015-04-02 Synopsys, Inc. Estimation of effective channel length for finfets and nano-wires
US9836563B2 (en) 2013-09-26 2017-12-05 Synopsys, Inc. Iterative simulation with DFT and non-DFT
US10402520B2 (en) 2013-09-26 2019-09-03 Synopsys, Inc. First principles design automation tool
US10489212B2 (en) 2013-09-26 2019-11-26 Synopsys, Inc. Adaptive parallelization for multi-scale simulation
US10516725B2 (en) 2013-09-26 2019-12-24 Synopsys, Inc. Characterizing target material properties based on properties of similar materials
WO2015048437A1 (en) 2013-09-26 2015-04-02 Synopsys, Inc. Mapping intermediate material properties to target properties to screen materials
US10734097B2 (en) 2015-10-30 2020-08-04 Synopsys, Inc. Atomic structure optimization
US10078735B2 (en) 2015-10-30 2018-09-18 Synopsys, Inc. Atomic structure optimization
US10685163B2 (en) 2017-03-01 2020-06-16 Synopsys, Inc. Computationally efficient nano-scale conductor resistance model
CN113641078A (zh) * 2021-08-12 2021-11-12 深圳市龙图光电有限公司 凹槽掩模版的制作方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3986876A (en) * 1974-05-24 1976-10-19 The United States Of America As Represented By The Secretary Of The Navy Method for making a mask having a sloped relief
US4057777A (en) * 1975-11-19 1977-11-08 Trw Inc. Termination for electrical resistor and method of making same
DE3151078A1 (de) * 1981-12-23 1983-07-28 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung von reliefbildern
DE3314156A1 (de) * 1983-04-19 1984-10-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur beschichtung scheibenfoermiger halbleitersubstrate mit photolack
US4533624A (en) * 1983-05-23 1985-08-06 Sperry Corporation Method of forming a low temperature multilayer photoresist lift-off pattern
US4568573A (en) * 1985-02-19 1986-02-04 Nikken Toso Tokyo Company, Limited Process of forming a film of fluorine-containing resin on a metallic substrate
DE68906416T2 (de) * 1988-02-17 1993-09-09 Konishiroku Photo Ind Beschichtungsapparat.
JP2645478B2 (ja) * 1988-10-07 1997-08-25 富士通株式会社 半導体装置の製造方法
US5362591A (en) * 1989-10-09 1994-11-08 Hitachi Ltd. Et Al. Mask having a phase shifter and method of manufacturing same
DE4115510A1 (de) * 1990-05-21 1991-11-28 Hamatech Halbleiter Maschinenb Vorrichtung zur randentlackung einer substrats
US5248575A (en) * 1990-10-12 1993-09-28 Seiko Epson Corporation Photomask with phase shifter and method of fabricating semiconductor device by using the same
JPH04153653A (ja) * 1990-10-18 1992-05-27 Dainippon Printing Co Ltd 位相シフト層を有するフォトマスクの製造方法
JPH04269750A (ja) * 1990-12-05 1992-09-25 American Teleph & Telegr Co <Att> 離隔特徴をフォトレジスト層に印刷する方法
JPH0521310A (ja) * 1991-07-11 1993-01-29 Canon Inc 微細パタン形成方法
JPH0534897A (ja) * 1991-07-30 1993-02-12 Fujitsu Ltd 光学マスク及びその製造方法
US5246800A (en) * 1991-09-12 1993-09-21 Etec Systems, Inc. Discrete phase shift mask writing
US5292623A (en) * 1992-07-02 1994-03-08 Motorola, Inc. Method for forming integrated circuit devices using a phase shifting mask

Also Published As

Publication number Publication date
EP0585872A3 (en) 1996-07-24
EP0585872A2 (de) 1994-03-09
EP0585872B1 (de) 2000-03-29
KR940007982A (ko) 1994-04-28
KR100298610B1 (ko) 2001-11-30
DE69328220T2 (de) 2000-08-24
US5702847A (en) 1997-12-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee