DE69323174T2 - Verbundformkörper mit dreidimensionalen mehrschichtigen leitfähigen schaltungen und verfahren zu seiner herstellung - Google Patents

Verbundformkörper mit dreidimensionalen mehrschichtigen leitfähigen schaltungen und verfahren zu seiner herstellung

Info

Publication number
DE69323174T2
DE69323174T2 DE69323174T DE69323174T DE69323174T2 DE 69323174 T2 DE69323174 T2 DE 69323174T2 DE 69323174 T DE69323174 T DE 69323174T DE 69323174 T DE69323174 T DE 69323174T DE 69323174 T2 DE69323174 T2 DE 69323174T2
Authority
DE
Germany
Prior art keywords
circuits
molded product
thermo
composite molded
primary molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69323174T
Other languages
English (en)
Other versions
DE69323174D1 (de
Inventor
Takayuki Miyashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of DE69323174D1 publication Critical patent/DE69323174D1/de
Application granted granted Critical
Publication of DE69323174T2 publication Critical patent/DE69323174T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
DE69323174T 1992-08-20 1993-08-20 Verbundformkörper mit dreidimensionalen mehrschichtigen leitfähigen schaltungen und verfahren zu seiner herstellung Expired - Fee Related DE69323174T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22133192A JPH0677648A (ja) 1992-08-20 1992-08-20 立体的多層導電回路を有する複合成形品及びその製造方法
PCT/JP1993/001168 WO1994005141A1 (en) 1992-08-20 1993-08-20 Composite molded product having three-dimensional multi-layered conductive circuits and method of its manufacture

Publications (2)

Publication Number Publication Date
DE69323174D1 DE69323174D1 (de) 1999-03-04
DE69323174T2 true DE69323174T2 (de) 1999-09-16

Family

ID=16765134

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323174T Expired - Fee Related DE69323174T2 (de) 1992-08-20 1993-08-20 Verbundformkörper mit dreidimensionalen mehrschichtigen leitfähigen schaltungen und verfahren zu seiner herstellung

Country Status (5)

Country Link
EP (1) EP0614328B1 (de)
JP (1) JPH0677648A (de)
AT (1) ATE176121T1 (de)
DE (1) DE69323174T2 (de)
WO (1) WO1994005141A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5868740A (en) 1995-03-24 1999-02-09 Board Of Regents-Univ Of Nebraska Method for volumetric tissue ablation
US6575967B1 (en) 1995-03-24 2003-06-10 The Board Of Regents Of The University Of Nebraska Method and systems for volumetric tissue ablation
US5936627A (en) * 1997-02-28 1999-08-10 International Business Machines Corporation Method and system for performing perspective divide operations on three-dimensional graphical object data within a computer system
US6100178A (en) * 1997-02-28 2000-08-08 Ford Motor Company Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
US6923919B2 (en) 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
US6403211B1 (en) 2000-07-18 2002-06-11 3M Innovative Properties Company Liquid crystal polymer for flexible circuits
US6696163B2 (en) 2000-07-18 2004-02-24 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
KR102357563B1 (ko) * 2020-12-14 2022-02-07 인탑스 주식회사 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61252687A (ja) * 1985-05-01 1986-11-10 キヤノン株式会社 成形回路基板の製造法
JPS61289698A (ja) * 1985-06-18 1986-12-19 キヤノン株式会社 多層成形回路基板の製造方法
JPH0831668B2 (ja) * 1986-07-09 1996-03-27 三共化成株式会社 メツキプラスチツク成型品の成形法
DE3625263A1 (de) * 1986-07-25 1988-02-04 Basf Ag Mikroelektronische bauelemente sowie dickschicht-hybridschaltungen
JPH0191444A (ja) * 1987-10-02 1989-04-11 Meiki Co Ltd 多層プリント回路基板の射出成形方法
JPH0378291A (ja) * 1989-08-21 1991-04-03 Toshiba Corp 立体配線基板の製造方法
JPH0435085A (ja) * 1990-05-31 1992-02-05 Hitachi Chem Co Ltd 回路付プラスチツク成形品の製造法
JPH04332193A (ja) * 1991-05-02 1992-11-19 Hitachi Cable Ltd 多層回路形成体およびその製造方法

Also Published As

Publication number Publication date
JPH0677648A (ja) 1994-03-18
DE69323174D1 (de) 1999-03-04
ATE176121T1 (de) 1999-02-15
EP0614328A1 (de) 1994-09-07
EP0614328A4 (en) 1995-11-15
WO1994005141A1 (en) 1994-03-03
EP0614328B1 (de) 1999-01-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: POLYPLASTICS CO. LTD., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee