DE69322970D1 - Herstellung und benutzung einer siebdruckschablone mit erhöhten kanten - Google Patents

Herstellung und benutzung einer siebdruckschablone mit erhöhten kanten

Info

Publication number
DE69322970D1
DE69322970D1 DE69322970T DE69322970T DE69322970D1 DE 69322970 D1 DE69322970 D1 DE 69322970D1 DE 69322970 T DE69322970 T DE 69322970T DE 69322970 T DE69322970 T DE 69322970T DE 69322970 D1 DE69322970 D1 DE 69322970D1
Authority
DE
Germany
Prior art keywords
pattern
electroformed
layer
resist
screen printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69322970T
Other languages
English (en)
Other versions
DE69322970T2 (de
Inventor
Daniel Robert Di Blessington
Gary Thomas Marks
Jerry Elden Sergent
Judy Ann Sline
Stephen Anthony Delucia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
AMTX Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/849,862 external-priority patent/US5478699A/en
Application filed by AMTX Inc filed Critical AMTX Inc
Application granted granted Critical
Publication of DE69322970D1 publication Critical patent/DE69322970D1/de
Publication of DE69322970T2 publication Critical patent/DE69322970T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/142—Forme preparation for stencil-printing or silk-screen printing using a galvanic or electroless metal deposition processing step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Screen Printers (AREA)
DE69322970T 1992-03-12 1993-03-12 Herstellung und benutzung einer siebdruckschablone mit erhöhten kanten Expired - Fee Related DE69322970T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/849,862 US5478699A (en) 1992-03-12 1992-03-12 Method for preparing a screen printing stencil
US07/963,641 US5359928A (en) 1992-03-12 1992-10-20 Method for preparing and using a screen printing stencil having raised edges
PCT/US1993/002471 WO1993018440A1 (en) 1992-03-12 1993-03-12 Method for preparing and using a screen printing stencil having raised edges

Publications (2)

Publication Number Publication Date
DE69322970D1 true DE69322970D1 (de) 1999-02-18
DE69322970T2 DE69322970T2 (de) 1999-08-12

Family

ID=27126883

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69322970T Expired - Fee Related DE69322970T2 (de) 1992-03-12 1993-03-12 Herstellung und benutzung einer siebdruckschablone mit erhöhten kanten

Country Status (8)

Country Link
US (1) US5359928A (de)
EP (2) EP0664016B1 (de)
AT (1) ATE175500T1 (de)
DE (1) DE69322970T2 (de)
DK (1) DK0664016T3 (de)
ES (1) ES2129079T3 (de)
GR (1) GR3029862T3 (de)
WO (1) WO1993018440A1 (de)

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US5622611A (en) * 1996-05-22 1997-04-22 Amtx, Inc. Electroformed multilayer flow regulator incorporating force-generating means for selectively constricting the fluid flow path, and a process for the preparation thereof
JPH11510754A (ja) * 1996-06-11 1999-09-21 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ ステンシル印刷法による平基板上へのトラック形成方法
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SE527993C2 (sv) * 2004-12-10 2006-08-01 Hp Etch Ab Lodpastastencil och förfarande för att tillverka densamma
US20060273138A1 (en) * 2005-06-07 2006-12-07 Samsung Electronics Co., Ltd. Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board
US20070000887A1 (en) * 2005-06-29 2007-01-04 Scott Caldwell Method for scan welding or marking through a waveguide and waveguide therefor
JP5002587B2 (ja) * 2006-03-28 2012-08-15 パナソニック株式会社 バンプ形成方法およびバンプ形成装置
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US7749883B2 (en) 2007-09-20 2010-07-06 Fry's Metals, Inc. Electroformed stencils for solar cell front side metallization
DE202007019165U1 (de) * 2007-12-11 2010-11-04 Nb Technologies Gmbh Schablone für den technischen Siebdruck
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US20100157566A1 (en) * 2008-12-19 2010-06-24 Robert Bogursky Electronic shield assembly and methods
WO2011033278A1 (en) 2009-09-21 2011-03-24 Dtg International Gmbh Printing screens and method of fabricating the same
SG179299A1 (en) * 2010-09-13 2012-04-27 Trimech Technology Pte Ltd A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly
CN103171244B (zh) * 2011-12-23 2015-06-10 昆山允升吉光电科技有限公司 制作双层太阳能印刷网板的方法
CN103203964B (zh) * 2012-01-16 2017-07-11 昆山允升吉光电科技有限公司 一种台阶电铸模板的制作工艺
CN103203960B (zh) * 2012-01-16 2017-03-15 昆山允升吉光电科技有限公司 一种台阶模板的制作方法
CN103205781B (zh) * 2012-01-16 2017-06-13 昆山允升吉光电科技有限公司 一种台阶电铸模板的制作工艺
WO2013120013A1 (en) * 2012-02-08 2013-08-15 Photo Stencil, Llc Screen printing apparatus including support bars, and methods of using same
JP5995640B2 (ja) * 2012-10-10 2016-09-21 三菱電機株式会社 半導体装置の製造方法
KR20150057389A (ko) * 2013-11-19 2015-05-28 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN106061739B (zh) * 2014-02-20 2018-08-03 加卢斯费迪南德吕施股份公司 印刷丝网和用于成像印刷丝网的方法
JP6389695B2 (ja) * 2014-08-18 2018-09-12 理想科学工業株式会社 感熱製版装置
JP6320879B2 (ja) * 2014-08-29 2018-05-09 マクセルホールディングス株式会社 印刷用マスク及びその製造方法
JP6782005B2 (ja) * 2016-08-04 2020-11-11 ミタニマイクロニクス九州株式会社 スクリーンマスクおよびその製造方法
JP6739462B2 (ja) * 2018-04-04 2020-08-12 マクセルホールディングス株式会社 印刷用マスク
CN109795215B (zh) * 2019-01-30 2021-11-19 仓和精密制造(苏州)有限公司 具有离型层的印刷网版及其制作方法
DE102022203815A1 (de) 2022-04-19 2023-10-19 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Beschichten einer Verteilerplatte für eine elektrochemische Zelle
CN115505974A (zh) * 2022-09-28 2022-12-23 北京允升吉电子有限公司 一种用于精密印刷模板制作的镍铁金属薄片的制作方法

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Also Published As

Publication number Publication date
GR3029862T3 (en) 1999-07-30
EP0664016B1 (de) 1999-01-07
ES2129079T3 (es) 1999-06-01
DE69322970T2 (de) 1999-08-12
ATE175500T1 (de) 1999-01-15
EP0664016A4 (de) 1995-09-06
US5359928A (en) 1994-11-01
WO1993018440A1 (en) 1993-09-16
DK0664016T3 (da) 1999-08-30
EP0850758A3 (de) 1998-08-19
EP0664016A1 (de) 1995-07-26
EP0850758A2 (de) 1998-07-01

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: XEROX CORP., ROCHESTER, N.Y., US

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee