DE69321187T2 - Optische Halbleitervorrichtung mit verbesserter Positionierung des optischen Strahls - Google Patents

Optische Halbleitervorrichtung mit verbesserter Positionierung des optischen Strahls

Info

Publication number
DE69321187T2
DE69321187T2 DE69321187T DE69321187T DE69321187T2 DE 69321187 T2 DE69321187 T2 DE 69321187T2 DE 69321187 T DE69321187 T DE 69321187T DE 69321187 T DE69321187 T DE 69321187T DE 69321187 T2 DE69321187 T2 DE 69321187T2
Authority
DE
Germany
Prior art keywords
optical
semiconductor device
improved positioning
optical semiconductor
optical beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69321187T
Other languages
English (en)
Other versions
DE69321187D1 (de
Inventor
Akihiko Makita
Junichi Ichihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69321187D1 publication Critical patent/DE69321187D1/de
Application granted granted Critical
Publication of DE69321187T2 publication Critical patent/DE69321187T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/02365—Fixing laser chips on mounts by clamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE69321187T 1992-10-14 1993-10-13 Optische Halbleitervorrichtung mit verbesserter Positionierung des optischen Strahls Expired - Fee Related DE69321187T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4276305A JPH06132613A (ja) 1992-10-14 1992-10-14 半導体レーザ装置

Publications (2)

Publication Number Publication Date
DE69321187D1 DE69321187D1 (de) 1998-10-29
DE69321187T2 true DE69321187T2 (de) 1999-02-18

Family

ID=17567605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69321187T Expired - Fee Related DE69321187T2 (de) 1992-10-14 1993-10-13 Optische Halbleitervorrichtung mit verbesserter Positionierung des optischen Strahls

Country Status (4)

Country Link
US (1) US5404368A (de)
EP (1) EP0595502B1 (de)
JP (1) JPH06132613A (de)
DE (1) DE69321187T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5731602A (en) * 1996-01-18 1998-03-24 E-Tek Dynamics, Inc. Laser diode package with anti-reflection and anti-scattering coating
US6240113B1 (en) 1998-02-27 2001-05-29 Litton Systems, Inc. Microlaser-based electro-optic system and associated fabrication method
US6072815A (en) * 1998-02-27 2000-06-06 Litton Systems, Inc. Microlaser submount assembly and associates packaging method
DE10362042B4 (de) * 2003-09-23 2009-01-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Lasergehäuse
US7157744B2 (en) * 2003-10-29 2007-01-02 M/A-Com, Inc. Surface mount package for a high power light emitting diode
JP4282565B2 (ja) * 2004-07-30 2009-06-24 パナソニック株式会社 レーザ加熱装置
JP4479614B2 (ja) * 2005-07-12 2010-06-09 パナソニック株式会社 光ピックアップ装置
JP5228412B2 (ja) * 2006-11-21 2013-07-03 日亜化学工業株式会社 半導体発光装置
JP2010251686A (ja) * 2009-03-26 2010-11-04 Harison Toshiba Lighting Corp 発光装置及びその製造方法
DE102010042087A1 (de) * 2010-10-06 2012-04-12 Jenoptik Laser Gmbh Lasermodul mit einer Laserdiodeneinheit und einem Kühler

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4222629A (en) * 1978-03-27 1980-09-16 Sperry Corporation Fiber optic connector assembly
JPS60113978A (ja) * 1983-11-25 1985-06-20 Sumitomo Electric Ind Ltd 光素子
JPS60140775A (ja) * 1983-12-27 1985-07-25 Nec Corp 半導体素子用ステム
JPS60219788A (ja) * 1984-04-16 1985-11-02 Fuji Xerox Co Ltd 半導体レ−ザの取付装置
US4768070A (en) * 1986-03-20 1988-08-30 Hitachi, Ltd Optoelectronics device
JPH0746747B2 (ja) * 1986-09-09 1995-05-17 松下電器産業株式会社 半導体レーザのボンディング方法
JPH02116186A (ja) * 1988-10-25 1990-04-27 Nec Corp 半導体レーザ
US5136152A (en) * 1990-12-19 1992-08-04 Hoetron, Inc. Hybrid optical pickup with integrated power emission and reading photodetectors
JPH04343306A (ja) * 1991-05-21 1992-11-30 Toshiba Corp レ−ザ発振装置の取付装置
JPH0523563U (ja) * 1991-07-17 1993-03-26 ソニー株式会社 半導体レーザ装置
US5327443A (en) * 1991-10-30 1994-07-05 Rohm Co., Ltd. Package-type semiconductor laser device
US5270870A (en) * 1992-12-23 1993-12-14 Eastman Kodak Company Athermalized beam source and collimator lens assembly

Also Published As

Publication number Publication date
DE69321187D1 (de) 1998-10-29
EP0595502B1 (de) 1998-09-23
EP0595502A1 (de) 1994-05-04
JPH06132613A (ja) 1994-05-13
US5404368A (en) 1995-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee