DE69304212T2 - Vorrichtung zur Regelung der Geometrie dünner mit einer Drahtsäge geschnitttener Scheiben - Google Patents

Vorrichtung zur Regelung der Geometrie dünner mit einer Drahtsäge geschnitttener Scheiben

Info

Publication number
DE69304212T2
DE69304212T2 DE69304212T DE69304212T DE69304212T2 DE 69304212 T2 DE69304212 T2 DE 69304212T2 DE 69304212 T DE69304212 T DE 69304212T DE 69304212 T DE69304212 T DE 69304212T DE 69304212 T2 DE69304212 T2 DE 69304212T2
Authority
DE
Germany
Prior art keywords
geometry
regulating
wire saw
thin slices
slices cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69304212T
Other languages
English (en)
Other versions
DE69304212D1 (de
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
Charles Hauser
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Charles Hauser filed Critical Charles Hauser
Publication of DE69304212D1 publication Critical patent/DE69304212D1/de
Application granted granted Critical
Publication of DE69304212T2 publication Critical patent/DE69304212T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/18—Compensation of tool-deflection due to temperature or force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
    • Y10T83/148—Including means to correct the sensed operation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/283—With means to control or modify temperature of apparatus or work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69304212T 1992-01-22 1993-01-14 Vorrichtung zur Regelung der Geometrie dünner mit einer Drahtsäge geschnitttener Scheiben Expired - Lifetime DE69304212T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00170/92A CH687301A5 (fr) 1992-01-22 1992-01-22 Dispositif de sciage par fil.

Publications (2)

Publication Number Publication Date
DE69304212D1 DE69304212D1 (de) 1996-10-02
DE69304212T2 true DE69304212T2 (de) 1997-02-20

Family

ID=4180862

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69304212T Expired - Lifetime DE69304212T2 (de) 1992-01-22 1993-01-14 Vorrichtung zur Regelung der Geometrie dünner mit einer Drahtsäge geschnitttener Scheiben

Country Status (5)

Country Link
US (1) US5377568A (de)
EP (1) EP0552663B1 (de)
JP (1) JP3284141B2 (de)
CH (1) CH687301A5 (de)
DE (1) DE69304212T2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011005948A1 (de) * 2011-03-23 2012-09-27 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
DE102013225104A1 (de) 2013-12-06 2015-07-02 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge

Families Citing this family (36)

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Publication number Priority date Publication date Assignee Title
CH688648A5 (fr) * 1993-06-09 1997-12-31 Charles Hauser Dispositif de sciage d'une pièce en matériau dur ou fragile.
JP2755907B2 (ja) * 1994-06-28 1998-05-25 信越半導体株式会社 ワイヤソー用溝ローラ
CH690419A5 (fr) * 1994-11-18 2000-09-15 Hct Shaping Systems Sa Dispositif de sciage par fil intégré et monobloc garantissant intrinsèquement par sa structure, un contrôle passif de la géométrie de coupe de tranches fines.
DE19510625A1 (de) * 1995-03-23 1996-09-26 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück
JP2885270B2 (ja) * 1995-06-01 1999-04-19 信越半導体株式会社 ワイヤーソー装置及びワークの切断方法
CH691036A5 (fr) * 1996-02-06 2001-04-12 Hct Shaping Systems Sa Dispositif de sciage par fil pour la découpe de tranches fines comprenant un mécanisme pour le taillage in situ des gorges des cylindres guide-fils.
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
DE19739965A1 (de) * 1997-09-11 1999-03-18 Wacker Siltronic Halbleitermat Sägeleiste zum Fixieren eines Kristalls und Verfahren zum Abtrennen von Scheiben
US6102024A (en) * 1998-03-11 2000-08-15 Norton Company Brazed superabrasive wire saw and method therefor
EP1097782B1 (de) * 1999-01-20 2006-11-15 Shin-Etsu Handotai Co., Ltd Drahtsäge und schneidverfahren
US6352071B1 (en) 2000-06-20 2002-03-05 Seh America, Inc. Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw
US20030170948A1 (en) * 2002-03-07 2003-09-11 Memc Electronic Materials, Inc. Method and apparatus for slicing semiconductor wafers
CN101970193A (zh) * 2008-02-11 2011-02-09 Memc电子材料有限公司 用于将锭线锯切片成晶片中的碳纳米管加强线锯梁
JP2010029955A (ja) * 2008-07-25 2010-02-12 Shin Etsu Handotai Co Ltd ワイヤソーの運転再開方法及びワイヤソー
MX2012001810A (es) 2009-08-14 2012-06-01 Saint Gobain Abrasives Inc Articulos abrasivos que incluyen particulas abrasivas unidas a un cuerpo alargado.
RU2508968C2 (ru) * 2009-08-14 2014-03-10 Сэнт-Гобэн Эбрейзивс, Инк. Абразивное изделие (варианты) и способ его формирования
TWI466990B (zh) 2010-12-30 2015-01-01 Saint Gobain Abrasives Inc 磨料物品及形成方法
WO2012110102A1 (en) * 2011-02-18 2012-08-23 Applied Materials, Inc. Wire saw device, method of building a wire web in a wire saw device and method for operating a wire saw device
DE102011005949B4 (de) * 2011-03-23 2012-10-31 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
WO2013040423A2 (en) 2011-09-16 2013-03-21 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
KR20140075717A (ko) 2011-09-29 2014-06-19 생-고뱅 어브레이시브즈, 인코포레이티드 배리어층이 있는 신장 기재 몸체 결합 연마 입자를 포함하는 연마 물품, 및 이를 형성하는 방법
TW201402274A (zh) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc 研磨物品及形成方法
TWI477343B (zh) 2012-06-29 2015-03-21 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201404527A (zh) 2012-06-29 2014-02-01 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201441355A (zh) 2013-04-19 2014-11-01 Saint Gobain Abrasives Inc 研磨製品及其形成方法
EP2937165A1 (de) * 2014-04-25 2015-10-28 Applied Materials Switzerland Sàrl Motoreinheit für eine Drahtsägenvorrichtung und Drahtsägenvorrichtung damit
CN104802325B (zh) * 2015-05-14 2016-06-08 宝鸡文理学院 用于线锯切割的超声振动弹性加载装置
TWI664057B (zh) 2015-06-29 2019-07-01 美商聖高拜磨料有限公司 研磨物品及形成方法
CN107639660A (zh) * 2016-06-24 2018-01-30 惠安县灿鑫新材料科技有限公司 一种横向快速切片机的使用方法
DE102019207719A1 (de) 2019-05-27 2020-12-03 Siltronic Ag Verfahren zum Abtrennen einer Vielzahl von Scheiben von Werkstücken während einer Anzahl von Abtrennvorgängen mittels einer Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
EP3858569A1 (de) 2020-01-28 2021-08-04 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
EP3922387A1 (de) 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben mittels einer drahtsäge von werkstücken während einer abfolge von abtrennvorgängen
EP3922385A1 (de) 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
EP3922389A1 (de) 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben mittels einer drahtsäge von werkstücken während einer abfolge von abtrennvorgängen
EP3922388A1 (de) 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben mittels einer drahtsäge von werkstücken während einer abfolge von abtrennvorgängen
EP3922386A1 (de) 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen

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US2886026A (en) * 1957-08-20 1959-05-12 Texas Instruments Inc Method of and apparatus for cutting a semiconductor crystal
US3186275A (en) * 1963-07-24 1965-06-01 West Virginia Pulp & Paper Co Thermal expansion means for maintaining and adjusting cutter knife clearance
SE316026B (de) * 1968-07-02 1969-10-13 Lkb Produkter Ab
US3680417A (en) * 1970-04-27 1972-08-01 W F Wells And Sons Inc Sensor for determining band saw blade deflection
CA1071978A (en) * 1977-12-07 1980-02-19 Thomas Bonac Bandsaw mechanism
JPS6090656A (ja) * 1983-10-20 1985-05-21 Citizen Watch Co Ltd 工作機械におけるスピンドル位置決め補正装置
EP0166064B1 (de) * 1984-06-27 1988-03-02 Maschinenfabrik Meyer & Burger AG Trennschleifmaschine mit einer Messanordnung und Verwendung dieser Messanordnung
WO1986007560A1 (en) * 1985-06-20 1986-12-31 Wolfgang Mayer Stone saw
US5113757A (en) * 1986-01-10 1992-05-19 Alliance Rubber Company, Inc. Method and apparatus for making printed elastic bands
EP0282454A3 (de) * 1987-03-10 1992-07-15 C.A. Weidmüller GmbH & Co. Vorrichtung zum Regeln der Relativlage zwischen einem Werkzeug und einem Werkstück
DE3826698A1 (de) * 1988-08-05 1990-02-08 Wacker Chemitronic Verfahren und vorrichtung zur kontrolle des schnittverlaufes beim abtrennen von scheiben von nichtmagnetisierbaren werkstuecken
JPH03503266A (ja) * 1988-11-03 1991-07-25 ホテック　アンドゥストリ　ソシエテ　アノニム 摩滅型分離装置
JPH02198759A (ja) * 1989-01-24 1990-08-07 Sumitomo Metal Ind Ltd ワイヤソーによる切断方法及びその装置
DE3906091A1 (de) * 1989-02-27 1990-08-30 Wacker Chemitronic Verfahren zum zersaegen von stabfoermigen werkstuecken in scheiben mittels innenlochsaege, sowie innenlochsaegen zu seiner durchfuehrung
JP2516717B2 (ja) * 1991-11-29 1996-07-24 信越半導体株式会社 ワイヤソ―及びその切断方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011005948A1 (de) * 2011-03-23 2012-09-27 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
DE102011005948B4 (de) * 2011-03-23 2012-10-31 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
US8746227B2 (en) 2011-03-23 2014-06-10 Siltronic Ag Method for slicing wafers from a workpiece
DE102013225104A1 (de) 2013-12-06 2015-07-02 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge
US9662804B2 (en) 2013-12-06 2017-05-30 Siltronic Ag Method for slicing wafers from a workpiece by means of a wire saw
DE102013225104B4 (de) * 2013-12-06 2019-11-28 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge

Also Published As

Publication number Publication date
DE69304212D1 (de) 1996-10-02
JPH05337901A (ja) 1993-12-21
JP3284141B2 (ja) 2002-05-20
CH687301A5 (fr) 1996-11-15
US5377568A (en) 1995-01-03
EP0552663A1 (de) 1993-07-28
EP0552663B1 (de) 1996-08-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HCT SHAPING SYSTEMS SA, CHESEAUX, CH

8381 Inventor (new situation)

Free format text: HAUSER, CHARLES, GENOLIER, CH

8327 Change in the person/name/address of the patent owner

Owner name: APPLIED MATERIALS SWITZERLAND SA, CHESEAUX-SUR, CH