DE69223345D1 - Vorrichtung zum Abschrägen der Kerbe eines Plättchen - Google Patents
Vorrichtung zum Abschrägen der Kerbe eines PlättchenInfo
- Publication number
- DE69223345D1 DE69223345D1 DE69223345T DE69223345T DE69223345D1 DE 69223345 D1 DE69223345 D1 DE 69223345D1 DE 69223345 T DE69223345 T DE 69223345T DE 69223345 T DE69223345 T DE 69223345T DE 69223345 D1 DE69223345 D1 DE 69223345D1
- Authority
- DE
- Germany
- Prior art keywords
- chamfering
- notch
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16775391A JP2571477B2 (ja) | 1991-06-12 | 1991-06-12 | ウエーハのノッチ部面取り装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69223345D1 true DE69223345D1 (de) | 1998-01-15 |
DE69223345T2 DE69223345T2 (de) | 1998-04-30 |
Family
ID=15855463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69223345T Expired - Fee Related DE69223345T2 (de) | 1991-06-12 | 1992-06-10 | Vorrichtung zum Abschrägen der Kerbe eines Plättchen |
Country Status (4)
Country | Link |
---|---|
US (1) | US5271185A (de) |
EP (1) | EP0518641B1 (de) |
JP (1) | JP2571477B2 (de) |
DE (1) | DE69223345T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2798345B2 (ja) * | 1993-06-11 | 1998-09-17 | 信越半導体株式会社 | ウェーハのノッチ部研磨装置 |
JP2798347B2 (ja) * | 1993-07-08 | 1998-09-17 | 信越半導体株式会社 | ウェーハのノッチ部研磨装置 |
JP2832138B2 (ja) * | 1993-09-30 | 1998-12-02 | 信越半導体株式会社 | ウェーハ外周部の研磨装置 |
JPH07223125A (ja) * | 1994-02-09 | 1995-08-22 | Sannohashi:Kk | ディスクドライブスイングア−ムの製造方法及び装置 |
JP3537020B2 (ja) * | 1996-10-02 | 2004-06-14 | 日本碍子株式会社 | セラミック製部品素材のエッジ部チッピングレス加工方法 |
JP3197253B2 (ja) * | 1998-04-13 | 2001-08-13 | 株式会社日平トヤマ | ウエーハの面取り方法 |
JP2000254845A (ja) * | 1999-03-10 | 2000-09-19 | Nippei Toyama Corp | ウエーハのノッチ溝の面取り方法及びウエーハ |
GB2351684B (en) * | 1999-07-03 | 2001-07-11 | Unova Uk Ltd | Improvement in and relating to edge grinding |
US6361405B1 (en) * | 2000-04-06 | 2002-03-26 | Applied Materials, Inc. | Utility wafer for chemical mechanical polishing |
JP2002367935A (ja) * | 2001-04-06 | 2002-12-20 | Speedfam Co Ltd | ウェハ鏡面加工装置 |
JP5196709B2 (ja) * | 2005-04-19 | 2013-05-15 | 株式会社荏原製作所 | 半導体ウエハ周縁研磨装置及び方法 |
JP5352331B2 (ja) * | 2009-04-15 | 2013-11-27 | ダイトエレクトロン株式会社 | ウェーハの面取り加工方法 |
JP5426682B2 (ja) * | 2009-09-18 | 2014-02-26 | 本田技研工業株式会社 | 摩擦式駆動装置および倒立振子型移動体 |
JP2013008769A (ja) * | 2011-06-23 | 2013-01-10 | Sumitomo Electric Ind Ltd | 炭化珪素基板の製造方法 |
JP6071611B2 (ja) * | 2013-02-13 | 2017-02-01 | Mipox株式会社 | オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法 |
USD834075S1 (en) | 2016-08-05 | 2018-11-20 | Ebara Corporation | Pressing member for substrate polishing apparatus |
US11482408B2 (en) * | 2020-06-23 | 2022-10-25 | Disco Corporation | Method of processing wafer |
CN112571195A (zh) * | 2020-11-30 | 2021-03-30 | 锦州神工半导体股份有限公司 | 一种硅盘倒角装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2767520A (en) * | 1953-05-18 | 1956-10-23 | Gear Grinding Mach Co | Form grinding machine |
GB1238963A (de) * | 1968-11-19 | 1971-07-14 | ||
US3815288A (en) * | 1970-09-28 | 1974-06-11 | Gen Electric | Pattern machining system for die rolls |
US3864878A (en) * | 1972-03-13 | 1975-02-11 | Wean United Inc | Apparatus for machining pilger rolls and the like |
FR2251176A5 (en) * | 1973-11-13 | 1975-06-06 | Czerwinski Rudolf | Cam disc profile gringing - has work and master profile on vertical shaft pressed by sprung guide roller |
JPS6014666B2 (ja) * | 1977-05-25 | 1985-04-15 | シチズン時計株式会社 | ねじれ面研削装置 |
JPS61214964A (ja) * | 1985-03-20 | 1986-09-24 | Ngk Insulators Ltd | 面取り装置 |
JPH0637024B2 (ja) * | 1987-08-23 | 1994-05-18 | エムテック株式会社 | オリエンテ−ションフラットの研削方法及び装置 |
JPH0637025B2 (ja) * | 1987-09-14 | 1994-05-18 | スピードファム株式会社 | ウエハの鏡面加工装置 |
US4905425A (en) * | 1988-09-30 | 1990-03-06 | Shin-Etsu Handotai Company Limited | Method for chamfering the notch of a notch-cut semiconductor wafer |
DE3842601A1 (de) * | 1988-12-17 | 1990-07-05 | Wernicke & Co Gmbh | Brillenglasrandschleifmaschine |
US5036624A (en) * | 1989-06-21 | 1991-08-06 | Silicon Technology Corporation | Notch grinder |
US5185965A (en) * | 1991-07-12 | 1993-02-16 | Daito Shoji Co., Ltd. | Method and apparatus for grinding notches of semiconductor wafer |
-
1991
- 1991-06-12 JP JP16775391A patent/JP2571477B2/ja not_active Expired - Lifetime
-
1992
- 1992-06-10 EP EP92305322A patent/EP0518641B1/de not_active Expired - Lifetime
- 1992-06-10 DE DE69223345T patent/DE69223345T2/de not_active Expired - Fee Related
- 1992-06-11 US US07/897,038 patent/US5271185A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5271185A (en) | 1993-12-21 |
JPH04364728A (ja) | 1992-12-17 |
EP0518641B1 (de) | 1997-12-03 |
DE69223345T2 (de) | 1998-04-30 |
JP2571477B2 (ja) | 1997-01-16 |
EP0518641A1 (de) | 1992-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |