DE69222232T2 - Verfahren zur Herstellung einer Mikroschaltungskarte und Mikroschaltungskarte - Google Patents

Verfahren zur Herstellung einer Mikroschaltungskarte und Mikroschaltungskarte

Info

Publication number
DE69222232T2
DE69222232T2 DE69222232T DE69222232T DE69222232T2 DE 69222232 T2 DE69222232 T2 DE 69222232T2 DE 69222232 T DE69222232 T DE 69222232T DE 69222232 T DE69222232 T DE 69222232T DE 69222232 T2 DE69222232 T2 DE 69222232T2
Authority
DE
Germany
Prior art keywords
microcircuit
card
module
encapsulation product
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69222232T
Other languages
German (de)
English (en)
Other versions
DE69222232D1 (de
Inventor
Jacques Venambre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De la Rue Cartes et Systemes SAS
Original Assignee
De la Rue Cartes et Systemes SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De la Rue Cartes et Systemes SAS filed Critical De la Rue Cartes et Systemes SAS
Application granted granted Critical
Publication of DE69222232D1 publication Critical patent/DE69222232D1/de
Publication of DE69222232T2 publication Critical patent/DE69222232T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • H10W72/884
    • H10W90/754
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
DE69222232T 1991-06-17 1992-06-15 Verfahren zur Herstellung einer Mikroschaltungskarte und Mikroschaltungskarte Expired - Lifetime DE69222232T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9107371A FR2677785A1 (fr) 1991-06-17 1991-06-17 Procede de fabrication d'une carte a microcircuit.

Publications (2)

Publication Number Publication Date
DE69222232D1 DE69222232D1 (de) 1997-10-23
DE69222232T2 true DE69222232T2 (de) 1998-06-10

Family

ID=9413915

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69222232T Expired - Lifetime DE69222232T2 (de) 1991-06-17 1992-06-15 Verfahren zur Herstellung einer Mikroschaltungskarte und Mikroschaltungskarte

Country Status (6)

Country Link
US (2) US5438750A (enExample)
EP (1) EP0519564B1 (enExample)
JP (1) JP3222204B2 (enExample)
DE (1) DE69222232T2 (enExample)
FR (1) FR2677785A1 (enExample)
TW (1) TW220003B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
DE19512725C1 (de) * 1995-04-05 1996-09-12 Orga Kartensysteme Gmbh Ausweiskarte o.dgl. in Form einer Chipkarte
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
FR2734983B1 (fr) 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
US6441736B1 (en) 1999-07-01 2002-08-27 Keith R. Leighton Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
US5817207A (en) * 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6036099A (en) 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US6027027A (en) * 1996-05-31 2000-02-22 Lucent Technologies Inc. Luggage tag assembly
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
US6914196B2 (en) * 1998-01-09 2005-07-05 Samsung Electronics Co., Ltd. Reel-deployed printed circuit board
FR2775099B1 (fr) * 1998-02-13 2000-03-31 Schlumberger Ind Sa Procede de fabrication d'une carte a circuit integre
FR2783354B1 (fr) * 1998-08-25 2002-07-12 Commissariat Energie Atomique Procede collectif de conditionnement d'une pluralite de composants formes initialement dans un meme substrat
TW388976B (en) * 1998-10-21 2000-05-01 Siliconware Precision Industries Co Ltd Semiconductor package with fully exposed heat sink
FR2792440B1 (fr) * 1999-04-19 2001-06-08 Schlumberger Systems & Service Dispositif a circuit integre securise contre des attaques procedant par destruction controlee d'une couche complementaire
FR2793331B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de fabrication d'une carte a microcircuit
FR2793330B1 (fr) 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
US6928718B2 (en) 2000-06-06 2005-08-16 Sawtekk, Inc. Method for array processing of surface acoustic wave devices
US7632698B2 (en) 2006-05-16 2009-12-15 Freescale Semiconductor, Inc. Integrated circuit encapsulation and method therefor
JP5163776B2 (ja) * 2010-07-13 2013-03-13 株式会社デンソー カードキー

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH619333A5 (en) * 1977-11-01 1980-09-15 Faselec Ag Process for covering a flat component with a polymer
JPS5837694B2 (ja) * 1978-10-30 1983-08-18 富士通株式会社 半導体装置
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
FR2583574B1 (fr) * 1985-06-14 1988-06-17 Eurotechnique Sa Micromodule a contacts enterres et carte contenant des circuits comportant un tel micromodule.
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2613510A1 (fr) * 1987-03-31 1988-10-07 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes a memoire ainsi obtenues
FR2617668B1 (fr) * 1987-07-03 1995-07-07 Radiotechnique Compelec Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
US5067008A (en) * 1989-08-11 1991-11-19 Hitachi Maxell, Ltd. Ic package and ic card incorporating the same thereinto

Also Published As

Publication number Publication date
DE69222232D1 (de) 1997-10-23
US5438750A (en) 1995-08-08
EP0519564B1 (fr) 1997-09-17
TW220003B (enExample) 1994-02-01
US5585669A (en) 1996-12-17
EP0519564A1 (fr) 1992-12-23
JP3222204B2 (ja) 2001-10-22
JPH05212995A (ja) 1993-08-24
FR2677785A1 (fr) 1992-12-18

Similar Documents

Publication Publication Date Title
DE69222232T2 (de) Verfahren zur Herstellung einer Mikroschaltungskarte und Mikroschaltungskarte
DE3886721T3 (de) Chipkartenstruktur.
DE69201159T2 (de) Anisotropleitendes Material und Verfahren zum Anschliessen integrierter Schaltkreise unter dessen Verwendung.
DE68928095T2 (de) Verfahren zur Herstellung eines elektronischen Moduls und elektronisches Modul, hergestellt nach diesem Verfahren
EP0299530B1 (de) Trägerelement zum Einbau in Ausweiskarten
DE69432968T2 (de) Gehäuse für elektronische Bauelemente
DE3586666T2 (de) Karte mit ic-baustein und verfahren zur herstellung derselben.
DE102007005630B4 (de) Sensorchip-Modul und Verfahren zur Herstellung eines Sensorchip-Moduls
DE69737248T2 (de) Verfahren zum Einkapseln einer integrierten Halbleiterschaltung
EP0852040B1 (de) Ic-kartenmodul zur herstellung einer ic-karte sowie verfahren zur herstellung einer ic-karte
DE68929367T2 (de) Kartenmodul für integrierte Schaltung
DE69832104T2 (de) Verbindung durch Aufbringen eines dem Relief entsprechenden viskosen Produktes
WO1998052221A1 (de) Leistungshalbleitermodul mit keramiksubstrat
DE102011003195B4 (de) Bauteil und Verfahren zum Herstellen eines Bauteils
DE3937996A1 (de) Verfahren zur herstellung von halbleiteranordnungen
EP0107061A2 (de) Informationskarte und Verfahren zu ihrer Herstellung
DE19813525A1 (de) Integriertes Halbleiterbauelement
DE3810899C2 (enExample)
DE68913053T2 (de) Persönliche Datenkarte und Verfahren zu ihrer Konstruktion.
EP0568572B1 (de) Trägerelement für integrierte halbleiter-schaltkreise, insbesondere zum einbau in chip-karten
DE68914927T2 (de) Halbleiteranordnung vom mit Plastik umhüllten Typ und Verfahren zur Herstellung derselben.
DE112005003634T5 (de) Ein integrierter Schaltungsbaustein und ein Verfahren zum Ausbilden eines integrierten Schaltungsbausteins
DE19645071A1 (de) Verfahren zur Herstellung von Chipkarten
DE69425774T2 (de) Verfahren zur Umhüllung von elektronischen Hybridbauteilen mittels Kugeln auf einem Substrat
EP0664524B1 (de) Verfahren zum Verkappen eines Chipkartenmoduls

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: DE LA RUE CARTES ET SYSTEMES, PARIS, FR

8328 Change in the person/name/address of the agent

Free format text: U. KNOBLAUCH UND KOLLEGEN, 60320 FRANKFURT

8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PATENTANWAELTE KNOBLAUCH UND KNOBLAUCH, 60322 FRANK

R071 Expiry of right

Ref document number: 519564

Country of ref document: EP