DE69217187T2 - Anordnung zur Zuführung einer Spannung auf einen Substrathalter - Google Patents

Anordnung zur Zuführung einer Spannung auf einen Substrathalter

Info

Publication number
DE69217187T2
DE69217187T2 DE69217187T DE69217187T DE69217187T2 DE 69217187 T2 DE69217187 T2 DE 69217187T2 DE 69217187 T DE69217187 T DE 69217187T DE 69217187 T DE69217187 T DE 69217187T DE 69217187 T2 DE69217187 T2 DE 69217187T2
Authority
DE
Germany
Prior art keywords
substrate holder
connecting pin
connector according
base
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69217187T
Other languages
German (de)
English (en)
Other versions
DE69217187D1 (de
Inventor
Richard Claude
Jean-Francois Daviet
Philippe Montmayeul
Louise Peccoud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE69217187D1 publication Critical patent/DE69217187D1/de
Publication of DE69217187T2 publication Critical patent/DE69217187T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H10P72/72—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Conductor Connections (AREA)
DE69217187T 1991-11-06 1992-11-04 Anordnung zur Zuführung einer Spannung auf einen Substrathalter Expired - Fee Related DE69217187T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9113686A FR2683395A1 (fr) 1991-11-06 1991-11-06 Dispositif d'amende de tension sur une piece conductrice.

Publications (2)

Publication Number Publication Date
DE69217187D1 DE69217187D1 (de) 1997-03-13
DE69217187T2 true DE69217187T2 (de) 1997-07-17

Family

ID=9418669

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69217187T Expired - Fee Related DE69217187T2 (de) 1991-11-06 1992-11-04 Anordnung zur Zuführung einer Spannung auf einen Substrathalter

Country Status (3)

Country Link
EP (1) EP0545748B1 (enExample)
DE (1) DE69217187T2 (enExample)
FR (1) FR2683395A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2724269B1 (fr) 1994-09-06 1996-10-18 Commissariat Energie Atomique Porte-substrat electrostatique
US6221221B1 (en) * 1998-11-16 2001-04-24 Applied Materials, Inc. Apparatus for providing RF return current path control in a semiconductor wafer processing system
US11651986B2 (en) * 2021-01-27 2023-05-16 Applied Materials, Inc. System for isolating electrodes at cryogenic temperatures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012491C2 (de) * 1980-03-31 1984-10-25 Feinmetall Gmbh, 7033 Herrenberg Kontaktbaustein zum Prüfen von elektrischen Leiterplatten
JPS59188550A (ja) * 1983-04-12 1984-10-25 Fuji Photo Film Co Ltd イオン活量測定装置用電気接続端子アセンブリ−
EP0256541A3 (de) * 1986-08-19 1990-03-14 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Kontaktiervorrichtung
US4777908A (en) * 1986-11-26 1988-10-18 Optical Coating Laboratory, Inc. System and method for vacuum deposition of thin films

Also Published As

Publication number Publication date
FR2683395A1 (fr) 1993-05-07
DE69217187D1 (de) 1997-03-13
EP0545748A1 (fr) 1993-06-09
FR2683395B1 (enExample) 1995-04-28
EP0545748B1 (fr) 1997-01-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee