DE69212769D1 - Laserbearbeitungsvorrichtung - Google Patents

Laserbearbeitungsvorrichtung

Info

Publication number
DE69212769D1
DE69212769D1 DE69212769T DE69212769T DE69212769D1 DE 69212769 D1 DE69212769 D1 DE 69212769D1 DE 69212769 T DE69212769 T DE 69212769T DE 69212769 T DE69212769 T DE 69212769T DE 69212769 D1 DE69212769 D1 DE 69212769D1
Authority
DE
Germany
Prior art keywords
machining device
laser machining
laser
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69212769T
Other languages
English (en)
Other versions
DE69212769T2 (de
Inventor
Atsushi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of DE69212769D1 publication Critical patent/DE69212769D1/de
Application granted granted Critical
Publication of DE69212769T2 publication Critical patent/DE69212769T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476Features inside the nozzle for feeding the fluid stream through the nozzle

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE69212769T 1991-04-23 1992-04-17 Laserbearbeitungsvorrichtung Expired - Fee Related DE69212769T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3119506A JP2617048B2 (ja) 1991-04-23 1991-04-23 レーザ加工装置
PCT/JP1992/000499 WO1992018285A1 (en) 1991-04-23 1992-04-17 Laser processing device

Publications (2)

Publication Number Publication Date
DE69212769D1 true DE69212769D1 (de) 1996-09-19
DE69212769T2 DE69212769T2 (de) 1996-12-19

Family

ID=14762950

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69212769T Expired - Fee Related DE69212769T2 (de) 1991-04-23 1992-04-17 Laserbearbeitungsvorrichtung

Country Status (6)

Country Link
US (1) US5308951A (de)
EP (1) EP0540745B1 (de)
JP (1) JP2617048B2 (de)
KR (1) KR960004755B1 (de)
DE (1) DE69212769T2 (de)
WO (1) WO1992018285A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06210481A (ja) * 1993-01-14 1994-08-02 Fanuc Ltd レーザ加工制御方法
DE19837334C1 (de) * 1998-08-18 2000-07-13 Baublys Gmbh Einrichtung zum Schutz des Objektivs eines Lasergerätes an einer Werkzeugmaschine
JP3385361B2 (ja) * 2000-05-09 2003-03-10 北海道大学長 レーザ溶接方法及びレーザ溶接装置
JP3385363B2 (ja) * 2000-05-11 2003-03-10 北海道大学長 レーザ溶接方法、レーザ溶接装置及びレーザ溶接用ガスシールド装置
US20020130115A1 (en) * 2001-03-13 2002-09-19 Lawson William E. Debris removal apparatus for use in laser ablation
EP1459835B1 (de) * 2003-03-15 2013-04-24 TRUMPF Werkzeugmaschinen GmbH + Co. KG Laserbearbeitungsverfahren mit einem Laserbearbeitungskopf zum Laserschneiden und zum Laserschweissen
US7060932B2 (en) 2003-03-18 2006-06-13 Loma Linda University Medical Center Method and apparatus for material processing
US7057134B2 (en) 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
US7286223B2 (en) 2003-03-18 2007-10-23 Loma Linda University Medical Center Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
US7038166B2 (en) 2003-03-18 2006-05-02 Loma Linda University Medical Center Containment plenum for laser irradiation and removal of material from a surface of a structure
US7379483B2 (en) 2003-03-18 2008-05-27 Loma Linda University Medical Center Method and apparatus for material processing
US7880116B2 (en) * 2003-03-18 2011-02-01 Loma Linda University Medical Center Laser head for irradiation and removal of material from a surface of a structure
US7218649B2 (en) * 2003-08-28 2007-05-15 Philip Morris Usa Inc. Laser beam containment system
DE102004002839A1 (de) * 2004-01-20 2005-08-11 Willer, Diana Schutzglaswechseleinheit (SGWE) Schutzeinrichtung für Laseroptik sowie Vorrichtung dazu
US10301912B2 (en) 2008-08-20 2019-05-28 Foro Energy, Inc. High power laser flow assurance systems, tools and methods
US20120074110A1 (en) * 2008-08-20 2012-03-29 Zediker Mark S Fluid laser jets, cutting heads, tools and methods of use
US11590606B2 (en) * 2008-08-20 2023-02-28 Foro Energy, Inc. High power laser tunneling mining and construction equipment and methods of use
US9080425B2 (en) 2008-10-17 2015-07-14 Foro Energy, Inc. High power laser photo-conversion assemblies, apparatuses and methods of use
US9719302B2 (en) 2008-08-20 2017-08-01 Foro Energy, Inc. High power laser perforating and laser fracturing tools and methods of use
US9089928B2 (en) 2008-08-20 2015-07-28 Foro Energy, Inc. Laser systems and methods for the removal of structures
US9664012B2 (en) 2008-08-20 2017-05-30 Foro Energy, Inc. High power laser decomissioning of multistring and damaged wells
US9669492B2 (en) 2008-08-20 2017-06-06 Foro Energy, Inc. High power laser offshore decommissioning tool, system and methods of use
WO2014204535A1 (en) 2013-03-15 2014-12-24 Foro Energy, Inc. High power laser fluid jets and beam paths using deuterium oxide
TWI812312B (zh) * 2022-06-29 2023-08-11 宏碁股份有限公司 雷射雕刻裝置及雷射雕刻系統

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3008176C2 (de) * 1979-03-07 1986-02-20 Crosfield Electronics Ltd., London Gravieren von Druckzylindern
US4315133A (en) * 1980-05-12 1982-02-09 Gte Automatic Electric Laboratories, Inc. Apparatus protecting a lens from airborne particulates
US4303824A (en) * 1980-05-12 1981-12-01 Gte Automatic Electric Laboratories, Inc. Method and apparatus protecting a lens from airborne particulates
DE3208626A1 (de) * 1982-03-10 1983-09-22 Siemens AG, 1000 Berlin und 8000 München Laser-beschriftungseinrichtung
JPS63154287A (ja) * 1986-12-17 1988-06-27 Mitsubishi Electric Corp レ−ザ加工機用ノズル
JPH0287588A (ja) * 1988-09-24 1990-03-28 Murata Mfg Co Ltd 厚膜配線基板の抵抗体形成方法
US4892992A (en) * 1988-11-03 1990-01-09 Gmf Robotics Corporation Industrial laser robot system
JPH0287588U (de) * 1988-12-26 1990-07-11
JPH02222586A (ja) * 1989-02-23 1990-09-05 Fanuc Ltd レーザ用ターボブロア及びレーザ発振装置
DE3927451C1 (en) * 1989-08-19 1990-07-26 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De Device for processing workpieces by laser radiation - uses turbine wheel to circulate gas at high speed, and optically monitors outlet valve

Also Published As

Publication number Publication date
JP2617048B2 (ja) 1997-06-04
KR960004755B1 (ko) 1996-04-13
WO1992018285A1 (en) 1992-10-29
EP0540745A4 (en) 1993-10-06
EP0540745A1 (de) 1993-05-12
EP0540745B1 (de) 1996-08-14
JPH0569175A (ja) 1993-03-23
US5308951A (en) 1994-05-03
KR930700251A (ko) 1993-03-13
DE69212769T2 (de) 1996-12-19

Similar Documents

Publication Publication Date Title
DE69212769D1 (de) Laserbearbeitungsvorrichtung
DE69217360D1 (de) Laserdioden
NO914521L (no) Laser
DE69220434D1 (de) Halbleiterlaser
DE69313347D1 (de) Lasermarkierungsgerät
DE69222077D1 (de) Lasersystem
DE69323762D1 (de) Lasermarkierungsgerät
DE69212938D1 (de) Halbleiterlaser
DE69218802D1 (de) Halbleiterlaser
DE69223737D1 (de) Halbleiterlaser
EP0462842A3 (en) Laser machining device
DE69419231D1 (de) Laserschneidevorrichtung
DE69217679D1 (de) Halbleiterlaser
DE69227403D1 (de) Halbleiterlaser
DE69414541D1 (de) Laserapparat
DE59001100D1 (de) Laserbearbeitungsvorrichtung.
DE69118563D1 (de) Laservorrichtung
DE69226027D1 (de) Halbleiterlaser
DE69208622D1 (de) Halbleiterlaservorrichtung
DE69220494D1 (de) Laserbearbeitungskopfvorrichtung
DE69209426D1 (de) Halbleiterlaser
DE69408845D1 (de) Laservorrichtung
DE69308082D1 (de) Halbleiterlaservorrichtung
DE69308977D1 (de) Halbleiterlaservorrichtung
DE69206600D1 (de) Laservorrichtung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee