DE69210858D1 - Photoabtrageverfahren von wenigstens einer gestuften Öffnung, die ein polymeres Material durchdringt und eine Düsenplatte, die eine gestufte Öffnung aufweist - Google Patents
Photoabtrageverfahren von wenigstens einer gestuften Öffnung, die ein polymeres Material durchdringt und eine Düsenplatte, die eine gestufte Öffnung aufweistInfo
- Publication number
- DE69210858D1 DE69210858D1 DE69210858T DE69210858T DE69210858D1 DE 69210858 D1 DE69210858 D1 DE 69210858D1 DE 69210858 T DE69210858 T DE 69210858T DE 69210858 T DE69210858 T DE 69210858T DE 69210858 D1 DE69210858 D1 DE 69210858D1
- Authority
- DE
- Germany
- Prior art keywords
- stepped opening
- photo
- penetrates
- polymeric material
- nozzle plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65872691A | 1991-02-21 | 1991-02-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69210858D1 true DE69210858D1 (de) | 1996-06-27 |
DE69210858T2 DE69210858T2 (de) | 1996-11-28 |
Family
ID=24642426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69210858T Expired - Fee Related DE69210858T2 (de) | 1991-02-21 | 1992-02-20 | Photoabtrageverfahren von wenigstens einer gestuften Öffnung, die ein polymeres Material durchdringt und eine Düsenplatte, die eine gestufte Öffnung aufweist |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0500110B1 (de) |
JP (1) | JPH0577425A (de) |
DE (1) | DE69210858T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5291226A (en) * | 1990-08-16 | 1994-03-01 | Hewlett-Packard Company | Nozzle member including ink flow channels |
JP3389256B2 (ja) * | 1992-02-19 | 2003-03-24 | セイコーエプソン株式会社 | ノズルプレートとその製造方法 |
IT1270861B (it) * | 1993-05-31 | 1997-05-13 | Olivetti Canon Ind Spa | Testina a getto di inchiostro perfezionata per una stampante a punti |
CA2217018C (en) | 1995-04-26 | 2006-10-17 | Minnesota Mining And Manufacturing Company | Method and apparatus for step and repeat exposures |
JP3292058B2 (ja) | 1996-10-01 | 2002-06-17 | 三菱電機株式会社 | レーザ光による配線基板の加工方法及びその装置 |
JPH10193618A (ja) * | 1996-11-13 | 1998-07-28 | Canon Inc | 液体噴射記録ヘッドおよびその製造方法 |
JP3480227B2 (ja) * | 1997-03-07 | 2003-12-15 | 富士ゼロックス株式会社 | レーザー加工方法およびレーザー加工装置 |
JPH10258386A (ja) * | 1997-03-14 | 1998-09-29 | Canon Inc | レーザ加工方法および該レーザ加工方法を用いた液体噴射記録ヘッドの製造方法 |
JP2000198199A (ja) | 1997-12-05 | 2000-07-18 | Canon Inc | 液体吐出ヘッドおよびヘッドカートリッジおよび液体吐出装置および液体吐出ヘッドの製造方法 |
EP0921004A3 (de) * | 1997-12-05 | 2000-04-26 | Canon Kabushiki Kaisha | Flüssigkeitsausstosskopf , Aufzeichnungsgerät und Flüssigkeitsausstosskopfenherstellungsverfahren |
GB9812725D0 (en) * | 1998-06-13 | 1998-08-12 | Exitech Ltd | The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages |
US6683276B2 (en) * | 1999-04-26 | 2004-01-27 | Ethicon, Inc. | Method of forming chamfered blind holes in surgical needles using a diode pumped Nd-YAG laser |
US6527370B1 (en) | 1999-09-09 | 2003-03-04 | Hewlett-Packard Company | Counter-boring techniques for improved ink-jet printheads |
JP2001210900A (ja) * | 2000-01-25 | 2001-08-03 | Kyocera Corp | Rf励起方式レーザー装置 |
US20060029955A1 (en) | 2001-03-24 | 2006-02-09 | Antonio Guia | High-density ion transport measurement biochip devices and methods |
US20040017430A1 (en) * | 2002-07-23 | 2004-01-29 | Yosuke Mizuyama | Laser processing method and laser processing apparatus |
DE10243147B4 (de) * | 2002-09-17 | 2006-03-16 | Siemens Ag | Verfahren zum Einbringen einer Lochkontur in ein Werkstück |
GB0509727D0 (en) * | 2005-05-13 | 2005-06-22 | Renishaw Plc | Method and apparatus for scale manufacture |
JP2008221334A (ja) * | 2007-02-17 | 2008-09-25 | Sii Printek Inc | レーザー加工装置、レーザー加工方法、ノズルプレート、インクジェットヘッド及び、インクジェット記録装置 |
US8288682B2 (en) * | 2007-09-28 | 2012-10-16 | Intel Corporation | Forming micro-vias using a two stage laser drilling process |
EP2252427A1 (de) * | 2008-03-17 | 2010-11-24 | Silverbrook Research Pty. Ltd | Doppellaserbohren einer druckkopf-ic-befestigungsfolie |
US8293057B2 (en) | 2008-03-17 | 2012-10-23 | Zamtec Limited | Double laser drilling of a printhead integrated circuit attachment film |
US8646875B2 (en) * | 2010-03-31 | 2014-02-11 | Xerox Corporation | Independent adjustment of drop mass and velocity using stepped nozzles |
US10549386B2 (en) * | 2016-02-29 | 2020-02-04 | Xerox Corporation | Method for ablating openings in unsupported layers |
CN114260590A (zh) * | 2021-12-08 | 2022-04-01 | 西安晟光硅研半导体科技有限公司 | 一种基于多功率微射流激光的SiC切割装置及其切割方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8722085D0 (en) * | 1987-09-19 | 1987-10-28 | Cambridge Consultants | Ink jet nozzle manufacture |
DE3805279A1 (de) * | 1988-02-19 | 1989-08-31 | Siemens Ag | Piezoelektrischer tintendruckkopf und verfahren zu seiner herstellung |
ES2060789T3 (es) * | 1988-10-31 | 1994-12-01 | Canon Kk | Metodo de fabricacion de un cabezal de impresion por chorros de tinta. |
JP3032021B2 (ja) * | 1990-02-02 | 2000-04-10 | キヤノン株式会社 | インクジェット記録装置 |
-
1992
- 1992-02-20 DE DE69210858T patent/DE69210858T2/de not_active Expired - Fee Related
- 1992-02-20 EP EP92102868A patent/EP0500110B1/de not_active Expired - Lifetime
- 1992-02-20 JP JP4070220A patent/JPH0577425A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH0577425A (ja) | 1993-03-30 |
EP0500110B1 (de) | 1996-05-22 |
DE69210858T2 (de) | 1996-11-28 |
EP0500110A1 (de) | 1992-08-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |