DE69208994D1 - Verfahren und Vorrichtung für das Löten in nicht-oxydierender Atmosphäre - Google Patents

Verfahren und Vorrichtung für das Löten in nicht-oxydierender Atmosphäre

Info

Publication number
DE69208994D1
DE69208994D1 DE69208994T DE69208994T DE69208994D1 DE 69208994 D1 DE69208994 D1 DE 69208994D1 DE 69208994 T DE69208994 T DE 69208994T DE 69208994 T DE69208994 T DE 69208994T DE 69208994 D1 DE69208994 D1 DE 69208994D1
Authority
DE
Germany
Prior art keywords
soldering
oxidizing atmosphere
oxidizing
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69208994T
Other languages
English (en)
Other versions
DE69208994T2 (de
Inventor
Colin John Precious
Raymund Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOC Group Ltd
Original Assignee
BOC Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Ltd filed Critical BOC Group Ltd
Application granted granted Critical
Publication of DE69208994D1 publication Critical patent/DE69208994D1/de
Publication of DE69208994T2 publication Critical patent/DE69208994T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
DE69208994T 1991-10-03 1992-09-23 Verfahren und Vorrichtung für das Löten in nicht-oxydierender Atmosphäre Expired - Fee Related DE69208994T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB919121003A GB9121003D0 (en) 1991-10-03 1991-10-03 Soldering

Publications (2)

Publication Number Publication Date
DE69208994D1 true DE69208994D1 (de) 1996-04-18
DE69208994T2 DE69208994T2 (de) 1996-07-25

Family

ID=10702351

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208994T Expired - Fee Related DE69208994T2 (de) 1991-10-03 1992-09-23 Verfahren und Vorrichtung für das Löten in nicht-oxydierender Atmosphäre

Country Status (10)

Country Link
US (1) US5320274A (de)
EP (1) EP0535845B1 (de)
JP (1) JPH05235530A (de)
KR (1) KR100287226B1 (de)
CN (1) CN1038488C (de)
AU (1) AU655061B2 (de)
CA (1) CA2079306A1 (de)
DE (1) DE69208994T2 (de)
GB (1) GB9121003D0 (de)
ZA (1) ZA927129B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2713952B1 (fr) * 1993-12-22 1996-01-12 Air Liquide Dispositif et procédé d'injection de gaz pour la formation d'une atmosphère contrôlée dans un espace confiné.
US5439158A (en) * 1994-02-22 1995-08-08 Sund; William Atmosphere controlled soldering apparatus with incorporated solder pump
US5520320A (en) * 1994-04-22 1996-05-28 Air Liquide America Corporation Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere
JP4923336B2 (ja) * 2001-04-10 2012-04-25 日本電気株式会社 回路基板及び該回路基板を用いた電子機器
JP2002329956A (ja) * 2001-04-27 2002-11-15 Ricoh Co Ltd はんだ付け方法および該はんだ付け方法を用いて製造した電子回路基板ならびに電子機器
US9166130B2 (en) 2012-10-24 2015-10-20 Spectrasensors, Inc. Solderless mounting for semiconductor lasers
DE102006024192A1 (de) * 2006-05-23 2007-11-29 Linde Ag Vorrichtung und Verfahren zum Wellenlöten
ATE501805T1 (de) * 2006-05-23 2011-04-15 Linde Ag Vorrichtung und verfahren zum wellenlöten
DE102006025184B4 (de) * 2006-05-30 2008-02-21 IBL-Löttechnik GmbH Vorrichtung zum Löten in der Dampfphase
US8104662B2 (en) * 2009-07-24 2012-01-31 Flextronics Ap Llc Inert environment enclosure
JP5310634B2 (ja) * 2010-04-09 2013-10-09 千住金属工業株式会社 はんだ付け装置
JP4978723B2 (ja) * 2010-09-17 2012-07-18 千住金属工業株式会社 はんだ付け装置
US9166364B2 (en) 2011-02-14 2015-10-20 Spectrasensors, Inc. Semiconductor laser mounting with intact diffusion barrier layer
US9368934B2 (en) * 2011-02-14 2016-06-14 Spectrasensors, Inc. Semiconductor laser mounting for improved frequency stability
CN103212761B (zh) * 2012-06-26 2015-05-06 深圳市堃琦鑫华股份有限公司 一种焊接方法
JP7249215B2 (ja) * 2019-06-19 2023-03-30 株式会社デンソーテン はんだ付け装置およびはんだ付け装置の制御方法
DE102021102393B3 (de) * 2021-02-02 2022-06-15 Rehm Thermal Systems Gmbh Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen
CN114871781B (zh) * 2022-05-18 2024-02-27 淮南市泰能电力工程有限公司 具备镍基合金超声氩弧焊焊缝的压水堆装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144860A (en) * 1980-04-14 1981-11-11 Fuji Electric Co Ltd Conveyor furnace
US4580716A (en) * 1984-10-17 1986-04-08 Rca Corporation Apparatus and method for vapor phase solder reflow
DE8520254U1 (de) * 1985-07-11 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Lötvorrichtung zum Löten elektronischer Flachbaugruppen in einer schutzgasgefüllten Lötkammer
JPS63174778A (ja) * 1987-01-11 1988-07-19 Daiichi Tsusho:Kk 自動半田付け方法及び装置
DE3737563A1 (de) * 1987-11-05 1989-05-18 Ernst Hohnerlein Loetmaschine
EP0440264A1 (de) * 1987-11-05 1991-08-07 Ernst Hohnerlein Verfahren und Vorrichtung zum Löten unter Schutzgas
US4838476A (en) * 1987-11-12 1989-06-13 Fluocon Technologies Inc. Vapour phase treatment process and apparatus
DE3843191C2 (de) * 1988-12-22 1994-09-15 Broadcast Television Syst Vorrichtung zum Löten
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
FR2670986B1 (fr) * 1990-12-20 1996-08-02 Air Liquide Dispositif d'inertage de bain de soudure d'une machine de soudage a la vague.
JPH04262865A (ja) * 1991-01-22 1992-09-18 Kenji Kondo はんだ付け装置
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife

Also Published As

Publication number Publication date
GB9121003D0 (en) 1991-11-13
US5320274A (en) 1994-06-14
DE69208994T2 (de) 1996-07-25
CA2079306A1 (en) 1993-04-04
EP0535845B1 (de) 1996-03-13
EP0535845A1 (de) 1993-04-07
KR930009488A (ko) 1993-05-22
ZA927129B (en) 1993-03-18
JPH05235530A (ja) 1993-09-10
CN1038488C (zh) 1998-05-27
KR100287226B1 (ko) 2001-09-17
AU655061B2 (en) 1994-12-01
AU2286692A (en) 1993-04-08
CN1074156A (zh) 1993-07-14

Similar Documents

Publication Publication Date Title
DE69208994T2 (de) Verfahren und Vorrichtung für das Löten in nicht-oxydierender Atmosphäre
DE69314802D1 (de) Verfahren und vorrichtung zum verdichten
GB2233121B (en) Work positioning method and apparatus
DE69117832D1 (de) Verfahren und Vorrichtung für die Thrombektomie
DE69232587D1 (de) Elektrochirurgische vorrichtung für die laproskopie und ähnliche verfahren
DE69024636D1 (de) Verfahren und apparatur für sequentielle mikrobielle anreicherung in einer einzigen vorrichtung
DE59208277D1 (de) Verfahren und vorrichtung für die emissionsspektroskopie
DE59204722D1 (de) Verfahren und Vorrichtung zum Kommissionieren
DE69327976T2 (de) Verfahren und Vorrichtung zum Aufschmelzlöten
DE58903199D1 (de) Verfahren und vorrichtung zum betrieb einer loetstation.
DE69210650T2 (de) Vorrichtung und Verfahren zum Elektroplattieren
DE68914667D1 (de) Verfahren und vorrichtung für temporäre linienmarkierung.
DE69016818T2 (de) Verfahren und Vorrichtung zum Aufwickeln.
DE69500725D1 (de) Verfahren und Gerät zum Löten
DE69228160D1 (de) Vorrichtung und Verfahren zum Beschichten
DE69208442T2 (de) Vorrichtung und Verfahren zum Vorbereiten von Metallstangen für das Hartlöten
DE69007363T2 (de) Verfahren und Vorrichtung zum Löten von Gegenständen.
DE69217096T2 (de) Vorrichtung und Verfahren für die kontinuierliche Durchschaltung in ATM
GB2236069B (en) Method and apparatus for use in micropropagation
DE69123669D1 (de) Verfahren und Vorrichtung zum Sintern
ATA45092A (de) Verfahren und vorrichtung zum bereithalten und kommissionieren
DE69017286T2 (de) Vorrichtung und Verfahren zum elektronischen Aktenablegen.
DE69304293D1 (de) Verfahren und Vorrichtung zum Positionieren von Stangen in einer Drehmaschine
DD296453A5 (de) Verfahren und vorrichtung zum drahtklammerheften
ATE104162T1 (de) Verfahren und vorrichtung fuer temporaere linienmarkierung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee