DE69133487D1 - Verfahren zur Herstellung eines dünnen metallischen Films - Google Patents
Verfahren zur Herstellung eines dünnen metallischen FilmsInfo
- Publication number
- DE69133487D1 DE69133487D1 DE69133487T DE69133487T DE69133487D1 DE 69133487 D1 DE69133487 D1 DE 69133487D1 DE 69133487 T DE69133487 T DE 69133487T DE 69133487 T DE69133487 T DE 69133487T DE 69133487 D1 DE69133487 D1 DE 69133487D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- metallic film
- thin metallic
- thin
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0545—Dispersions or suspensions of nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/12—Making metallic powder or suspensions thereof using physical processes starting from gaseous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Conductive Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2081635A JPH03281783A (ja) | 1990-03-29 | 1990-03-29 | 金属薄膜の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69133487D1 true DE69133487D1 (de) | 2006-02-09 |
DE69133487T2 DE69133487T2 (de) | 2006-06-14 |
Family
ID=13751800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69133487T Expired - Lifetime DE69133487T2 (de) | 1990-03-29 | 1991-03-28 | Verfahren zur Herstellung eines dünnen metallischen Films |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0449309B9 (de) |
JP (1) | JPH03281783A (de) |
DE (1) | DE69133487T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0591604B1 (de) * | 1992-10-05 | 1997-07-02 | E.I. Du Pont De Nemours And Company | Zusammensetzungen zum Füllen von Durchgangslöchern |
JP3422233B2 (ja) * | 1997-09-26 | 2003-06-30 | 株式会社村田製作所 | バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法 |
JP2001035814A (ja) * | 1999-07-22 | 2001-02-09 | Vacuum Metallurgical Co Ltd | 銀配線パターンの形成法 |
EP1158573A4 (de) * | 1999-10-15 | 2008-09-24 | Ebara Corp | Methode und apparat zur verbindungsformung |
EP1153762A4 (de) * | 1999-10-19 | 2007-07-11 | Ebara Corp | Optischer aufzeichnungsträger und vorrichtung zur herstellung |
US6486413B1 (en) * | 1999-11-17 | 2002-11-26 | Ebara Corporation | Substrate coated with a conductive layer and manufacturing method thereof |
TW476073B (en) | 1999-12-09 | 2002-02-11 | Ebara Corp | Solution containing metal component, method of and apparatus for forming thin metal film |
US6519842B2 (en) * | 1999-12-10 | 2003-02-18 | Ebara Corporation | Method for mounting semiconductor device |
JP3841607B2 (ja) * | 2000-02-03 | 2006-11-01 | 三井金属鉱業株式会社 | ニッケル粉及び導電ペースト |
US6743395B2 (en) * | 2000-03-22 | 2004-06-01 | Ebara Corporation | Composite metallic ultrafine particles and process for producing the same |
JP4670497B2 (ja) * | 2004-06-17 | 2011-04-13 | 三菱マテリアル株式会社 | 薄膜電極用ペースト並びに薄膜電極及び薄膜素子の製造方法 |
WO2006076611A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Production of metal nanoparticles |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
JP4918994B2 (ja) | 2005-05-30 | 2012-04-18 | 住友電気工業株式会社 | 金属被膜の形成方法および金属配線 |
DE112007001519B4 (de) | 2006-06-22 | 2022-03-10 | Mitsubishi Paper Mills Limited | Verfahren zum Herstellen eines leitfähigen Materials |
US8253137B2 (en) | 2007-07-18 | 2012-08-28 | Ricoh Company, Ltd. | Laminate structure, electronic device, and display device |
JP5386852B2 (ja) | 2008-05-07 | 2014-01-15 | 株式会社リコー | 積層構造体、半導体装置、積層構造体の製造方法及び半導体装置の製造方法 |
JP5157662B2 (ja) * | 2008-06-13 | 2013-03-06 | 日本電気株式会社 | 電気回路用配線、その製造装置、その製造方法及び分散剤の回収方法 |
JP5489358B2 (ja) * | 2011-03-24 | 2014-05-14 | 富士フイルム株式会社 | 銅配線の形成方法、配線基板の製造方法および配線基板 |
KR101081864B1 (ko) * | 2011-04-01 | 2011-11-09 | 한국에너지기술연구원 | 휘발성이 우수한 고순도 SIOx나노 분말 제조 방법 및 그 제조 장치 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4122023B1 (de) * | 1963-02-14 | 1966-12-22 | ||
DE3134918A1 (de) * | 1981-09-03 | 1983-03-17 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben" |
JPS5876287A (ja) * | 1981-10-31 | 1983-05-09 | Mitsubishi Electric Corp | サ−マルヘツド |
JPS60192658A (ja) * | 1984-03-13 | 1985-10-01 | Mitsubishi Electric Corp | 厚膜型サ−マルヘツド |
US4617237A (en) * | 1984-05-14 | 1986-10-14 | Allied Corporation | Production of conductive metal silicide films from ultrafine powders |
JPS6334157A (ja) * | 1986-07-29 | 1988-02-13 | Mitsubishi Electric Corp | サ−マルヘツドの導体形成方法 |
US4793946A (en) * | 1986-10-06 | 1988-12-27 | Engelhard Corporation | Thin print etchable gold conductor composition |
-
1990
- 1990-03-29 JP JP2081635A patent/JPH03281783A/ja active Pending
-
1991
- 1991-03-28 EP EP91105070A patent/EP0449309B9/de not_active Expired - Lifetime
- 1991-03-28 DE DE69133487T patent/DE69133487T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH03281783A (ja) | 1991-12-12 |
EP0449309B1 (de) | 2005-09-28 |
EP0449309A3 (en) | 1994-08-17 |
EP0449309A2 (de) | 1991-10-02 |
DE69133487T2 (de) | 2006-06-14 |
EP0449309B9 (de) | 2006-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69133487T2 (de) | Verfahren zur Herstellung eines dünnen metallischen Films | |
DE69216747D1 (de) | Verfahren zur Bildung eines dünnen Films | |
DE69324633D1 (de) | Verfahren zur Herstellung eines einkristallinen Dünnfilmes | |
DE69224888D1 (de) | Verfahren zur Herstellung eines chemisch adsorbierten Films | |
DE69203875D1 (de) | Verfahren zur Herstellung eines chemisch adsorbierten Films. | |
DE69106091D1 (de) | Verfahren zur Abscheidung eines dünnen Films. | |
DE68920417D1 (de) | Verfahren zur Herstellung eines kohlenstoffhaltigen Films. | |
DE69011729D1 (de) | Verfahren zur Herstellung eines Graphitfilms. | |
DE69118043D1 (de) | Verfahren zur Herstellung eines kupferkaschierten Laminats | |
DE69423991D1 (de) | Verfahren zur Herstellung eines Siliciumoxidfilmes | |
DE69304252D1 (de) | Verfahren zur Herstellung eines chemisch adsorbierten Filmes | |
DE69404569D1 (de) | Verfahren zur herstellung eines porösen films aus polytetrafluorethylen | |
DE69122069D1 (de) | Verfahren zur Herstellung eines aufgedampften Films | |
DE69120745D1 (de) | Verfahren zur Züchtung eines dünnen kristallinen Films | |
DE69232102D1 (de) | Verfahren zur Herstellung eines Mehrschichtenverbundfilms | |
DE69418549D1 (de) | Verfahren zur Herstellung eines Partikelnfilmes | |
DE69204538D1 (de) | Verfahren zur Herstellung eines Beschichtungsfilms. | |
DE3887907D1 (de) | Verfahren zur Herstellung eines hochmodularen Films. | |
DE69218276D1 (de) | Verfahren zur Herstellung eines zusammengesetzten Films auf einem metallischen Substrat | |
DE3752094D1 (de) | Verfahren zur Herstellung eines ferroelektrischen Film | |
DE69206838D1 (de) | Verfahren zur Herstellung eines chemisch absorbierten Films | |
DE3574740D1 (de) | Verfahren zur herstellung eines keramischen films. | |
DE69318380D1 (de) | Verfahren zur Herstellung eines Orientierungsfilmes | |
DE69013948D1 (de) | Verfahren zur Herstellung eines dünnen Filmes. | |
DE3864056D1 (de) | Verfahren zur herstellung eines supraleitenden duennen films und vorrichtung hierfuer. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ULVAC, INC., CHIGASAKI-SHI, KANAGAWA, JP |