DE6912949U - Halbleitergleichrichter. - Google Patents

Halbleitergleichrichter.

Info

Publication number
DE6912949U
DE6912949U DE6912949U DE6912949U DE6912949U DE 6912949 U DE6912949 U DE 6912949U DE 6912949 U DE6912949 U DE 6912949U DE 6912949 U DE6912949 U DE 6912949U DE 6912949 U DE6912949 U DE 6912949U
Authority
DE
Germany
Prior art keywords
semiconductor
disk
electrodes
rectifier
semiconductor body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE6912949U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE6912949U publication Critical patent/DE6912949U/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed

Landscapes

  • Die Bonding (AREA)
DE6912949U 1968-04-09 1969-03-31 Halbleitergleichrichter. Expired DE6912949U (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71996668A 1968-04-09 1968-04-09

Publications (1)

Publication Number Publication Date
DE6912949U true DE6912949U (de) 1972-09-14

Family

ID=24892121

Family Applications (2)

Application Number Title Priority Date Filing Date
DE6912949U Expired DE6912949U (de) 1968-04-09 1969-03-31 Halbleitergleichrichter.
DE19691916399 Pending DE1916399A1 (de) 1968-04-09 1969-03-31 Halbleitergleichrichter

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19691916399 Pending DE1916399A1 (de) 1968-04-09 1969-03-31 Halbleitergleichrichter

Country Status (5)

Country Link
US (1) US3581163A (https=)
DE (2) DE6912949U (https=)
FR (1) FR2005892A1 (https=)
GB (1) GB1258309A (https=)
SE (1) SE354742B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE350874B (https=) * 1970-03-05 1972-11-06 Asea Ab
US3800192A (en) * 1970-08-11 1974-03-26 O Schaerli Semiconductor circuit element with pressure contact means
DE2556749A1 (de) * 1975-12-17 1977-06-23 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement in scheibenzellenbauweise
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
US4402004A (en) * 1978-01-07 1983-08-30 Tokyo Shibaura Denki Kabushiki Kaisha High current press pack semiconductor device having a mesa structure
JPS5929143B2 (ja) * 1978-01-07 1984-07-18 株式会社東芝 電力用半導体装置
US4327370A (en) * 1979-06-28 1982-04-27 Rca Corporation Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device
US7534979B2 (en) * 2004-05-14 2009-05-19 Mitsubishi Denki Kabushiki Kaisha Pressure-contact type rectifier with contact friction reducer
WO2008060447A2 (en) * 2006-11-09 2008-05-22 Quantum Leap Packaging, Inc. Microcircuit package having ductile layer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE534817A (https=) * 1954-01-14 1900-01-01
US3268309A (en) * 1964-03-30 1966-08-23 Gen Electric Semiconductor contact means
US3293508A (en) * 1964-04-21 1966-12-20 Int Rectifier Corp Compression connected semiconductor device
SE312860B (https=) * 1964-09-28 1969-07-28 Asea Ab
GB1140677A (en) * 1965-05-07 1969-01-22 Ass Elect Ind Improvements relating to semi-conductor devices
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting

Also Published As

Publication number Publication date
GB1258309A (https=) 1971-12-30
FR2005892A1 (https=) 1969-12-19
US3581163A (en) 1971-05-25
DE1916399A1 (de) 1969-10-23
SE354742B (https=) 1973-03-19

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