FR2005892A1 - - Google Patents

Info

Publication number
FR2005892A1
FR2005892A1 FR6910962A FR6910962A FR2005892A1 FR 2005892 A1 FR2005892 A1 FR 2005892A1 FR 6910962 A FR6910962 A FR 6910962A FR 6910962 A FR6910962 A FR 6910962A FR 2005892 A1 FR2005892 A1 FR 2005892A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6910962A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2005892A1 publication Critical patent/FR2005892A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
FR6910962A 1968-04-09 1969-04-09 Withdrawn FR2005892A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71996668A 1968-04-09 1968-04-09

Publications (1)

Publication Number Publication Date
FR2005892A1 true FR2005892A1 (https=) 1969-12-19

Family

ID=24892121

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6910962A Withdrawn FR2005892A1 (https=) 1968-04-09 1969-04-09

Country Status (5)

Country Link
US (1) US3581163A (https=)
DE (2) DE6912949U (https=)
FR (1) FR2005892A1 (https=)
GB (1) GB1258309A (https=)
SE (1) SE354742B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE350874B (https=) * 1970-03-05 1972-11-06 Asea Ab
US3800192A (en) * 1970-08-11 1974-03-26 O Schaerli Semiconductor circuit element with pressure contact means
DE2556749A1 (de) * 1975-12-17 1977-06-23 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement in scheibenzellenbauweise
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
US4402004A (en) * 1978-01-07 1983-08-30 Tokyo Shibaura Denki Kabushiki Kaisha High current press pack semiconductor device having a mesa structure
JPS5929143B2 (ja) * 1978-01-07 1984-07-18 株式会社東芝 電力用半導体装置
US4327370A (en) * 1979-06-28 1982-04-27 Rca Corporation Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device
US7534979B2 (en) * 2004-05-14 2009-05-19 Mitsubishi Denki Kabushiki Kaisha Pressure-contact type rectifier with contact friction reducer
WO2008060447A2 (en) * 2006-11-09 2008-05-22 Quantum Leap Packaging, Inc. Microcircuit package having ductile layer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE534817A (https=) * 1954-01-14 1900-01-01
US3268309A (en) * 1964-03-30 1966-08-23 Gen Electric Semiconductor contact means
US3293508A (en) * 1964-04-21 1966-12-20 Int Rectifier Corp Compression connected semiconductor device
SE312860B (https=) * 1964-09-28 1969-07-28 Asea Ab
GB1140677A (en) * 1965-05-07 1969-01-22 Ass Elect Ind Improvements relating to semi-conductor devices
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting

Also Published As

Publication number Publication date
GB1258309A (https=) 1971-12-30
US3581163A (en) 1971-05-25
DE1916399A1 (de) 1969-10-23
DE6912949U (de) 1972-09-14
SE354742B (https=) 1973-03-19

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Legal Events

Date Code Title Description
ST Notification of lapse