DE69127372D1 - Anordnung zum transportieren von substraten in form dünner plättchen - Google Patents

Anordnung zum transportieren von substraten in form dünner plättchen

Info

Publication number
DE69127372D1
DE69127372D1 DE69127372T DE69127372T DE69127372D1 DE 69127372 D1 DE69127372 D1 DE 69127372D1 DE 69127372 T DE69127372 T DE 69127372T DE 69127372 T DE69127372 T DE 69127372T DE 69127372 D1 DE69127372 D1 DE 69127372D1
Authority
DE
Germany
Prior art keywords
arrangement
thin plates
transporting substrates
transporting
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69127372T
Other languages
English (en)
Other versions
DE69127372T2 (de
Inventor
Masayuki Toda
Takashi Onoda
Tadahiro Ohmi
Masaru Umeda
Yoichi Kanno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M Watanabe and Co Ltd
Original Assignee
M Watanabe and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M Watanabe and Co Ltd filed Critical M Watanabe and Co Ltd
Application granted granted Critical
Publication of DE69127372D1 publication Critical patent/DE69127372D1/de
Publication of DE69127372T2 publication Critical patent/DE69127372T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69127372T 1990-11-16 1991-10-28 Anordnung zum transportieren von substraten in form dünner plättchen Expired - Fee Related DE69127372T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30887190 1990-11-16
PCT/JP1991/001469 WO1992009103A1 (en) 1990-11-16 1991-10-28 Device and method for carrying thin plate-like substrate

Publications (2)

Publication Number Publication Date
DE69127372D1 true DE69127372D1 (de) 1997-09-25
DE69127372T2 DE69127372T2 (de) 1998-03-19

Family

ID=17986266

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69127372T Expired - Fee Related DE69127372T2 (de) 1990-11-16 1991-10-28 Anordnung zum transportieren von substraten in form dünner plättchen
DE69132324T Expired - Fee Related DE69132324T2 (de) 1990-11-16 1991-10-28 Methode zum Transportieren von Substraten mit plattenförmiger Grundlage

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69132324T Expired - Fee Related DE69132324T2 (de) 1990-11-16 1991-10-28 Methode zum Transportieren von Substraten mit plattenförmiger Grundlage

Country Status (4)

Country Link
US (2) US5518360A (de)
EP (2) EP0557523B1 (de)
DE (2) DE69127372T2 (de)
WO (1) WO1992009103A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0557523B1 (de) * 1990-11-16 1997-08-20 Kabushiki Kaisha Watanabe Shoko Anordnung zum transportieren von substraten in form dünner plättchen
EP0671871B1 (de) * 1992-08-14 2003-07-02 Takasago Netsugaku Kogyo Kabushiki Kaisha Vorrichtung und verfahren zur herstellung von gasförmigen ionen unter verwendung von röntgenstrahlen und deren anwendung in verschiedenen geräten und strukturen
EP0809284B8 (de) * 1995-12-28 2007-06-13 Taiyo Nippon Sanso Corporation Verfahren und Anordnung zum Transport von Substratscheiben
JP3901265B2 (ja) * 1996-11-26 2007-04-04 大陽日酸株式会社 薄板状基体の搬送方法及び搬送装置
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
JP3298810B2 (ja) * 1997-07-09 2002-07-08 株式会社新川 ダイボンディング装置
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
JP2002054634A (ja) * 2000-08-07 2002-02-20 Nippon Steel Corp 静圧気体軸受
US6676365B2 (en) * 2001-03-16 2004-01-13 Toda Kogyo Corporation Air track conveyor system for disk production
DE10145686B4 (de) * 2001-09-15 2006-04-06 Schott Ag Vorrichtung zum berührungslosen Fördern eines Gegenstandes aus Glas oder Glaskeramik
EP1576299B1 (de) * 2002-12-18 2008-01-23 Koninklijke Philips Electronics N.V. Gaslagersystem
KR100956348B1 (ko) * 2003-09-05 2010-05-06 삼성전자주식회사 인라인 반송 시스템
US6905300B1 (en) * 2004-01-16 2005-06-14 Dmetrix, Inc. Slide feeder with air bearing conveyor
JP5291281B2 (ja) * 2004-06-28 2013-09-18 株式会社渡辺商行 浮上搬送装置及び浮上搬送方法
DE102004057754B4 (de) * 2004-11-30 2007-08-09 Steag Hama Tech Ag Verfahren und Vorrichtung zum Behandeln von ein Innenloch aufweisenden Substratscheiben
US7080962B1 (en) * 2005-05-31 2006-07-25 Kimberly-Clark Worldwide, Inc. Air conveyance apparatus
JP4755498B2 (ja) * 2006-01-06 2011-08-24 東京エレクトロン株式会社 加熱装置及び加熱方法
CN101769336B (zh) * 2009-01-05 2013-02-13 鸿富锦精密工业（深圳）有限公司 空气导轨
EP2409318A2 (de) * 2009-03-16 2012-01-25 Alta Devices, Inc. Gasphasenabscheidungsreaktorsystem und verfahren dafür
JP4919115B2 (ja) * 2009-09-24 2012-04-18 横河電機株式会社 放射線検査装置
US8834073B2 (en) * 2010-10-29 2014-09-16 Corning Incorporated Transport apparatus having a measuring system and methods therefor
CN103381965B (zh) * 2013-07-02 2016-02-03 深圳市华星光电技术有限公司 一种液晶面板的气浮式导向轮传送装置
KR101839345B1 (ko) * 2016-10-27 2018-03-16 세메스 주식회사 기판 플로팅 장치 및 기판 플로팅 방법
US9889995B1 (en) * 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3797889A (en) * 1971-12-30 1974-03-19 Texas Instruments Inc Workpiece alignment system
US3923342A (en) * 1974-06-10 1975-12-02 Motorola Inc Apparatus and method for handling frangible objects
US4081201A (en) * 1976-12-27 1978-03-28 International Business Machines Corporation Wafer air film transportation system
US4165132A (en) * 1977-02-28 1979-08-21 International Business Machines Corporation Pneumatic control of the motion of objects suspended on an air film
US4618292A (en) * 1977-02-28 1986-10-21 International Business Machines Corporation Controls for semiconductor wafer orientor
JPS5538828A (en) * 1978-09-13 1980-03-18 Ajinomoto Co Inc Stabilized halogen-containing resin composition
US4242038A (en) * 1979-06-29 1980-12-30 International Business Machines Corporation Wafer orienting apparatus
NL8103979A (nl) * 1981-08-26 1983-03-16 Bok Edward Methode en inrichting voor het aanbrengen van een film vloeibaar medium op een substraat.
JPS594022A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd スピンエアベアリング
US4540326A (en) * 1982-09-17 1985-09-10 Nacom Industries, Inc. Semiconductor wafer transport system
JPS59215718A (ja) * 1983-05-23 1984-12-05 Kokusai Electric Co Ltd 半導体基板の赤外線熱処理装置
JPS6015318A (ja) * 1983-07-08 1985-01-26 Hitachi Ltd 半導体ウェハの搬送装置
US4624617A (en) * 1984-10-09 1986-11-25 David Belna Linear induction semiconductor wafer transportation apparatus
KR900001666B1 (ko) * 1985-07-19 1990-03-17 후지쓰가부시끼가이샤 화합물 반도체의 에피택셜층 성장용의 화학적 유기 금속 기상 성장장치
DE3923405A1 (de) * 1989-07-14 1991-01-24 Wacker Chemitronic Vorrichtung zum transportieren und positionieren von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, und verfahren zur nasschemischen oberflaechenbehandlung derselben
EP0557523B1 (de) * 1990-11-16 1997-08-20 Kabushiki Kaisha Watanabe Shoko Anordnung zum transportieren von substraten in form dünner plättchen
JPH0812847B2 (ja) * 1991-04-22 1996-02-07 株式会社半導体プロセス研究所 半導体製造装置及び半導体装置の製造方法
JP3330166B2 (ja) * 1992-12-04 2002-09-30 東京エレクトロン株式会社 処理装置

Also Published As

Publication number Publication date
EP0747931A3 (de) 1997-05-02
US5921744A (en) 1999-07-13
EP0557523A4 (de) 1994-02-09
DE69132324D1 (de) 2000-08-17
EP0557523B1 (de) 1997-08-20
US5518360A (en) 1996-05-21
WO1992009103A1 (en) 1992-05-29
EP0557523A1 (de) 1993-09-01
DE69132324T2 (de) 2001-01-04
DE69127372T2 (de) 1998-03-19
EP0747931B1 (de) 2000-07-12
EP0747931A2 (de) 1996-12-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee