DE69127186D1 - Eine TAB-Packung und eine Flüssigkeitskristallplatte die diese Packung anwendet - Google Patents

Eine TAB-Packung und eine Flüssigkeitskristallplatte die diese Packung anwendet

Info

Publication number
DE69127186D1
DE69127186D1 DE69127186T DE69127186T DE69127186D1 DE 69127186 D1 DE69127186 D1 DE 69127186D1 DE 69127186 T DE69127186 T DE 69127186T DE 69127186 T DE69127186 T DE 69127186T DE 69127186 D1 DE69127186 D1 DE 69127186D1
Authority
DE
Germany
Prior art keywords
pack
liquid crystal
crystal panel
tab
tab pack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69127186T
Other languages
English (en)
Other versions
DE69127186T2 (de
Inventor
Kazuhiko Fukuta
Naoyuki Tajima
Yasunori Chikawa
Takaaki Tsuda
Takamichi Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69127186D1 publication Critical patent/DE69127186D1/de
Application granted granted Critical
Publication of DE69127186T2 publication Critical patent/DE69127186T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
DE69127186T 1990-11-28 1991-03-14 Eine TAB-Packung und eine Flüssigkeitskristallplatte die diese Packung anwendet Expired - Lifetime DE69127186T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2331468A JP2857492B2 (ja) 1990-11-28 1990-11-28 Ｔａｂパッケージ

Publications (2)

Publication Number Publication Date
DE69127186D1 true DE69127186D1 (de) 1997-09-11
DE69127186T2 DE69127186T2 (de) 1998-02-05

Family

ID=18243983

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69127186T Expired - Lifetime DE69127186T2 (de) 1990-11-28 1991-03-14 Eine TAB-Packung und eine Flüssigkeitskristallplatte die diese Packung anwendet

Country Status (5)

Country Link
US (1) US5153705A (de)
EP (1) EP0493870B1 (de)
JP (1) JP2857492B2 (de)
KR (1) KR920010332A (de)
DE (1) DE69127186T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2878066B2 (ja) 1993-05-24 1999-04-05 シャープ株式会社 印刷回路基板の接続方法
JP3569025B2 (ja) * 1995-04-24 2004-09-22 東芝電子エンジニアリング株式会社 半導体装置、およびそれを用いた電子装置
KR100514558B1 (ko) 1998-09-09 2005-09-13 세이코 엡슨 가부시키가이샤 반도체 장치 및 그 제조방법, 회로기판 및 전자기기
JP2001237280A (ja) * 2000-02-22 2001-08-31 Nec Corp テープキャリア型半導体装置および可撓性フィルム接続基板
KR100765478B1 (ko) * 2005-08-12 2007-10-09 삼성전자주식회사 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치
KR20090067744A (ko) 2007-12-21 2009-06-25 엘지전자 주식회사 연성 필름
KR101054433B1 (ko) * 2007-12-27 2011-08-04 엘지전자 주식회사 연성 필름 및 그를 포함하는 표시장치
KR100949118B1 (ko) * 2008-12-29 2010-03-23 삼성전자주식회사 백 라이트 어셈블리 및 이를 포함하는 액정표시장치
KR102535363B1 (ko) * 2016-07-11 2023-05-24 삼성디스플레이 주식회사 표시 패널 및 이를 포함하는 표시 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758346A (en) * 1980-09-24 1982-04-08 Nec Corp Tape carrier for semiconductor device
DE3036439C2 (de) * 1980-09-26 1982-10-21 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung eines Rückseitenkontaktes bei filmmontierten integrierten Schaltkreisen
JPS618960A (ja) * 1984-06-25 1986-01-16 Hitachi Hokkai Semiconductor Kk リ−ドフレ−ム
JPS61121078A (ja) * 1984-11-16 1986-06-09 松下電器産業株式会社 平板型デバイスの電極接続構造体
JPH0656872B2 (ja) * 1985-03-14 1994-07-27 九州日立マクセル株式会社 半導体装置のリ−ドフレ−ム
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
JPS63250849A (ja) * 1987-04-08 1988-10-18 Hitachi Cable Ltd ワイヤ−ボンデイング特性に優れたリ−ドフレ−ム
JP2641869B2 (ja) * 1987-07-24 1997-08-20 三菱電機株式会社 半導体装置の製造方法
DE3731787C2 (de) * 1987-09-22 2000-11-16 Aeg Ges Moderne Inf Sys Mbh Anordnung von mehreren IC's auf einem Bandstreifen aus Isoliermaterial
US4967260A (en) * 1988-05-04 1990-10-30 International Electronic Research Corp. Hermetic microminiature packages
EP0388312A3 (de) * 1989-03-17 1991-04-24 Furukawa Denki Kogyo Kabushiki Kaisha Chipträger mit verbesserter Flexibilität
US5018005A (en) * 1989-12-27 1991-05-21 Motorola Inc. Thin, molded, surface mount electronic device
JP3033227B2 (ja) * 1990-05-08 2000-04-17 セイコーエプソン株式会社 半導体装置

Also Published As

Publication number Publication date
EP0493870A3 (en) 1992-07-22
JP2857492B2 (ja) 1999-02-17
JPH04196555A (ja) 1992-07-16
US5153705A (en) 1992-10-06
KR920010332A (ko) 1992-06-26
EP0493870B1 (de) 1997-08-06
DE69127186T2 (de) 1998-02-05
EP0493870A2 (de) 1992-07-08

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Legal Events

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