DE69121842D1 - Dünne Metallschicht mit ausgezeichneter Übertragungsfähigkeit und Verfahren zu ihrer Herstellung - Google Patents

Dünne Metallschicht mit ausgezeichneter Übertragungsfähigkeit und Verfahren zu ihrer Herstellung

Info

Publication number
DE69121842D1
DE69121842D1 DE69121842T DE69121842T DE69121842D1 DE 69121842 D1 DE69121842 D1 DE 69121842D1 DE 69121842 T DE69121842 T DE 69121842T DE 69121842 T DE69121842 T DE 69121842T DE 69121842 D1 DE69121842 D1 DE 69121842D1
Authority
DE
Germany
Prior art keywords
production
metal layer
thin metal
excellent transferability
transferability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69121842T
Other languages
English (en)
Other versions
DE69121842T2 (de
Inventor
Takao Hosokawa
Yoshiaki Kohno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE69121842D1 publication Critical patent/DE69121842D1/de
Application granted granted Critical
Publication of DE69121842T2 publication Critical patent/DE69121842T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DE1991621842 1990-11-05 1991-11-05 Dünne Metallschicht mit ausgezeichneter Übertragungsfähigkeit und Verfahren zu ihrer Herstellung Expired - Lifetime DE69121842T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30034790 1990-11-05
JP3144591A JP2990621B2 (ja) 1990-11-05 1991-06-17 積層セラミック電子部品の製造方法

Publications (2)

Publication Number Publication Date
DE69121842D1 true DE69121842D1 (de) 1996-10-10
DE69121842T2 DE69121842T2 (de) 1997-02-20

Family

ID=26475961

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991621842 Expired - Lifetime DE69121842T2 (de) 1990-11-05 1991-11-05 Dünne Metallschicht mit ausgezeichneter Übertragungsfähigkeit und Verfahren zu ihrer Herstellung

Country Status (4)

Country Link
EP (1) EP0485176B1 (de)
JP (1) JP2990621B2 (de)
DE (1) DE69121842T2 (de)
SG (1) SG42991A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3252534B2 (ja) * 1993-06-10 2002-02-04 株式会社村田製作所 基板への導電パターン形成方法
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
JP3099640B2 (ja) * 1994-06-14 2000-10-16 株式会社村田製作所 焼結体内蔵抵抗体の製造方法及び積層セラミック電子部品の製造方法
KR100231356B1 (ko) 1994-09-12 1999-11-15 모리시타요이찌 적층형 세라믹칩 인덕터 및 그 제조방법
US6911887B1 (en) 1994-09-12 2005-06-28 Matsushita Electric Industrial Co., Ltd. Inductor and method for producing the same
KR100276052B1 (ko) * 1994-10-04 2000-12-15 모리시타 요이찌 전사도체의 제조방법 및 적층용 그린시트의 제조방법
EP0732735B1 (de) * 1995-03-16 2005-12-14 Murata Manufacturing Co., Ltd. Monolithisches Keramikbauelement und seine Herstellung
JP2002050519A (ja) * 2000-08-04 2002-02-15 Sony Corp 高周波コイル装置及びその製造方法
JP4595183B2 (ja) * 2000-09-11 2010-12-08 株式会社村田製作所 セラミック電子部品およびその製造方法ならびに積層型セラミック電子部品およびその製造方法
JP3656612B2 (ja) * 2001-06-08 2005-06-08 株式会社村田製作所 金属膜およびその製造方法ならびに積層セラミック電子部品およびその製造方法
JP4702711B2 (ja) * 2001-07-24 2011-06-15 東レフィルム加工株式会社 金属化フィルム及び金属箔
JP2003145674A (ja) * 2001-11-08 2003-05-20 Learonal Japan Inc 樹脂複合材料の形成方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product
US4568413A (en) * 1983-07-25 1986-02-04 James J. Toth Metallized and plated laminates
JPH0754780B2 (ja) * 1987-08-10 1995-06-07 株式会社村田製作所 積層セラミックコンデンサの製造方法

Also Published As

Publication number Publication date
SG42991A1 (en) 1997-10-17
JP2990621B2 (ja) 1999-12-13
DE69121842T2 (de) 1997-02-20
EP0485176A2 (de) 1992-05-13
EP0485176A3 (en) 1992-07-08
EP0485176B1 (de) 1996-09-04
JPH04314876A (ja) 1992-11-06

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