DE69121842D1 - Dünne Metallschicht mit ausgezeichneter Übertragungsfähigkeit und Verfahren zu ihrer Herstellung - Google Patents
Dünne Metallschicht mit ausgezeichneter Übertragungsfähigkeit und Verfahren zu ihrer HerstellungInfo
- Publication number
- DE69121842D1 DE69121842D1 DE69121842T DE69121842T DE69121842D1 DE 69121842 D1 DE69121842 D1 DE 69121842D1 DE 69121842 T DE69121842 T DE 69121842T DE 69121842 T DE69121842 T DE 69121842T DE 69121842 D1 DE69121842 D1 DE 69121842D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- metal layer
- thin metal
- excellent transferability
- transferability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/308—Stacked capacitors made by transfer techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30034790 | 1990-11-05 | ||
JP3144591A JP2990621B2 (ja) | 1990-11-05 | 1991-06-17 | 積層セラミック電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69121842D1 true DE69121842D1 (de) | 1996-10-10 |
DE69121842T2 DE69121842T2 (de) | 1997-02-20 |
Family
ID=26475961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1991621842 Expired - Lifetime DE69121842T2 (de) | 1990-11-05 | 1991-11-05 | Dünne Metallschicht mit ausgezeichneter Übertragungsfähigkeit und Verfahren zu ihrer Herstellung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0485176B1 (de) |
JP (1) | JP2990621B2 (de) |
DE (1) | DE69121842T2 (de) |
SG (1) | SG42991A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3252534B2 (ja) * | 1993-06-10 | 2002-02-04 | 株式会社村田製作所 | 基板への導電パターン形成方法 |
US5751256A (en) * | 1994-03-04 | 1998-05-12 | Flexcon Company Inc. | Resonant tag labels and method of making same |
JP3099640B2 (ja) * | 1994-06-14 | 2000-10-16 | 株式会社村田製作所 | 焼結体内蔵抵抗体の製造方法及び積層セラミック電子部品の製造方法 |
KR100231356B1 (ko) | 1994-09-12 | 1999-11-15 | 모리시타요이찌 | 적층형 세라믹칩 인덕터 및 그 제조방법 |
US6911887B1 (en) | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
KR100276052B1 (ko) * | 1994-10-04 | 2000-12-15 | 모리시타 요이찌 | 전사도체의 제조방법 및 적층용 그린시트의 제조방법 |
EP0732735B1 (de) * | 1995-03-16 | 2005-12-14 | Murata Manufacturing Co., Ltd. | Monolithisches Keramikbauelement und seine Herstellung |
JP2002050519A (ja) * | 2000-08-04 | 2002-02-15 | Sony Corp | 高周波コイル装置及びその製造方法 |
JP4595183B2 (ja) * | 2000-09-11 | 2010-12-08 | 株式会社村田製作所 | セラミック電子部品およびその製造方法ならびに積層型セラミック電子部品およびその製造方法 |
JP3656612B2 (ja) * | 2001-06-08 | 2005-06-08 | 株式会社村田製作所 | 金属膜およびその製造方法ならびに積層セラミック電子部品およびその製造方法 |
JP4702711B2 (ja) * | 2001-07-24 | 2011-06-15 | 東レフィルム加工株式会社 | 金属化フィルム及び金属箔 |
JP2003145674A (ja) * | 2001-11-08 | 2003-05-20 | Learonal Japan Inc | 樹脂複合材料の形成方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
US4568413A (en) * | 1983-07-25 | 1986-02-04 | James J. Toth | Metallized and plated laminates |
JPH0754780B2 (ja) * | 1987-08-10 | 1995-06-07 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
-
1991
- 1991-06-17 JP JP3144591A patent/JP2990621B2/ja not_active Expired - Lifetime
- 1991-11-05 SG SG1996001893A patent/SG42991A1/en unknown
- 1991-11-05 EP EP19910310229 patent/EP0485176B1/de not_active Expired - Lifetime
- 1991-11-05 DE DE1991621842 patent/DE69121842T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SG42991A1 (en) | 1997-10-17 |
JP2990621B2 (ja) | 1999-12-13 |
DE69121842T2 (de) | 1997-02-20 |
EP0485176A2 (de) | 1992-05-13 |
EP0485176A3 (en) | 1992-07-08 |
EP0485176B1 (de) | 1996-09-04 |
JPH04314876A (ja) | 1992-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |