DE69116205T2 - Lampentempervorrichtung und Verfahren - Google Patents

Lampentempervorrichtung und Verfahren

Info

Publication number
DE69116205T2
DE69116205T2 DE1991616205 DE69116205T DE69116205T2 DE 69116205 T2 DE69116205 T2 DE 69116205T2 DE 1991616205 DE1991616205 DE 1991616205 DE 69116205 T DE69116205 T DE 69116205T DE 69116205 T2 DE69116205 T2 DE 69116205T2
Authority
DE
Germany
Prior art keywords
tempering device
lamp
lamp tempering
tempering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1991616205
Other languages
English (en)
Other versions
DE69116205D1 (de
Inventor
Nobuo Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE69116205D1 publication Critical patent/DE69116205D1/de
Application granted granted Critical
Publication of DE69116205T2 publication Critical patent/DE69116205T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE1991616205 1990-04-23 1991-04-23 Lampentempervorrichtung und Verfahren Expired - Fee Related DE69116205T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10691690A JPH045822A (ja) 1990-04-23 1990-04-23 ランプアニール装置および方法

Publications (2)

Publication Number Publication Date
DE69116205D1 DE69116205D1 (de) 1996-02-22
DE69116205T2 true DE69116205T2 (de) 1996-06-27

Family

ID=14445754

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991616205 Expired - Fee Related DE69116205T2 (de) 1990-04-23 1991-04-23 Lampentempervorrichtung und Verfahren

Country Status (4)

Country Link
EP (1) EP0454054B1 (de)
JP (1) JPH045822A (de)
CA (1) CA2040946A1 (de)
DE (1) DE69116205T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090210A (en) * 1996-07-24 2000-07-18 Applied Materials, Inc. Multi-zone gas flow control in a process chamber
US5781693A (en) * 1996-07-24 1998-07-14 Applied Materials, Inc. Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween
JP3917237B2 (ja) * 1997-05-20 2007-05-23 東京エレクトロン株式会社 レジスト膜形成方法
JPH11288893A (ja) 1998-04-03 1999-10-19 Nec Corp 半導体製造装置及び半導体装置の製造方法
KR100634642B1 (ko) * 1998-11-20 2006-10-16 스티그 알티피 시스템즈, 인코포레이티드 반도체 웨이퍼의 급속 가열 및 냉각 장치
US7037797B1 (en) * 2000-03-17 2006-05-02 Mattson Technology, Inc. Localized heating and cooling of substrates
JP4870604B2 (ja) * 2007-03-29 2012-02-08 株式会社ニューフレアテクノロジー 気相成長装置
JP5456257B2 (ja) * 2008-01-08 2014-03-26 大日本スクリーン製造株式会社 熱処理装置
DE102008012931B4 (de) * 2008-03-06 2011-07-21 VTD Vakuumtechnik Dresden GmbH, 01257 Verfahren und Vorrichtung zum Kühlen von Substraten
JP2014204018A (ja) * 2013-04-08 2014-10-27 シンフォニアテクノロジー株式会社 被処理体の冷却ユニット
JP2014204017A (ja) * 2013-04-08 2014-10-27 シンフォニアテクノロジー株式会社 被処理体の受容装置
TWI569349B (zh) * 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
JP2015103726A (ja) * 2013-11-27 2015-06-04 東京エレクトロン株式会社 マイクロ波加熱処理装置及びマイクロ波加熱処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4221956A (en) * 1978-06-21 1980-09-09 General Electric Company Apparatus for practising temperature gradient zone melting
US4830700A (en) * 1987-07-16 1989-05-16 Texas Instruments Incorporated Processing apparatus and method

Also Published As

Publication number Publication date
DE69116205D1 (de) 1996-02-22
JPH045822A (ja) 1992-01-09
EP0454054A2 (de) 1991-10-30
CA2040946A1 (en) 1991-10-24
EP0454054B1 (de) 1996-01-10
EP0454054A3 (en) 1992-03-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee