DE69112922D1 - Anlage mit einer Vakuumkammer. - Google Patents
Anlage mit einer Vakuumkammer.Info
- Publication number
- DE69112922D1 DE69112922D1 DE69112922T DE69112922T DE69112922D1 DE 69112922 D1 DE69112922 D1 DE 69112922D1 DE 69112922 T DE69112922 T DE 69112922T DE 69112922 T DE69112922 T DE 69112922T DE 69112922 D1 DE69112922 D1 DE 69112922D1
- Authority
- DE
- Germany
- Prior art keywords
- vacuum chamber
- vacuum
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2142650A JPH07116586B2 (ja) | 1990-05-31 | 1990-05-31 | バルブ機構を備えた配管装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69112922D1 true DE69112922D1 (de) | 1995-10-19 |
DE69112922T2 DE69112922T2 (de) | 1996-02-22 |
Family
ID=15320295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69112922T Expired - Fee Related DE69112922T2 (de) | 1990-05-31 | 1991-05-28 | Anlage mit einer Vakuumkammer. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5205918A (de) |
EP (1) | EP0463392B1 (de) |
JP (1) | JPH07116586B2 (de) |
DE (1) | DE69112922T2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5229615A (en) * | 1992-03-05 | 1993-07-20 | Eaton Corporation | End station for a parallel beam ion implanter |
CH687258A5 (de) * | 1993-04-22 | 1996-10-31 | Balzers Hochvakuum | Gaseinlassanordnung. |
US5558717A (en) * | 1994-11-30 | 1996-09-24 | Applied Materials | CVD Processing chamber |
US5885356A (en) * | 1994-11-30 | 1999-03-23 | Applied Materials, Inc. | Method of reducing residue accumulation in CVD chamber using ceramic lining |
NL1000138C2 (nl) * | 1995-04-13 | 1996-10-15 | Od & Me Bv | Inrichtingen voor het bewerken van een substraat alsmede werkwijze geschikt voor toepassing bij dergelijke inrichtingen. |
AU7874198A (en) * | 1996-12-23 | 1998-07-17 | Balzers Aktiengesellschaft | Vacuum treatment equipment |
JP2000133693A (ja) * | 1998-08-19 | 2000-05-12 | Shibaura Mechatronics Corp | 真空装置用駆動機構および真空装置 |
EP1048746B1 (de) * | 1999-04-28 | 2005-09-21 | Alcan Technology & Management AG | Verfahren und Vorrichtung zur Herstellung von Packungen |
US6899795B1 (en) * | 2000-01-18 | 2005-05-31 | Unaxis Balzers Aktiengesellschaft | Sputter chamber as well as vacuum transport chamber and vacuum handling apparatus with such chambers |
DE10100427A1 (de) * | 2001-01-08 | 2002-07-18 | Steag Hamatech Ag | Verfahren und Vorrichtung zum Zusammenfügen von Substraten |
JP4977316B2 (ja) * | 2002-05-24 | 2012-07-18 | カーハーエス コーポプラスト ゲーエムベーハー | 工作物のプラズマ処理方法および装置 |
DE102004055388A1 (de) | 2004-11-17 | 2006-05-18 | Jrw Technology + Engineering Gmbh | Vorrichtung zur Bearbeitung von Werkstücken im Vakuum |
DE102005029616B3 (de) * | 2005-06-23 | 2006-11-16 | Jrw Technology + Engineering Gmbh | Vakuumschweißanlage mit Beladungsvorrichtung |
DE102006024418A1 (de) * | 2006-05-25 | 2007-11-29 | Plasma Systems Gmbh | Vorrichtung zur Oberflächenbehandlung von Halbleitersubstraten aus Silizium |
JP2009221541A (ja) * | 2008-03-17 | 2009-10-01 | Fujifilm Corp | 無機層の真空成膜法、バリア性積層体、デバイスおよび光学部材 |
CN103726103B (zh) * | 2012-10-10 | 2016-04-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种反应腔室 |
US10559451B2 (en) * | 2017-02-15 | 2020-02-11 | Applied Materials, Inc. | Apparatus with concentric pumping for multiple pressure regimes |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE924065C (de) * | 1951-11-11 | 1955-02-24 | W C Heraeus G M B H Platinschm | Verschlussplatte fuer Vakuumkessel |
US3981791A (en) * | 1975-03-10 | 1976-09-21 | Signetics Corporation | Vacuum sputtering apparatus |
JPS59117671U (ja) * | 1983-01-28 | 1984-08-08 | 株式会社日立製作所 | イオンスパツタリング装置 |
US4548699A (en) * | 1984-05-17 | 1985-10-22 | Varian Associates, Inc. | Transfer plate rotation system |
JPS61147871A (ja) * | 1984-12-19 | 1986-07-05 | Nec Corp | 真空蒸着装置 |
DE3716498C2 (de) * | 1987-05-16 | 1994-08-04 | Leybold Ag | Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer |
DE3735284A1 (de) * | 1987-10-17 | 1989-04-27 | Leybold Ag | Vorrichtung nach dem karussell-prinzip zum beschichten von substraten |
-
1990
- 1990-05-31 JP JP2142650A patent/JPH07116586B2/ja not_active Expired - Fee Related
-
1991
- 1991-05-28 DE DE69112922T patent/DE69112922T2/de not_active Expired - Fee Related
- 1991-05-28 EP EP91108724A patent/EP0463392B1/de not_active Expired - Lifetime
- 1991-05-30 US US07/707,891 patent/US5205918A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0436468A (ja) | 1992-02-06 |
US5205918A (en) | 1993-04-27 |
DE69112922T2 (de) | 1996-02-22 |
EP0463392B1 (de) | 1995-09-13 |
EP0463392A1 (de) | 1992-01-02 |
JPH07116586B2 (ja) | 1995-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |