DE69111752T2 - Wiederaufschmelzlötofen. - Google Patents
Wiederaufschmelzlötofen.Info
- Publication number
- DE69111752T2 DE69111752T2 DE69111752T DE69111752T DE69111752T2 DE 69111752 T2 DE69111752 T2 DE 69111752T2 DE 69111752 T DE69111752 T DE 69111752T DE 69111752 T DE69111752 T DE 69111752T DE 69111752 T2 DE69111752 T2 DE 69111752T2
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- furnace
- inert gas
- zone
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 62
- 239000011261 inert gas Substances 0.000 claims description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 22
- 238000007664 blowing Methods 0.000 claims description 18
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 30
- 239000007789 gas Substances 0.000 description 20
- 239000000112 cooling gas Substances 0.000 description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 239000002904 solvent Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000035622 drinking Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000003895 groundwater pollution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Tunnel Furnaces (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118910U JPH0739483Y2 (ja) | 1990-11-15 | 1990-11-15 | リフロー炉 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69111752D1 DE69111752D1 (de) | 1995-09-07 |
| DE69111752T2 true DE69111752T2 (de) | 1996-04-04 |
Family
ID=14748199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69111752T Expired - Lifetime DE69111752T2 (de) | 1990-11-15 | 1991-11-14 | Wiederaufschmelzlötofen. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5338008A (enExample) |
| EP (1) | EP0486390B1 (enExample) |
| JP (1) | JPH0739483Y2 (enExample) |
| DE (1) | DE69111752T2 (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3404768B2 (ja) * | 1992-08-07 | 2003-05-12 | 松下電器産業株式会社 | リフロー装置 |
| JP3250082B2 (ja) * | 1992-09-30 | 2002-01-28 | エイテックテクトロン株式会社 | 自動半田付け装置 |
| JP2683713B2 (ja) * | 1992-11-24 | 1997-12-03 | ティーディーケイ株式会社 | 電子部品のはんだ付け方法及び装置 |
| US5526978A (en) * | 1992-11-24 | 1996-06-18 | Tdk Corporation | Method for soldering electronic components |
| JP3226651B2 (ja) * | 1993-02-02 | 2001-11-05 | 千住金属工業株式会社 | リフロー炉およびリフロー炉用冷却装置 |
| JP2847020B2 (ja) * | 1993-11-29 | 1999-01-13 | 日立テクノエンジニアリング株式会社 | リフローはんだ付け装置 |
| US6145734A (en) * | 1996-04-16 | 2000-11-14 | Matsushita Electric Industrial Co., Ltd. | Reflow method and reflow device |
| US5814789A (en) * | 1996-07-18 | 1998-09-29 | Btu International, Inc. | Forced convection furnance gas plenum |
| DE19723894A1 (de) * | 1997-06-06 | 1998-12-10 | Seho Systemtechnik Gmbh | Prozeßkammer zur thermischen Behandlung von Oberflächen mit einem Prozeßgas |
| US6005224A (en) * | 1997-10-30 | 1999-12-21 | U.S. Philips Corporation | Method of soldering components to at least one carrier |
| US6106281A (en) * | 1997-12-12 | 2000-08-22 | Materna; Peter A. | Method of reducing the flow of gas needed for a chamber with controlled temperature and controlled composition of gas |
| US6050814A (en) * | 1998-12-09 | 2000-04-18 | Glasstech, Inc. | Forced convection furnace for heating glass sheets |
| US6283748B1 (en) * | 1999-06-17 | 2001-09-04 | Btu International, Inc. | Continuous pusher furnace having traveling gas barrier |
| US6457971B2 (en) | 1999-06-17 | 2002-10-01 | Btu International, Inc. | Continuous furnace having traveling gas barrier |
| US6129256A (en) * | 1999-09-21 | 2000-10-10 | Intel Corporation | Reflow furnace for an electronic assembly |
| US6533996B2 (en) * | 2001-02-02 | 2003-03-18 | The Boc Group, Inc. | Method and apparatus for metal processing |
| US6386422B1 (en) * | 2001-05-03 | 2002-05-14 | Asm Assembly Automation Limited | Solder reflow oven |
| US6592364B2 (en) * | 2001-11-30 | 2003-07-15 | David Zapata | Apparatus, method and system for independently controlling airflow in a conveyor oven |
| JP2003181682A (ja) * | 2001-12-20 | 2003-07-02 | Tamura Seisakusho Co Ltd | はんだ付け用冷却装置 |
| FR2860862B1 (fr) * | 2003-10-09 | 2006-08-04 | Air Liquide | Procede de traitement thermique d'une serie d'objets et appareil associe |
| EP1732118B1 (en) * | 2004-03-30 | 2011-05-11 | Tamura Corporation | Heater, reflow apparatus with such heater |
| US7708183B2 (en) * | 2008-03-28 | 2010-05-04 | Illinois Tool Works Inc. | Reflow solder oven with cooling diffuser |
| JP5541353B1 (ja) * | 2012-12-28 | 2014-07-09 | 千住金属工業株式会社 | 気体吸込み孔の配列構造及びはんだ付け装置 |
| JP5541354B1 (ja) * | 2012-12-28 | 2014-07-09 | 千住金属工業株式会社 | 気体吹き出し孔の配列構造及びはんだ付け装置 |
| WO2014139099A1 (en) * | 2013-03-13 | 2014-09-18 | China Sunergy (Nanjing) Co., Ltd. | Soldering system |
| RU2533892C1 (ru) * | 2013-06-13 | 2014-11-27 | Сергей Борисович Либкинд | Способ изготовления композитного теплообменника |
| WO2015057903A1 (en) * | 2013-10-15 | 2015-04-23 | Luvata Franklin, Inc. | Cooling system to reduce liquid metal embrittlement in metal tube and pipe |
| US20150118012A1 (en) * | 2013-10-31 | 2015-04-30 | Lam Research Corporation | Wafer entry port with gas concentration attenuators |
| DE102016110040A1 (de) * | 2016-05-31 | 2017-11-30 | Endress + Hauser Gmbh + Co. Kg | Fertigungslinie zum Löten |
| JP6998666B2 (ja) * | 2017-03-27 | 2022-02-04 | 株式会社タムラ製作所 | リフロー装置 |
| JP6769923B2 (ja) * | 2017-05-19 | 2020-10-14 | トヨタ自動車株式会社 | 燃料タンク製造装置 |
| CN107838516B (zh) * | 2017-12-29 | 2023-10-03 | 山东才聚电子科技有限公司 | 一种真空焊接炉的焊接机构 |
| CN107931768B (zh) * | 2017-12-29 | 2023-05-16 | 山东才聚电子科技有限公司 | 一种真空焊接炉及焊接工艺 |
| US11633797B2 (en) * | 2019-11-15 | 2023-04-25 | General Electric Company | Braze joints for a component and methods of forming the same |
| CN116265162A (zh) * | 2021-12-16 | 2023-06-20 | 伊利诺斯工具制品有限公司 | 回流焊炉 |
| CN117352443B (zh) * | 2023-12-05 | 2024-03-26 | 北京中科同志科技股份有限公司 | 一种凸点回流封装焊接设备 |
| CN118951217B (zh) * | 2024-08-13 | 2025-02-14 | 无锡固翌智能科技有限公司 | 半导体器件真空焊接自动化设备 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522277A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Soldering device |
| FR2536160A1 (fr) * | 1982-11-17 | 1984-05-18 | Piezo Ceram Electronique | Four continu de brasure de composants electroniques |
| JPS62183960A (ja) * | 1986-02-10 | 1987-08-12 | R I Denshi Kogyo:Kk | ハンダ付け用還元性雰囲気炉 |
| DE3681181D1 (de) * | 1986-09-16 | 1991-10-02 | Edward Michael Goldberg | Vorrichtung zur drainage der pleurahoehle. |
| JPH0749151B2 (ja) * | 1987-10-30 | 1995-05-31 | 富士通株式会社 | ハンダ付けリフロー炉 |
| KR910005959B1 (ko) * | 1988-01-19 | 1991-08-09 | 니혼 덴네쯔 게이기 가부시끼가이샤 | 리플로우 납땜 방법 및 그 장치 |
| JPH0244185A (ja) * | 1988-08-03 | 1990-02-14 | Furukawa Electric Co Ltd:The | 加熱装置 |
-
1990
- 1990-11-15 JP JP1990118910U patent/JPH0739483Y2/ja not_active Expired - Lifetime
-
1991
- 1991-11-14 DE DE69111752T patent/DE69111752T2/de not_active Expired - Lifetime
- 1991-11-14 EP EP91403052A patent/EP0486390B1/en not_active Expired - Lifetime
-
1993
- 1993-05-17 US US08/062,160 patent/US5338008A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69111752D1 (de) | 1995-09-07 |
| US5338008A (en) | 1994-08-16 |
| EP0486390B1 (en) | 1995-08-02 |
| EP0486390A1 (en) | 1992-05-20 |
| JPH0475665U (enExample) | 1992-07-02 |
| JPH0739483Y2 (ja) | 1995-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8363 | Opposition against the patent | ||
| 8365 | Fully valid after opposition proceedings |