DE69111488T2 - Industriematerial mit fluorpassivierter Schicht und Verfahren zum Herstellen desselben. - Google Patents
Industriematerial mit fluorpassivierter Schicht und Verfahren zum Herstellen desselben.Info
- Publication number
- DE69111488T2 DE69111488T2 DE69111488T DE69111488T DE69111488T2 DE 69111488 T2 DE69111488 T2 DE 69111488T2 DE 69111488 T DE69111488 T DE 69111488T DE 69111488 T DE69111488 T DE 69111488T DE 69111488 T2 DE69111488 T2 DE 69111488T2
- Authority
- DE
- Germany
- Prior art keywords
- nickel
- industrial material
- fluorine
- substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012770 industrial material Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 10
- 229910052759 nickel Inorganic materials 0.000 abstract 5
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 3
- 229910052731 fluorine Inorganic materials 0.000 abstract 3
- 239000011737 fluorine Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000004334 fluoridation Methods 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 239000003039 volatile agent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/027—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
- H01S3/0305—Selection of materials for the tube or the coatings thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/22—Gases
- H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
- H01S3/225—Gases the active gas being polyatomic, i.e. containing two or more atoms comprising an excimer or exciplex
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/936—Chemical deposition, e.g. electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/938—Vapor deposition or gas diffusion
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Chemically Coating (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Glass Compositions (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5944390 | 1990-03-08 | ||
JP17717290 | 1990-07-04 | ||
JP28315190 | 1990-10-19 | ||
JP28315090 | 1990-10-19 | ||
JP40513190 | 1990-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69111488D1 DE69111488D1 (de) | 1995-08-31 |
DE69111488T2 true DE69111488T2 (de) | 1996-01-11 |
Family
ID=27523511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69111488T Expired - Lifetime DE69111488T2 (de) | 1990-03-08 | 1991-03-11 | Industriematerial mit fluorpassivierter Schicht und Verfahren zum Herstellen desselben. |
Country Status (5)
Country | Link |
---|---|
US (1) | US6258411B1 (de) |
EP (1) | EP0446079B1 (de) |
JP (1) | JP2954716B2 (de) |
AT (1) | ATE125642T1 (de) |
DE (1) | DE69111488T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0464226A (ja) * | 1990-07-04 | 1992-02-28 | Tadahiro Omi | 金属フッ化膜を備えた電子装置 |
DE69717182T2 (de) | 1996-03-07 | 2003-07-24 | Tadahiro Ohmi | Excimerlasergenerator |
JP3094000B2 (ja) * | 1997-09-12 | 2000-10-03 | 昭和電工株式会社 | フッ化表面層を有する金属材料もしくは金属皮膜ならびにフッ化方法 |
US6444083B1 (en) * | 1999-06-30 | 2002-09-03 | Lam Research Corporation | Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof |
JP5001489B2 (ja) * | 2001-03-19 | 2012-08-15 | 東京エレクトロン株式会社 | 処理装置 |
JP3891815B2 (ja) * | 2001-10-12 | 2007-03-14 | 昭和電工株式会社 | 皮膜形成処理用アルミニウム合金、ならびに耐食性に優れたアルミニウム合金材およびその製造方法 |
CN100392151C (zh) * | 2003-05-09 | 2008-06-04 | 昭和电工株式会社 | 耐腐蚀性材料及其制造方法 |
CN1833052B (zh) * | 2003-08-08 | 2010-10-20 | 昭和电工株式会社 | 带有黑膜的基质的生产方法和带有黑膜的基质 |
EP4006201A4 (de) | 2019-07-31 | 2023-11-29 | Resonac Corporation | Laminat und verfahren zur herstellung davon |
WO2021049235A1 (ja) | 2019-09-13 | 2021-03-18 | 昭和電工株式会社 | 積層体およびその製造方法 |
SG11202113223VA (en) | 2019-10-10 | 2021-12-30 | Showa Denko Kk | Laminate and method for producing same |
KR102448366B1 (ko) * | 2020-12-21 | 2022-09-29 | 에스케이스페셜티 주식회사 | 내스크래치성이 향상된 고순도 불화수소의 저장 용기용 금속재료 및 이의 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4397812A (en) * | 1974-05-24 | 1983-08-09 | Richardson Chemical Company | Electroless nickel polyalloys |
DE2751517C2 (de) * | 1977-11-18 | 1983-10-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Oberflächenpassiviertes Halbleiterbauelement mit einer Halbleiterscheibe und Verfahren zur Herstellung desselben |
JPS5913065A (ja) | 1982-07-13 | 1984-01-23 | Fujitsu Ltd | 薄膜防食法 |
DE3407093A1 (de) * | 1984-02-28 | 1985-08-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur passivierung einer metallischen oberflaeche |
US4608097A (en) * | 1984-10-05 | 1986-08-26 | Exxon Research And Engineering Co. | Method for producing an electronically passivated surface on crystalline silicon using a fluorination treatment and an organic overlayer |
US5009963A (en) | 1988-07-20 | 1991-04-23 | Tadahiro Ohmi | Metal material with film passivated by fluorination and apparatus composed of the metal material |
EP0352061B1 (de) * | 1988-07-20 | 1994-09-21 | Hashimoto Chemical Industries Co., Ltd. | Metallischer Werkstoff mit durch Fluorierung passiviertem Film und aus dem metallischen Werkstoff bestehende Anlage |
-
1991
- 1991-02-20 JP JP3026214A patent/JP2954716B2/ja not_active Expired - Lifetime
- 1991-03-11 DE DE69111488T patent/DE69111488T2/de not_active Expired - Lifetime
- 1991-03-11 EP EP91302016A patent/EP0446079B1/de not_active Expired - Lifetime
- 1991-03-11 AT AT91302016T patent/ATE125642T1/de not_active IP Right Cessation
-
1999
- 1999-04-27 US US09/300,773 patent/US6258411B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69111488D1 (de) | 1995-08-31 |
US6258411B1 (en) | 2001-07-10 |
EP0446079A1 (de) | 1991-09-11 |
JP2954716B2 (ja) | 1999-09-27 |
JPH05302177A (ja) | 1993-11-16 |
EP0446079B1 (de) | 1995-07-26 |
ATE125642T1 (de) | 1995-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |