DE69107245D1 - Polyimidosiloxan-Harz, Zusammensetzung daraus und Methode zur Anwendung. - Google Patents

Polyimidosiloxan-Harz, Zusammensetzung daraus und Methode zur Anwendung.

Info

Publication number
DE69107245D1
DE69107245D1 DE69107245T DE69107245T DE69107245D1 DE 69107245 D1 DE69107245 D1 DE 69107245D1 DE 69107245 T DE69107245 T DE 69107245T DE 69107245 T DE69107245 T DE 69107245T DE 69107245 D1 DE69107245 D1 DE 69107245D1
Authority
DE
Germany
Prior art keywords
polyimidosiloxane
resin
composition
polyimidosiloxane resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69107245T
Other languages
English (en)
Other versions
DE69107245T2 (de
Inventor
Kohei Nakajima
Hiroshi Yasuno
Mitsushi Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2141516A external-priority patent/JP2597215B2/ja
Priority claimed from JP13237191A external-priority patent/JP2730652B2/ja
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Application granted granted Critical
Publication of DE69107245D1 publication Critical patent/DE69107245D1/de
Publication of DE69107245T2 publication Critical patent/DE69107245T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69107245T 1990-06-01 1991-05-30 Polyimidosiloxan-Harz, Zusammensetzung daraus und Methode zur Anwendung. Expired - Fee Related DE69107245T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2141516A JP2597215B2 (ja) 1990-06-01 1990-06-01 ポリイミドシロキサン組成物および固化膜
JP13237191A JP2730652B2 (ja) 1991-03-26 1991-03-26 保護塗膜被覆配線部材及びその製法

Publications (2)

Publication Number Publication Date
DE69107245D1 true DE69107245D1 (de) 1995-03-23
DE69107245T2 DE69107245T2 (de) 1995-09-28

Family

ID=26466956

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69107245T Expired - Fee Related DE69107245T2 (de) 1990-06-01 1991-05-30 Polyimidosiloxan-Harz, Zusammensetzung daraus und Methode zur Anwendung.

Country Status (3)

Country Link
US (1) US5252703A (de)
EP (1) EP0459809B1 (de)
DE (1) DE69107245T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241041A (en) * 1991-12-16 1993-08-31 Occidental Chemical Corporation Photocrosslinkable polyimide ammonium salts
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
GB2279958B (en) * 1993-07-13 1997-11-05 Kobe Steel Europ Ltd Siloxane-imide block copolymers for toughening epoxy resins
WO1995009211A1 (fr) * 1993-09-29 1995-04-06 Nippon Shokubai Co., Ltd. Composition de traitement de surface et moulage en resine a surface traitee
US6218496B1 (en) * 1994-03-31 2001-04-17 Occidental Chemical Corporation Polyimidesiloxane adhesive
US5643986A (en) * 1995-03-17 1997-07-01 Ube Industries, Ltd. Polyimidosiloxane compositions
JPH09100350A (ja) * 1995-07-28 1997-04-15 Ube Ind Ltd 感光性ポリイミドシロキサン、組成物および絶縁膜
JPH09118825A (ja) * 1995-10-24 1997-05-06 Shin Etsu Chem Co Ltd ポリイミド樹脂組成物
SG52916A1 (en) * 1996-02-13 1998-09-28 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
US6117510A (en) * 1996-07-30 2000-09-12 Ube Industries, Ltd. Adhesive-applied tape
JP3689518B2 (ja) * 1997-02-18 2005-08-31 新日鐵化学株式会社 電子材料用樹脂溶液組成物
US5935372A (en) * 1997-04-29 1999-08-10 Occidental Chemical Corporation Adhesive sealant for bonding metal parts to ceramics
JP3986143B2 (ja) * 1997-12-25 2007-10-03 東レ・ダウコーニング株式会社 シリコーン含有ポリイミド樹脂およびシリコーン含有ポリアミック酸
JP4306824B2 (ja) * 1998-01-30 2009-08-05 東レ・ダウコーニング株式会社 有機官能性オルガノペンタシロキサンの製造方法、有機樹脂改質剤および有機樹脂
JP3950560B2 (ja) 1998-08-14 2007-08-01 株式会社巴川製紙所 電子部品用接着剤および電子部品用接着テープ
JP4509247B2 (ja) 1999-04-30 2010-07-21 東レ・ダウコーニング株式会社 シリコーン含有ポリイミド樹脂、シリコーン含有ポリアミック酸およびそれらの製造方法
JP4374756B2 (ja) * 2000-09-22 2009-12-02 宇部興産株式会社 末端に酸無水物基を有するイミド系オリゴマ−および硬化性樹脂組成物
JP3855649B2 (ja) * 2000-09-26 2006-12-13 宇部興産株式会社 一液性エポキシ樹脂組成物および硬化物
US6632523B1 (en) * 2000-09-28 2003-10-14 Sumitomo Bakelite Company Limited Low temperature bonding adhesive composition
US6872457B2 (en) 2001-07-31 2005-03-29 Ube Industries, Ltd. Atomic oxygen-resistant film
US20040132888A1 (en) * 2002-12-16 2004-07-08 Ube Industries, Ltd. Electronic device packaging and curable resin composition
US20080275181A1 (en) * 2004-05-27 2008-11-06 Sumitomo Electric Industries, Ltd Block Copolymerized Polyimide Ink Composition for Printing
JP5006310B2 (ja) * 2006-03-03 2012-08-22 株式会社ピーアイ技術研究所 スクリーン印刷用感光性インク組成物及びそれを用いたポジ型レリーフパターンの形成方法
MX2014010334A (es) 2012-02-28 2014-09-22 Corning Inc Articulos de vidrio con revestimientos de baja friccion.
US11497681B2 (en) 2012-02-28 2022-11-15 Corning Incorporated Glass articles with low-friction coatings
US10737973B2 (en) 2012-02-28 2020-08-11 Corning Incorporated Pharmaceutical glass coating for achieving particle reduction
US10273048B2 (en) 2012-06-07 2019-04-30 Corning Incorporated Delamination resistant glass containers with heat-tolerant coatings
US9034442B2 (en) 2012-11-30 2015-05-19 Corning Incorporated Strengthened borosilicate glass containers with improved damage tolerance
US10117806B2 (en) 2012-11-30 2018-11-06 Corning Incorporated Strengthened glass containers resistant to delamination and damage
CA2959666C (en) 2014-09-05 2021-03-16 Corning Incorporated Glass articles and methods for improving the reliability of glass articles
EP3206998B1 (de) 2014-11-26 2021-09-08 Corning Incorporated Verfahren zur herstellung von gehärteten und beständigen glasbehältern
EP3150564B1 (de) 2015-09-30 2018-12-05 Corning Incorporated Halogenierte chemische polyimidsiloxanzusammensetzungen und glasgegenstände mit halogenierten polylmidsiloxanbeschichtungen mit geringer reibung
WO2017075435A1 (en) 2015-10-30 2017-05-04 Corning Incorporated Glass articles with mixed polymer and metal oxide coatings
US11477884B2 (en) * 2018-04-04 2022-10-18 Sumitomo Electric Printed Circuits, Inc. Cover film for flexible printed circuit board and flexible printed circuit board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410664A (en) * 1982-09-20 1983-10-18 Plastics Engineering Company Polyimide-epoxy thermoset resins
JPS61111359A (ja) * 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
FR2578258B1 (fr) * 1985-03-01 1987-03-20 Elf Aquitaine Procede de modification des proprietes d'un materiau polymere choisi parmi les polyimides et les polyamide-imides
JPS61281150A (ja) * 1985-06-05 1986-12-11 Nitto Electric Ind Co Ltd ポリイミド粉末およびその製法
DE3615039A1 (de) * 1986-05-03 1987-11-05 Hoechst Ag Polyamidcarbonsaeuren, daraus hergestellte polyimide und verfahren zur herstellung von hochtemperaturbestaendigen schichten
JPH0727966B2 (ja) * 1986-07-04 1995-03-29 日立化成工業株式会社 半導体装置
KR930004777B1 (ko) * 1987-01-31 1993-06-08 가부시키가이샤 도시바 내열성 절연피복재 및 이것을 이용한 써말 헤드
CA1299801C (en) * 1987-03-31 1992-04-28 Chung J. Lee Soluble polyimidesiloxanes and methods for their preparation and use
JP2536620B2 (ja) * 1989-05-31 1996-09-18 信越化学工業株式会社 ポリイミド樹脂の製造方法

Also Published As

Publication number Publication date
EP0459809A1 (de) 1991-12-04
DE69107245T2 (de) 1995-09-28
US5252703A (en) 1993-10-12
EP0459809B1 (de) 1995-02-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee