DE6910490U - Halbleitereinheit. - Google Patents
Halbleitereinheit.Info
- Publication number
- DE6910490U DE6910490U DE19696910490 DE6910490U DE6910490U DE 6910490 U DE6910490 U DE 6910490U DE 19696910490 DE19696910490 DE 19696910490 DE 6910490 U DE6910490 U DE 6910490U DE 6910490 U DE6910490 U DE 6910490U
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor unit
- disc spring
- heat sinks
- semiconductor
- unit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 35
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000003825 pressing Methods 0.000 description 6
- KGSSUTVUTPLSQW-UHFFFAOYSA-N Robustone Chemical compound C1=C2OCOC2=CC(C2=COC=3C=C4OC(C=CC4=C(O)C=3C2=O)(C)C)=C1 KGSSUTVUTPLSQW-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH727168A CH474153A (de) | 1968-05-16 | 1968-05-16 | Verfahren zur Herstellung einer Halbleitereinheit durch Montage eines scheibenförmigen Halbleiterelementes mit zwei Kühlkörpern sowie Halbleitereinheit, hergestellt nach diesem Verfahren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE6910490U true DE6910490U (de) | 1971-06-09 |
Family
ID=4322513
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19696910490 Expired DE6910490U (de) | 1968-05-16 | 1969-03-15 | Halbleitereinheit. |
| DE19691913229 Pending DE1913229A1 (de) | 1968-05-16 | 1969-03-15 | Verfahren zur Montage eines scheibenfoermigen Halbleiterelementes mit zwei Kuehlkoerpern zu einer Einheit sowie Halbleitereinheit,montiert nach diesem Verfahren |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19691913229 Pending DE1913229A1 (de) | 1968-05-16 | 1969-03-15 | Verfahren zur Montage eines scheibenfoermigen Halbleiterelementes mit zwei Kuehlkoerpern zu einer Einheit sowie Halbleitereinheit,montiert nach diesem Verfahren |
Country Status (6)
| Country | Link |
|---|---|
| AT (1) | AT280423B (enrdf_load_stackoverflow) |
| CH (1) | CH474153A (enrdf_load_stackoverflow) |
| DE (2) | DE6910490U (enrdf_load_stackoverflow) |
| FR (1) | FR2008660A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1197048A (enrdf_load_stackoverflow) |
| NL (1) | NL6810991A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH522288A (de) * | 1970-09-29 | 1972-06-15 | Bbc Brown Boveri & Cie | Halbleitereinheit und Verfahren zur Herstellung derselben |
| GB1381778A (en) * | 1972-06-08 | 1975-01-29 | Cableform Ltd | Semiconductor clamping means |
| DE2602589C2 (de) * | 1976-01-22 | 1982-02-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Vorrichtung zum Einspannen eines Scheibenthyristors zwischen zwei Kühlkörpern |
| DE4211426C1 (en) * | 1992-04-01 | 1993-06-24 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De | Clamping device securing gate-turn-off thyristor between opposing heat sinks - has threaded bolts between heat sinks and spring plate laminates activated in succession to exert pressure on pressure plate |
-
1968
- 1968-05-16 CH CH727168A patent/CH474153A/de not_active IP Right Cessation
- 1968-07-31 AT AT745568A patent/AT280423B/de not_active IP Right Cessation
- 1968-08-02 NL NL6810991A patent/NL6810991A/xx unknown
-
1969
- 1969-03-15 DE DE19696910490 patent/DE6910490U/de not_active Expired
- 1969-03-15 DE DE19691913229 patent/DE1913229A1/de active Pending
- 1969-05-12 GB GB2413269A patent/GB1197048A/en not_active Expired
- 1969-05-14 FR FR6915638A patent/FR2008660A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE1913229A1 (de) | 1970-01-22 |
| FR2008660A1 (enrdf_load_stackoverflow) | 1970-01-23 |
| NL6810991A (enrdf_load_stackoverflow) | 1969-11-18 |
| GB1197048A (en) | 1970-07-01 |
| CH474153A (de) | 1969-06-15 |
| AT280423B (de) | 1970-04-10 |
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