FR2008660A1 - - Google Patents

Info

Publication number
FR2008660A1
FR2008660A1 FR6915638A FR6915638A FR2008660A1 FR 2008660 A1 FR2008660 A1 FR 2008660A1 FR 6915638 A FR6915638 A FR 6915638A FR 6915638 A FR6915638 A FR 6915638A FR 2008660 A1 FR2008660 A1 FR 2008660A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6915638A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Original Assignee
BBC BROWN BOVERI and CIE
Brown Boveri und Cie AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, Brown Boveri und Cie AG Switzerland filed Critical BBC BROWN BOVERI and CIE
Publication of FR2008660A1 publication Critical patent/FR2008660A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR6915638A 1968-05-16 1969-05-14 Withdrawn FR2008660A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH727168A CH474153A (de) 1968-05-16 1968-05-16 Verfahren zur Herstellung einer Halbleitereinheit durch Montage eines scheibenförmigen Halbleiterelementes mit zwei Kühlkörpern sowie Halbleitereinheit, hergestellt nach diesem Verfahren

Publications (1)

Publication Number Publication Date
FR2008660A1 true FR2008660A1 (enrdf_load_stackoverflow) 1970-01-23

Family

ID=4322513

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6915638A Withdrawn FR2008660A1 (enrdf_load_stackoverflow) 1968-05-16 1969-05-14

Country Status (6)

Country Link
AT (1) AT280423B (enrdf_load_stackoverflow)
CH (1) CH474153A (enrdf_load_stackoverflow)
DE (2) DE6910490U (enrdf_load_stackoverflow)
FR (1) FR2008660A1 (enrdf_load_stackoverflow)
GB (1) GB1197048A (enrdf_load_stackoverflow)
NL (1) NL6810991A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH522288A (de) * 1970-09-29 1972-06-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
DE2602589C2 (de) * 1976-01-22 1982-02-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines Scheibenthyristors zwischen zwei Kühlkörpern
DE4211426C1 (en) * 1992-04-01 1993-06-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De Clamping device securing gate-turn-off thyristor between opposing heat sinks - has threaded bolts between heat sinks and spring plate laminates activated in succession to exert pressure on pressure plate

Also Published As

Publication number Publication date
DE1913229A1 (de) 1970-01-22
NL6810991A (enrdf_load_stackoverflow) 1969-11-18
DE6910490U (de) 1971-06-09
GB1197048A (en) 1970-07-01
CH474153A (de) 1969-06-15
AT280423B (de) 1970-04-10

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Legal Events

Date Code Title Description
ST Notification of lapse