DE69033029D1 - Verbesserte elektrische verbindungen für ic-chip-tester - Google Patents
Verbesserte elektrische verbindungen für ic-chip-testerInfo
- Publication number
- DE69033029D1 DE69033029D1 DE69033029T DE69033029T DE69033029D1 DE 69033029 D1 DE69033029 D1 DE 69033029D1 DE 69033029 T DE69033029 T DE 69033029T DE 69033029 T DE69033029 T DE 69033029T DE 69033029 D1 DE69033029 D1 DE 69033029D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical connections
- improved electrical
- chip tester
- tester
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36434389A | 1989-06-09 | 1989-06-09 | |
PCT/US1990/002875 WO1990015517A1 (en) | 1989-06-09 | 1990-05-14 | Improved electrical connectors and ic chip tester embodying same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69033029D1 true DE69033029D1 (de) | 1999-05-06 |
DE69033029T2 DE69033029T2 (de) | 1999-08-12 |
Family
ID=23434082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69033029T Expired - Fee Related DE69033029T2 (de) | 1989-06-09 | 1990-05-14 | Verbesserte elektrische verbindungen für ic-chip-tester |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0428681B1 (de) |
JP (1) | JP2891539B2 (de) |
CA (1) | CA1320546C (de) |
DE (1) | DE69033029T2 (de) |
ES (1) | ES2130122T3 (de) |
WO (1) | WO1990015517A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162382A (ja) * | 1990-10-25 | 1992-06-05 | Canon Inc | Icソケット |
EP0689241A2 (de) * | 1991-10-17 | 1995-12-27 | Fujitsu Limited | Halter für Halbleiterteil |
JP2894431B2 (ja) * | 1995-11-15 | 1999-05-24 | 日本電気株式会社 | ベアチップソケット |
FR2786275B1 (fr) * | 1998-11-20 | 2001-02-02 | Adeunis R F | Equipement de test pour des composants electroniques radiofrequences ou numeriques rapides |
DE10309103A1 (de) * | 2003-02-28 | 2004-09-09 | Bayerische Motoren Werke Ag | Elektrischer Steckverbinder |
JP4863130B2 (ja) | 2009-05-22 | 2012-01-25 | 山一電機株式会社 | 基板接続用コネクタ、それを備える半導体装置用ソケット、ケーブル用コネクタ、および、ボードツーボードコネクタ |
KR102002518B1 (ko) * | 2018-04-27 | 2019-07-22 | 이승용 | Fpcb 및 디스플레이 패널 테스트용 테스트 소켓 및 테스트 장치 |
US11350525B2 (en) * | 2020-05-18 | 2022-05-31 | Nuvoton Technology Corporation | Method and apparatus for mounting a DUT on a test board without use of socket or solder |
KR102606908B1 (ko) * | 2020-12-23 | 2023-11-24 | (주)마이크로컨텍솔루션 | 반도체 칩 테스트 소켓 |
KR102551966B1 (ko) * | 2023-01-04 | 2023-07-06 | 주식회사 피엠티 | 프로브 카드의 지지 어셈블리 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4431404Y1 (de) * | 1967-01-20 | 1969-12-24 | ||
US4029375A (en) * | 1976-06-14 | 1977-06-14 | Electronic Engineering Company Of California | Miniature electrical connector |
US4236776A (en) * | 1978-08-24 | 1980-12-02 | Augat Inc. | Electrical contact with improved means for solder wicking and degassing |
US4581679A (en) * | 1983-05-31 | 1986-04-08 | Trw Inc. | Multi-element circuit construction |
DK291184D0 (da) * | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | Fremgangsmaade og indretning til test af kredsloebsplader |
US4620761A (en) * | 1985-01-30 | 1986-11-04 | Texas Instruments Incorporated | High density chip socket |
JPS62165958A (ja) * | 1986-01-17 | 1987-07-22 | Hitachi Vlsi Eng Corp | 半導体装置の電気特性測定用ソケツト |
GB2189657B (en) * | 1986-04-25 | 1990-02-14 | Plessey Co Plc | Improvements in or relating to electrical contactors |
BE1000697A6 (fr) * | 1987-10-28 | 1989-03-14 | Irish Transformers Ltd | Appareil pour tester des circuits electriques integres. |
-
1989
- 1989-09-29 CA CA000615035A patent/CA1320546C/en not_active Expired - Fee Related
-
1990
- 1990-05-14 JP JP2508281A patent/JP2891539B2/ja not_active Expired - Lifetime
- 1990-05-14 DE DE69033029T patent/DE69033029T2/de not_active Expired - Fee Related
- 1990-05-14 WO PCT/US1990/002875 patent/WO1990015517A1/en active IP Right Grant
- 1990-05-14 EP EP90908839A patent/EP0428681B1/de not_active Expired - Lifetime
- 1990-05-14 ES ES90908839T patent/ES2130122T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0428681A4 (en) | 1992-07-22 |
EP0428681B1 (de) | 1999-03-31 |
JP2891539B2 (ja) | 1999-05-17 |
WO1990015517A1 (en) | 1990-12-13 |
EP0428681A1 (de) | 1991-05-29 |
JPH04501192A (ja) | 1992-02-27 |
DE69033029T2 (de) | 1999-08-12 |
ES2130122T3 (es) | 1999-07-01 |
CA1320546C (en) | 1993-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: CINCH CONNECTORS, INC., LOMBARD, ILL., US |
|
8339 | Ceased/non-payment of the annual fee |