DE69031039D1 - Keramische leiterplatte - Google Patents
Keramische leiterplatteInfo
- Publication number
- DE69031039D1 DE69031039D1 DE69031039T DE69031039T DE69031039D1 DE 69031039 D1 DE69031039 D1 DE 69031039D1 DE 69031039 T DE69031039 T DE 69031039T DE 69031039 T DE69031039 T DE 69031039T DE 69031039 D1 DE69031039 D1 DE 69031039D1
- Authority
- DE
- Germany
- Prior art keywords
- ceramic pcb
- pcb
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6565—Cooling rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/658—Atmosphere during thermal treatment
- C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/121—Metallic interlayers based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/122—Metallic interlayers based on refractory metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/124—Metallic interlayers based on copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/341—Silica or silicates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
- C04B2237/525—Pre-treatment of the joining surfaces, e.g. cleaning, machining by heating
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9752390 | 1990-04-16 | ||
PCT/JP1990/001502 WO1991016805A1 (en) | 1990-04-16 | 1990-11-16 | Ceramic circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69031039D1 true DE69031039D1 (de) | 1997-08-14 |
DE69031039T2 DE69031039T2 (de) | 1997-11-06 |
Family
ID=14194619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69031039T Expired - Fee Related DE69031039T2 (de) | 1990-04-16 | 1990-11-16 | Keramische leiterplatte |
Country Status (4)
Country | Link |
---|---|
US (1) | US5354415A (de) |
EP (1) | EP0480038B1 (de) |
DE (1) | DE69031039T2 (de) |
WO (1) | WO1991016805A1 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09181423A (ja) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
JP3866320B2 (ja) * | 1995-02-09 | 2007-01-10 | 日本碍子株式会社 | 接合体、および接合体の製造方法 |
JP4077888B2 (ja) * | 1995-07-21 | 2008-04-23 | 株式会社東芝 | セラミックス回路基板 |
JP3845925B2 (ja) * | 1996-02-05 | 2006-11-15 | 住友電気工業株式会社 | 窒化アルミニウム基材を用いた半導体装置用部材及びその製造方法 |
JP3682552B2 (ja) * | 1997-03-12 | 2005-08-10 | 同和鉱業株式会社 | 金属−セラミックス複合基板の製造方法 |
US6197435B1 (en) | 1997-11-07 | 2001-03-06 | Denki Kagaku Kogyo Kabushiki Kaisha | Substrate |
EP1063873A3 (de) * | 1999-06-22 | 2003-04-23 | Dr.-Ing. Jürgen Schulz-Harder | Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte-und Fixierelement zur Verwendung bei dem Verfahren |
JP4649027B2 (ja) * | 1999-09-28 | 2011-03-09 | 株式会社東芝 | セラミックス回路基板 |
EP1122780A3 (de) * | 2000-01-31 | 2004-01-02 | Ngk Insulators, Ltd. | Laminatkühler, Leistungshalbleiter und seine Herstellung |
KR100565139B1 (ko) * | 2001-02-22 | 2006-03-30 | 니뽄 가이시 가부시키가이샤 | 전자 회로용 부재 및 그 제조 방법과 전자 부품 |
US7069645B2 (en) | 2001-03-29 | 2006-07-04 | Ngk Insulators, Ltd. | Method for producing a circuit board |
JP4887583B2 (ja) * | 2001-08-09 | 2012-02-29 | Dowaメタルテック株式会社 | セラミックス回路基板の製造方法 |
JP4811756B2 (ja) * | 2001-09-28 | 2011-11-09 | Dowaメタルテック株式会社 | 金属−セラミックス接合回路基板の製造方法 |
US6800211B2 (en) * | 2002-08-26 | 2004-10-05 | Tong Hsing Electric Industries Ltd. | Method for removing voids in a ceramic substrate |
US20040112571A1 (en) * | 2002-11-01 | 2004-06-17 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
JP4394477B2 (ja) * | 2003-03-27 | 2010-01-06 | Dowaホールディングス株式会社 | 金属−セラミックス接合基板の製造方法 |
JP4014528B2 (ja) * | 2003-03-28 | 2007-11-28 | 日本碍子株式会社 | ヒートスプレッダモジュールの製造方法及びヒートスプレッダモジュール |
US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
TWI385720B (zh) * | 2004-03-24 | 2013-02-11 | Tosoh Corp | Etching composition and etching treatment method |
KR101108454B1 (ko) * | 2004-04-05 | 2012-01-31 | 미쓰비시 마테리알 가부시키가이샤 | Al/AlN 접합체, 전력 모듈용 기판 및 전력 모듈, 그리고 Al/AlN 접합체의 제조 방법 |
JP2006179856A (ja) * | 2004-11-25 | 2006-07-06 | Fuji Electric Holdings Co Ltd | 絶縁基板および半導体装置 |
JP4378334B2 (ja) * | 2005-09-09 | 2009-12-02 | 日本碍子株式会社 | ヒートスプレッダモジュール及びその製造方法 |
KR20100014769A (ko) * | 2007-01-10 | 2010-02-11 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 전자 부품 모듈 및 이의 생산 방법 |
JP5128829B2 (ja) * | 2007-02-28 | 2013-01-23 | Dowaメタルテック株式会社 | 金属−セラミックス接合基板およびそれに用いるろう材 |
CN101715536A (zh) * | 2007-05-02 | 2010-05-26 | 固利吉股份有限公司 | 用于电子冷却应用的微管/多端口逆流散热器设计 |
US9297571B1 (en) | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
WO2010017321A1 (en) * | 2008-08-05 | 2010-02-11 | Cooligy Inc. | Bonded metal and ceramic plates for thermal management of optical and electronic devices |
US9301390B2 (en) | 2009-03-30 | 2016-03-29 | Tokuyama Corporation | Process for producing metallized substrate, and metallized substrate |
WO2011010597A1 (ja) * | 2009-07-24 | 2011-01-27 | 株式会社東芝 | 窒化珪素製絶縁シートおよびそれを用いた半導体モジュール構造体 |
TW201118940A (en) * | 2009-11-20 | 2011-06-01 | Holy Stone Entpr Co Ltd | Ceramic substrate manufacturing method |
TW201118059A (en) * | 2009-11-20 | 2011-06-01 | Holy Stone Entpr Co Ltd | Manufacturing process for high precision ceramic substrate |
EP2544515A4 (de) * | 2010-03-02 | 2014-07-30 | Tokuyama Corp | Verfahren zur herstellung eines metallbeschichteten substrats |
KR101489159B1 (ko) * | 2011-12-23 | 2015-02-05 | 주식회사 잉크테크 | 금속 인쇄회로기판의 제조방법 |
WO2013115359A1 (ja) | 2012-02-01 | 2013-08-08 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、パワーモジュール用基板の製造方法、および銅部材接合用ペースト |
KR101975633B1 (ko) * | 2012-11-20 | 2019-05-07 | 도와 메탈테크 가부시키가이샤 | 금속-세라믹스 접합 기판 및 그 제조 방법 |
JP6056432B2 (ja) * | 2012-12-06 | 2017-01-11 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、パワーモジュール用基板の製造方法 |
JP5720861B1 (ja) * | 2013-08-15 | 2015-05-20 | 日立金属株式会社 | セラミックス回路基板の製造方法及びセラミックス回路基板 |
EP3341345B1 (de) * | 2015-12-22 | 2023-07-26 | Heraeus Deutschland GmbH & Co. KG | Durch dickschichtpaste vermittelte, mit metall- oder metallhybridfolien verbundene keramik |
JP2017135374A (ja) * | 2016-01-22 | 2017-08-03 | 三菱マテリアル株式会社 | 接合体、パワーモジュール用基板、パワーモジュール、接合体の製造方法及びパワーモジュール用基板の製造方法 |
JP6631333B2 (ja) * | 2016-03-11 | 2020-01-15 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
JP6904094B2 (ja) * | 2016-06-23 | 2021-07-14 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
JP6799479B2 (ja) * | 2017-03-03 | 2020-12-16 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板の製造方法 |
CN113646883A (zh) * | 2019-03-29 | 2021-11-12 | 京瓷株式会社 | 布线基板、电子装置用封装件以及电子装置 |
CN110993485B (zh) * | 2019-11-27 | 2022-06-10 | 江苏富乐华半导体科技股份有限公司 | 一种氮化硅陶瓷覆铜基板的表面钝化方法 |
DE102020111697A1 (de) * | 2020-04-29 | 2021-11-04 | Rogers Germany Gmbh | Trägersubstrat und Verfahren zur Herstellung eines Trägersubstrats |
DE102020111700A1 (de) * | 2020-04-29 | 2021-11-04 | Rogers Germany Gmbh | Trägersubstrat und Verfahren zur Herstellung eines Trägersubstrats |
CN114105668A (zh) * | 2021-12-19 | 2022-03-01 | 辽宁伊菲科技股份有限公司 | 一种防止氮化硅集成电路板钎焊分层的原料制备方法和设备 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508179B1 (de) * | 1970-06-26 | 1975-04-02 | ||
JPS513101A (ja) * | 1974-06-25 | 1976-01-12 | Sharp Kk | Denpashaheiyoban |
JPS5815955B2 (ja) * | 1975-03-14 | 1983-03-28 | 三洋電機株式会社 | コンセイシユウセキカイロノ ドウデンロノケイセイホウホウ |
GB2006538B (en) * | 1977-10-24 | 1982-03-17 | Asahi Chemical Ind | Thin-film microcircuit board and method for making the same |
JPS54103568A (en) * | 1978-01-31 | 1979-08-15 | Matsushita Electric Works Ltd | Method of forming electric circuit |
JPS5541744A (en) * | 1978-09-19 | 1980-03-24 | Tokyo Shibaura Electric Co | Method of manufacturing printed circuit board |
JPS56134404A (en) * | 1980-03-24 | 1981-10-21 | Sony Corp | Conductive material and method of prdoducing same |
JPS5750490A (en) * | 1980-09-11 | 1982-03-24 | Nippon Electric Co | Method of producing hybrid circuit board |
JPS59150453A (ja) * | 1982-12-23 | 1984-08-28 | Toshiba Corp | 半導体モジユ−ル用基板の製造方法 |
JPS59229892A (ja) * | 1983-06-13 | 1984-12-24 | 株式会社東芝 | プリント基板の製造方法 |
JPH0810710B2 (ja) * | 1984-02-24 | 1996-01-31 | 株式会社東芝 | 良熱伝導性基板の製造方法 |
JPS60195068A (ja) * | 1984-03-16 | 1985-10-03 | 田中貴金属工業株式会社 | セラミックス接合方法 |
JPS6142192A (ja) * | 1984-08-03 | 1986-02-28 | オ−ケ−プリント配線株式会社 | セラミツク基板の製造方法 |
JPS6182493A (ja) * | 1984-09-29 | 1986-04-26 | 株式会社東芝 | セラミツク配線基板の製造方法 |
JPS61121489A (ja) * | 1984-11-19 | 1986-06-09 | 株式会社東芝 | 基板製造用Cu配線シ−ト |
US4647477A (en) * | 1984-12-07 | 1987-03-03 | Kollmorgen Technologies Corporation | Surface preparation of ceramic substrates for metallization |
JPS61158423A (ja) * | 1984-12-28 | 1986-07-18 | Toyobo Co Ltd | 延伸製膜法 |
US4712161A (en) * | 1985-03-25 | 1987-12-08 | Olin Corporation | Hybrid and multi-layer circuitry |
JPS61158423U (de) * | 1985-03-22 | 1986-10-01 | ||
JPS62151581A (ja) * | 1985-12-26 | 1987-07-06 | Toshiba Corp | 金属表面処理材 |
JPS62264689A (ja) * | 1986-05-13 | 1987-11-17 | 同和鉱業株式会社 | 回路付金属−セラミツクス接合体の製造方法 |
US5058799A (en) * | 1986-07-24 | 1991-10-22 | Zsamboky Kalman F | Metallized ceramic substrate and method therefor |
JPS63160393A (ja) * | 1986-12-24 | 1988-07-04 | ロ−ム株式会社 | 回路基板の製造方法 |
JPS63169348A (ja) * | 1986-12-29 | 1988-07-13 | Teikoku Piston Ring Co Ltd | セラミツク接合用アモルフアス合金箔 |
JPS6424078A (en) * | 1987-07-17 | 1989-01-26 | Nippon Steel Corp | Method for joining ceramic to metal |
JP2760987B2 (ja) * | 1987-08-08 | 1998-06-04 | 株式会社東芝 | セラミックスと金属との接合方法 |
JPS6454798A (en) * | 1987-08-26 | 1989-03-02 | Hitachi Ltd | Manufacture of ceramic substrate |
EP0331500B1 (de) * | 1988-03-04 | 1993-01-07 | Kabushiki Kaisha Toshiba | Hartlötpaste zum Verbinden von Metalle und keramische Materialien |
JPH01230290A (ja) * | 1988-03-09 | 1989-09-13 | Mitsubishi Electric Corp | 厚膜回路の形成方法 |
JPH01313968A (ja) * | 1988-06-13 | 1989-12-19 | Tanaka Kikinzoku Kogyo Kk | セラミックパッケージ用リードピン |
JPH0272695A (ja) * | 1988-09-07 | 1990-03-12 | Toshiba Lighting & Technol Corp | 混成集積回路 |
JPH02198198A (ja) * | 1989-01-27 | 1990-08-06 | Cmk Corp | 電磁波シールド層を備えるプリント配線板 |
DE3913115A1 (de) * | 1989-04-21 | 1990-10-25 | Du Pont Deutschland | Verfahren zur herstellung von elektrisch leitfaehigen mustern |
DE69123692T2 (de) * | 1990-10-05 | 1997-07-24 | Toshiba Kawasaki Kk | Verfahren zur Herstellung einer keramischen Leiterplatte |
-
1990
- 1990-11-16 WO PCT/JP1990/001502 patent/WO1991016805A1/ja active IP Right Grant
- 1990-11-16 EP EP90916807A patent/EP0480038B1/de not_active Expired - Lifetime
- 1990-11-16 DE DE69031039T patent/DE69031039T2/de not_active Expired - Fee Related
-
1993
- 1993-01-04 US US08/000,584 patent/US5354415A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0480038B1 (de) | 1997-07-09 |
US5354415A (en) | 1994-10-11 |
EP0480038A4 (en) | 1993-04-07 |
EP0480038A1 (de) | 1992-04-15 |
WO1991016805A1 (en) | 1991-10-31 |
DE69031039T2 (de) | 1997-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69031039D1 (de) | Keramische leiterplatte | |
DE69621222D1 (de) | Keramische leiterplatte | |
DE69217285D1 (de) | Keramische Leiterplatte | |
DE69115408D1 (de) | Keramische Packungen und keramische Leiterplatte | |
FI88440B (fi) | Keramiskt filter | |
DE69209417T2 (de) | Nichtreduzierbare dielektrische keramische Zusammensetzung | |
DE69119152T2 (de) | Schaltungsanordnung | |
DE69409881T2 (de) | Dielektrische keramische Zusammensetzung | |
DE68926099T2 (de) | Dielektrische keramische Zusammensetzung | |
DE68906841T2 (de) | Dielektrische keramische Zusammensetzung. | |
DE69112732D1 (de) | Keramische Zusammensetzungen. | |
DE68905668D1 (de) | Dielektrische keramische zusammensetzung. | |
DE69216896T2 (de) | Keramisches Filter | |
ATA288689A (de) | Keramikfilter | |
DE9003681U1 (de) | Schlickergegossenes keramisches Bauteil | |
DE69412717T2 (de) | Dielektrische keramische Zusammensetzung | |
DE69116415D1 (de) | Dielektrische Keramiken | |
DE69123779T2 (de) | Dielektrische keramische Zusammensetzung | |
DE68908382D1 (de) | Dielektrische keramische zusammensetzung. | |
DE68905421D1 (de) | Dielektrische keramische zusammensetzung. | |
DK0508734T3 (da) | Keramisk filter | |
DE69119363D1 (de) | Halteschaltung | |
KR920010396U (ko) | 세라믹 캐필러리 | |
DE9305549U1 (de) | Keramische Fliesen | |
KR920013993U (ko) | 적분회로 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8365 | Fully valid after opposition proceedings | ||
8339 | Ceased/non-payment of the annual fee |