DE69028518D1 - Verfahren sowie gerät zur messung der schichtanordnung in einem halbleiter-wafer - Google Patents
Verfahren sowie gerät zur messung der schichtanordnung in einem halbleiter-waferInfo
- Publication number
- DE69028518D1 DE69028518D1 DE69028518T DE69028518T DE69028518D1 DE 69028518 D1 DE69028518 D1 DE 69028518D1 DE 69028518 T DE69028518 T DE 69028518T DE 69028518 T DE69028518 T DE 69028518T DE 69028518 D1 DE69028518 D1 DE 69028518D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- measurement
- semiconductor wafer
- calculated
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/308,253 US4938600A (en) | 1989-02-09 | 1989-02-09 | Method and apparatus for measuring registration between layers of a semiconductor wafer |
PCT/US1990/000741 WO1990009558A1 (en) | 1989-02-09 | 1990-02-08 | Method and apparatus for measuring registration between layers of a semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69028518D1 true DE69028518D1 (de) | 1996-10-17 |
DE69028518T2 DE69028518T2 (de) | 1997-04-24 |
Family
ID=23193206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69028518T Expired - Fee Related DE69028518T2 (de) | 1989-02-09 | 1990-02-08 | Verfahren sowie gerät zur messung der schichtanordnung in einem halbleiter-wafer |
Country Status (6)
Country | Link |
---|---|
US (1) | US4938600A (de) |
EP (1) | EP0457843B1 (de) |
JP (1) | JPH04503410A (de) |
AT (1) | ATE142775T1 (de) |
DE (1) | DE69028518T2 (de) |
WO (1) | WO1990009558A1 (de) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2640040B1 (fr) * | 1988-12-05 | 1994-10-28 | Micro Controle | Procede et dispositif de mesure optique |
DE3924989A1 (de) * | 1989-07-28 | 1991-02-07 | Roland Man Druckmasch | Vorrichtung zur durchfuehrung einer umfassenden qualitaetskontrolle an druckbogen |
US5237393A (en) * | 1990-05-28 | 1993-08-17 | Nec Corporation | Reticle for a reduced projection exposure apparatus |
US5280437A (en) * | 1991-06-28 | 1994-01-18 | Digital Equipment Corporation | Structure and method for direct calibration of registration measurement systems to actual semiconductor wafer process topography |
JP2523227Y2 (ja) * | 1991-07-30 | 1997-01-22 | 株式会社堀場製作所 | 異物検査装置 |
JP2756620B2 (ja) * | 1992-01-10 | 1998-05-25 | キヤノン株式会社 | 半導体露光方法およびその装置 |
US5204739A (en) * | 1992-02-07 | 1993-04-20 | Karl Suss America, Inc. | Proximity mask alignment using a stored video image |
US5394100A (en) * | 1993-05-06 | 1995-02-28 | Karl Suss America, Incorporated | Probe system with automatic control of contact pressure and probe alignment |
JP3039210B2 (ja) * | 1993-08-03 | 2000-05-08 | 日本電気株式会社 | 半導体装置の製造方法 |
US5699282A (en) * | 1994-04-28 | 1997-12-16 | The United States Of America As Represented By The Secretary Of Commerce | Methods and test structures for measuring overlay in multilayer devices |
US6465322B2 (en) * | 1998-01-15 | 2002-10-15 | Koninklijke Philips Electronics N.V. | Semiconductor processing methods and structures for determining alignment during semiconductor wafer processing |
US5919714A (en) * | 1998-05-06 | 1999-07-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Segmented box-in-box for improving back end overlay measurement |
US6256555B1 (en) | 1998-12-02 | 2001-07-03 | Newport Corporation | Robot arm with specimen edge gripping end effector |
CN1238882C (zh) | 1998-12-02 | 2006-01-25 | 纽波特公司 | 试片夹持机械手末端执行器 |
US6357996B2 (en) | 1999-05-14 | 2002-03-19 | Newport Corporation | Edge gripping specimen prealigner |
US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
US6384408B1 (en) * | 1999-08-11 | 2002-05-07 | Kla-Tencor Corporation | Calibration of a scanning electron microscope |
US6640151B1 (en) | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Multi-tool control system, method and medium |
US7200459B1 (en) * | 2000-01-04 | 2007-04-03 | Advanced Micro Devices, Inc. | Method for determining optimal photolithography overlay targets based on process performance and yield in microelectronic fabrication |
US7095885B1 (en) * | 2000-03-01 | 2006-08-22 | Micron Technology, Inc. | Method for measuring registration of overlapping material layers of an integrated circuit |
US20030020889A1 (en) * | 2000-08-02 | 2003-01-30 | Nikon Corporation | Stage unit, measurement unit and measurement method, and exposure apparatus and exposure method |
US6708074B1 (en) | 2000-08-11 | 2004-03-16 | Applied Materials, Inc. | Generic interface builder |
EP1184725A1 (de) * | 2000-09-04 | 2002-03-06 | Infineon Technologies SC300 GmbH & Co. KG | Verfahren zur Einstellung eines lithographischen Gerätes |
US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
DE10065120C2 (de) * | 2000-12-28 | 2003-03-20 | Inb Vision Ag | Verfahren zur Bestimmung der Abweichung des Pixelortes der Pixel mindestens einer Bildaufnahmematrix von der Sollposition |
US6436595B1 (en) | 2001-02-08 | 2002-08-20 | International Business Machines Corporation | Method of aligning lithographically printed product layers using non-zero overlay targets |
US7101799B2 (en) * | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
US7433509B1 (en) * | 2001-10-09 | 2008-10-07 | Nanometrics Incorporated | Method for automatic de-skewing of multiple layer wafer for improved pattern recognition |
US6936826B2 (en) | 2001-11-07 | 2005-08-30 | Soluris, Inc. | Vibration-isolating coupling including an elastomer diaphragm for scanning electron microscope and the like |
DE20118356U1 (de) * | 2001-11-12 | 2002-02-14 | Ahauser Tiefdruck Gravuren Gmb | Vorrichtung zur Darstellung und Vermessung von Mikrostrukturen auf Oberflächen |
US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
US6672716B2 (en) * | 2002-04-29 | 2004-01-06 | Xerox Corporation | Multiple portion solid ink stick |
WO2004013715A1 (en) | 2002-08-01 | 2004-02-12 | Applied Materials, Inc. | Method, system, and medium for handling misrepresentative metrology data within an advanced process control system |
AU2003290932A1 (en) | 2002-11-15 | 2004-06-15 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
US7625679B2 (en) * | 2005-09-23 | 2009-12-01 | Applied Materials, Inc. | Method of aligning a particle-beam-generated pattern to a pattern on a pre-patterned substrate |
US7656518B2 (en) * | 2007-03-30 | 2010-02-02 | Asml Netherlands B.V. | Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus |
CN107202555B (zh) * | 2017-04-28 | 2021-01-05 | 广东工业大学 | 一种连杆加工旋转盘夹具视觉检测装置和检测方法 |
CN115917720A (zh) * | 2020-06-25 | 2023-04-04 | 科磊股份有限公司 | 用于改善半导体装置的不对齐及不对称性的小波系统及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU562756A2 (ru) * | 1975-05-28 | 1977-06-25 | Предприятие П/Я Р-6681 | Дифференциальный рефрактометр |
US4467211A (en) * | 1981-04-16 | 1984-08-21 | Control Data Corporation | Method and apparatus for exposing multi-level registered patterns interchangeably between stations of a multi-station electron-beam array lithography (EBAL) system |
US4536239A (en) * | 1983-07-18 | 1985-08-20 | Nicolet Instrument Corporation | Multi-layer circuit board inspection system |
US4742233A (en) * | 1986-12-22 | 1988-05-03 | American Telephone And Telgraph Company | Method and apparatus for automated reading of vernier patterns |
FR2640040B1 (fr) * | 1988-12-05 | 1994-10-28 | Micro Controle | Procede et dispositif de mesure optique |
-
1989
- 1989-02-09 US US07/308,253 patent/US4938600A/en not_active Expired - Lifetime
-
1990
- 1990-02-08 WO PCT/US1990/000741 patent/WO1990009558A1/en active IP Right Grant
- 1990-02-08 DE DE69028518T patent/DE69028518T2/de not_active Expired - Fee Related
- 1990-02-08 EP EP90904088A patent/EP0457843B1/de not_active Expired - Lifetime
- 1990-02-08 AT AT90904088T patent/ATE142775T1/de active
- 1990-02-08 JP JP2504027A patent/JPH04503410A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH04503410A (ja) | 1992-06-18 |
EP0457843B1 (de) | 1996-09-11 |
WO1990009558A1 (en) | 1990-08-23 |
EP0457843A1 (de) | 1991-11-27 |
US4938600A (en) | 1990-07-03 |
DE69028518T2 (de) | 1997-04-24 |
EP0457843A4 (en) | 1993-06-02 |
ATE142775T1 (de) | 1996-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |