DE69027349D1 - Ladungsverschiebeanordnung und Verfahren zu deren Herstellung - Google Patents

Ladungsverschiebeanordnung und Verfahren zu deren Herstellung

Info

Publication number
DE69027349D1
DE69027349D1 DE69027349T DE69027349T DE69027349D1 DE 69027349 D1 DE69027349 D1 DE 69027349D1 DE 69027349 T DE69027349 T DE 69027349T DE 69027349 T DE69027349 T DE 69027349T DE 69027349 D1 DE69027349 D1 DE 69027349D1
Authority
DE
Germany
Prior art keywords
manufacture
transfer device
charge transfer
charge
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69027349T
Other languages
English (en)
Other versions
DE69027349T2 (de
Inventor
Akio Izumi
Yasuhito Maki
Tadakuni Narabu
Maki Sato
Koji Otsu
Katsuyuki Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE69027349D1 publication Critical patent/DE69027349D1/de
Publication of DE69027349T2 publication Critical patent/DE69027349T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/762Charge transfer devices
    • H01L29/765Charge-coupled devices
    • H01L29/768Charge-coupled devices with field effect produced by an insulated gate
    • H01L29/76866Surface Channel CCD
    • H01L29/76875Two-Phase CCD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H01L27/1057Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components comprising charge coupled devices [CCD] or charge injection devices [CID]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE1990627349 1989-02-21 1990-02-20 Ladungsverschiebeanordnung und Verfahren zu deren Herstellung Expired - Fee Related DE69027349T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1040995A JP3057683B2 (ja) 1989-02-21 1989-02-21 非破壊読み出し型電荷転送装置とその製造方法

Publications (2)

Publication Number Publication Date
DE69027349D1 true DE69027349D1 (de) 1996-07-18
DE69027349T2 DE69027349T2 (de) 1996-11-28

Family

ID=12596010

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1990627349 Expired - Fee Related DE69027349T2 (de) 1989-02-21 1990-02-20 Ladungsverschiebeanordnung und Verfahren zu deren Herstellung

Country Status (3)

Country Link
EP (1) EP0384692B1 (de)
JP (1) JP3057683B2 (de)
DE (1) DE69027349T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241198A (en) * 1990-11-26 1993-08-31 Matsushita Electronics Corporation Charge-coupled device and solid-state imaging device
JP2642523B2 (ja) * 1991-03-19 1997-08-20 株式会社東芝 電荷結合素子を持つ半導体集積回路装置の製造方法
JP3214432B2 (ja) 1998-02-04 2001-10-02 日本電気株式会社 固体撮像装置の製造方法
JP6045391B2 (ja) * 2013-02-22 2016-12-14 京セラドキュメントソリューションズ株式会社 段ボール箱の開封構造及び段ボール箱

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2004694A (en) * 1977-08-19 1979-04-04 Gen Electric Co Ltd Methods of manufacturing semiconductor devices
JPS5815271A (ja) * 1981-07-21 1983-01-28 Nec Corp 電荷結合素子
US4614960A (en) * 1983-07-15 1986-09-30 Westinghouse Electric Corp. Focal plane array

Also Published As

Publication number Publication date
EP0384692B1 (de) 1996-06-12
JP3057683B2 (ja) 2000-07-04
JPH02220450A (ja) 1990-09-03
EP0384692A2 (de) 1990-08-29
DE69027349T2 (de) 1996-11-28
EP0384692A3 (en) 1990-10-17

Similar Documents

Publication Publication Date Title
DE69030822D1 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
DE68926645D1 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE69030283D1 (de) Halbleitervorrichtung und Verfahren zu deren Einbrennen
DE69309583T2 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
ATA95691A (de) Leistungstransistorvorrichtung und verfahren zu deren herstellung
DE69329635D1 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE4323799B4 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE3688604T2 (de) Optisches Gerät und Verfahren zu dessen Herstellung.
DE69315152T2 (de) Brennereinrichtung und Verfahren zu deren Herstellung
DE69313024T2 (de) Festkörperbildaufnahmeanordnung und Verfahren zu ihrer Herstellung
DE68928564D1 (de) Josephson-Einrichtungen und Verfahren zu deren Herstellung
DE69128334D1 (de) Integrierte Schaltung und Verfahren zu deren Herstellung
DE69033900D1 (de) Halbleiteranordnung und Verfahren zu seiner Herstellung
DE58909634D1 (de) Rohrwendeln und Verfahren zu deren Herstellung
DE69002900D1 (de) Behälter und Verfahren und Vorrichtung zu deren Herstellung.
DE3650186T2 (de) Halbleiteranordnung und Verfahren zu deren Herstellung.
DE69131633T2 (de) Festkörperbildaufnahmevorrichtung und Verfahren zu deren Herstellung
DE69027894D1 (de) Halbleiteranordnung und Verfahren zu deren Herstellung
DE69219100T2 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE69531127D1 (de) Halbleitervorrichtung und Verfahren zu deren Herstellung
DE68910644T2 (de) Schwingungsisolierungsvorrichtung und Verfahren zu deren Herstellung.
DE69027349D1 (de) Ladungsverschiebeanordnung und Verfahren zu deren Herstellung
DE69417790D1 (de) Ladungsverschiebeanordnung mit einem FDA-Ladungsdetektor und Verfahren zu ihrer Herstellung
DE59009107D1 (de) 1-E3-(2-Hydroxy-3-alkylaminopropoxy)-2-thienyl]-3-phenyl-1-propanone und Verfahren zu deren Herstellung.
DE69031717D1 (de) Halbleitervorrichtung und Verfahren zu seiner Herstellung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee