DE69024456T2 - Adhäsionsfreie elastische Walze - Google Patents

Adhäsionsfreie elastische Walze

Info

Publication number
DE69024456T2
DE69024456T2 DE69024456T DE69024456T DE69024456T2 DE 69024456 T2 DE69024456 T2 DE 69024456T2 DE 69024456 T DE69024456 T DE 69024456T DE 69024456 T DE69024456 T DE 69024456T DE 69024456 T2 DE69024456 T2 DE 69024456T2
Authority
DE
Germany
Prior art keywords
elastic roller
adhesive elastic
adhesive
roller
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69024456T
Other languages
English (en)
Other versions
DE69024456D1 (de
Inventor
Noboru Mizunuma
Haruo Naruse
Ikuyo Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1269574A external-priority patent/JP2670458B2/ja
Priority claimed from JP2240491A external-priority patent/JPH04119383A/ja
Priority claimed from JP2240490A external-priority patent/JP3005028B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69024456D1 publication Critical patent/DE69024456D1/de
Publication of DE69024456T2 publication Critical patent/DE69024456T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • G03G15/20Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • G03G15/20Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2003Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
    • G03G15/2014Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
    • G03G15/2053Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating
    • G03G15/2057Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating relating to the chemical composition of the heat element and layers thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • G03G15/20Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2003Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
    • G03G15/2014Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
    • G03G15/206Structural details or chemical composition of the pressure elements and layers thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fixing For Electrophotography (AREA)
DE69024456T 1989-10-16 1990-10-15 Adhäsionsfreie elastische Walze Expired - Fee Related DE69024456T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1269574A JP2670458B2 (ja) 1989-10-16 1989-10-16 加圧ローラ及びそれを有する定着装置
JP2240491A JPH04119383A (ja) 1990-09-10 1990-09-10 定着装置
JP2240490A JP3005028B2 (ja) 1990-09-10 1990-09-10 定着装置

Publications (2)

Publication Number Publication Date
DE69024456D1 DE69024456D1 (de) 1996-02-08
DE69024456T2 true DE69024456T2 (de) 1996-05-23

Family

ID=27332831

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69024456T Expired - Fee Related DE69024456T2 (de) 1989-10-16 1990-10-15 Adhäsionsfreie elastische Walze

Country Status (4)

Country Link
US (1) US5561511A (de)
EP (1) EP0424053B1 (de)
KR (1) KR0132422B1 (de)
DE (1) DE69024456T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69111326T2 (de) * 1990-08-03 1996-01-11 Canon Kk Elastische Rolle und diese verwendendes Fixiergerät.
JP2989930B2 (ja) * 1991-05-16 1999-12-13 株式会社金陽社 定着器用ロール
US5639549A (en) * 1992-05-08 1997-06-17 Kinyosha Co., Ltd. Fixing roll
JPH05333729A (ja) * 1992-05-29 1993-12-17 Sharp Corp 画像形成装置
US5722026A (en) * 1995-08-31 1998-02-24 Canon Kabushiki Kaisha Pressing rotator and heating-fixing apparatus using the same
US5724638A (en) * 1995-09-14 1998-03-03 Minolta Co., Ltd. Fixing device for image forming apparatus
US5819646A (en) * 1996-04-30 1998-10-13 Kinyosha Co., Ltd. Pressing roll for a fixing device
JPH10186920A (ja) * 1996-12-24 1998-07-14 Canon Inc 定着装置
JP2001215833A (ja) * 2000-02-02 2001-08-10 Konica Corp 画像形成装置の定着装置
JP4510310B2 (ja) * 2000-05-15 2010-07-21 キヤノン株式会社 定着部材、定着装置、及び画像形成装置
JP2006018139A (ja) * 2004-07-05 2006-01-19 Nitto Kogyo Co Ltd 画像形成装置用の回転体
US7353605B2 (en) * 2004-07-30 2008-04-08 Eastman Kodak Company Method for producing a metallic core for use in cylinder sleeves for an electrophotographic process
JP4951990B2 (ja) * 2006-02-13 2012-06-13 富士ゼロックス株式会社 弾性体ロール及び定着装置
WO2015033963A1 (ja) * 2013-09-03 2015-03-12 Nok株式会社 シリコーンゴム-フッ素樹脂積層体

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110638A (en) * 1976-03-15 1977-09-16 Fuji Xerox Co Ltd Heat fixing roll for electrophotographic copying machine
JPS5823626B2 (ja) * 1977-06-07 1983-05-16 コニカ株式会社 電子複写機用ロ−ラ−定着装置
US4196256A (en) * 1978-08-28 1980-04-01 Xerox Corporation Long life fuser roll
JPS55164858A (en) * 1979-06-12 1980-12-22 Fuji Xerox Co Ltd Heat fixing device
JPS5983181A (ja) * 1982-11-04 1984-05-14 Minolta Camera Co Ltd 熱ロ−ラ定着装置
JPS59111178A (ja) * 1982-12-15 1984-06-27 Sharp Corp 定着用ヒ−トロ−ラ
JPS60100164A (ja) * 1983-11-07 1985-06-04 Fuji Xerox Co Ltd 定着装置
JPS61184575A (ja) * 1985-02-12 1986-08-18 Konishiroku Photo Ind Co Ltd 定着装置
US4804576A (en) * 1985-02-28 1989-02-14 Canon Kabushiki Kaisha Elastic rotatable member
JPS61251881A (ja) * 1985-05-01 1986-11-08 Katsuragawa Denki Kk 定着装置
JPS62178290A (ja) * 1986-01-31 1987-08-05 Showa Electric Wire & Cable Co Ltd 熱定着ロ−ラ
US4724305A (en) * 1986-03-07 1988-02-09 Hitachi Metals, Ltd. Directly-heating roller for fuse-fixing toner images
JPH0827572B2 (ja) * 1986-05-30 1996-03-21 ミノルタ株式会社 熱ロ−ラ定着装置
DE3787590T2 (de) * 1986-07-21 1994-03-10 Daikin Ind Ltd Polytetrafluoräthylenhaltige Beschichtungsmasse und ihre Verwendung.
JPH0746252B2 (ja) * 1986-09-13 1995-05-17 キヤノン株式会社 弾性回転体及び定着装置
JPS63173085A (ja) * 1987-01-13 1988-07-16 Matsushita Electric Ind Co Ltd 定着装置
JPS63195409A (ja) * 1987-02-09 1988-08-12 Shin Etsu Chem Co Ltd 弾性体ロ−ル
JPS63218982A (ja) * 1987-03-06 1988-09-12 Nitto Kogyo Kk 非直筒定着ロ−ラ−の生産方法
EP0295901B1 (de) * 1987-06-16 1995-12-20 Canon Kabushiki Kaisha Bildfixiergerät
JPS6424284A (en) * 1987-07-21 1989-01-26 Ricoh Kk Pressurizing roller for fixing device
JP2674692B2 (ja) * 1987-07-30 1997-11-12 日立金属株式会社 加熱定着装置
JPH01127677A (ja) * 1987-10-05 1989-05-19 Dainippon Screen Mfg Co Ltd 熱化学気相成長法による選択的薄膜形成方法
JPH0823725B2 (ja) * 1987-12-14 1996-03-06 キヤノン株式会社 定着ローラー
US5270777A (en) * 1987-12-18 1993-12-14 Canon Kabushiki Kaisha Fixing apparatus having heat conducting member inside a fixing roller
US5253024A (en) * 1988-12-07 1993-10-12 Canon Kabushiki Kaisha Fixing apparatus with rectifier element
JP2614317B2 (ja) * 1989-06-20 1997-05-28 キヤノン株式会社 画像形成装置
US5073434A (en) * 1989-12-29 1991-12-17 Xerox Corporation Ionographic imaging system
US5035950A (en) * 1990-02-09 1991-07-30 Ames Rubber Corporation Fluoroelastomer coated fuser roll
DE69112098T2 (de) * 1990-02-20 1996-02-08 Canon Kk Bild-Heizgerät mit von einem rotierenden Element angetriebenen Film.
US5178071A (en) * 1992-01-23 1993-01-12 American Roller Company Impression roller and method of preparation

Also Published As

Publication number Publication date
KR0132422B1 (ko) 1998-04-16
EP0424053A2 (de) 1991-04-24
EP0424053A3 (en) 1992-05-27
EP0424053B1 (de) 1995-12-27
KR910008509A (ko) 1991-05-31
DE69024456D1 (de) 1996-02-08
US5561511A (en) 1996-10-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee